Top 10 Companies in the Global Dicing Die‑Attach Tape Market (2026): Market Leaders Driving Innovation

MARKET INSIGHTS

Global Dicing Die‑Attach Tape Market size was valued at USD 0.35 billion in 2024. The market is projected to grow from USD 0.38 billion in 2025 to USD 0.65 billion by 2032, exhibiting a CAGR of 7.9 % during the forecast period.

Dicing Die‑Attach Tape combines the functionalities of dicing tape and die‑attach film in a single product. It effectively addresses issues such as bleeding associated with liquid adhesives, ensuring precise wafer dicing and reliable die attachment in semiconductor manufacturing. Specialized variants are available for processes such as Dicing Before Grinding (DBG), enhancing efficiency in thin wafer handling and improving yield rates.

The market is witnessing steady growth driven by the expanding semiconductor industry, surging demand for advanced electronics, and the proliferation of miniaturized devices such as smartphones and wearables. Furthermore, innovations in packaging technologies, including 5G and IoT applications, are accelerating adoption. Key players are investing in R&D to develop high‑performance tapes; for instance, in March 2023, Nitto Denko Corporation introduced a new thermally releasable dicing die‑attach tape optimized for high‑speed dicing processes. Leading companies such as LINTEC Corporation, Nitto Denko, Furukawa Electric Co., Ltd., Henkel Adhesives, and Hitachi Chemical Company, Ltd., dominate the landscape with diverse product portfolios tailored to various assembly needs.

Global Dicing Die‑Attach Tape Market – View in Detailed Research Report

Top 10 Companies in the Global Dicing Die‑Attach Tape Market (2026)

1. LINTEC Advanced Technologies (Japan)

Headquarters: Tokyo, Japan
Key Offering: Advanced non‑conductive and conductive die‑attach tapes, including UV‑curable and thermally releasable variants.

LINTEC’s portfolio delivers the adhesion reliability required by automotive and aerospace electronics. The company offers a spectrum of thicknesses and adhesion strengths that accommodate both thick‑wafer and ultra‑thin‑wafer processes, ensuring process flexibility for a broad range of packaging technologies.

LINTEC invests heavily in bio‑based adhesive research and collaborates with OSATs to accelerate the deployment of next‑generation packaging solutions.

• UV‑curable high‑temperature tape
• Thermally releasable solution for DBG
• Low‑contamination formulation

2. Nitto Denko Corporation (Japan)

Headquarters: Osaka, Japan
Key Offering: UV‑curable and thermally releasable dicing die‑attach tapes with a focus on high‑precision applications.

After launching a thermally releasable tape in 2023, Nitto Denko has positioned itself as a leader in high‑speed dicing environments. The company’s product line spans from standard to ultra‑thin formulations, supporting a wide array of semiconductor nodes.

Nitto Denko’s sustainability strategy includes reducing VOC emissions through advanced curing processes and expanding its portfolio of recyclable tape materials.

• High‑temperature UV‑curable tape
• Thermally releasable DBG‑compatible tape
• Recyclable polyolefin base

3. Furukawa Electric Co., Ltd. (Japan)

Headquarters: Tokyo, Japan
Key Offering: DBG‑compatible die‑attach tapes that mitigate adhesive bleeding.

Furukawa’s focus on DBG solutions has earned the company a strong foothold in the automotive battery management market, where robust die attachment is critical. Its product range includes conductive and non‑conductive tapes designed for high‑yield, thin‑wafer processes.

Furukawa emphasizes process integration, offering tailored tape formulations that reduce handling time and improve yield.

• DBG‑optimized non‑conductive tape
• Conductive DBG‑compatible tape
• Process‑specific adhesion control

4. Henkel Adhesives (Germany)

Headquarters: Düsseldorf, Germany
Key Offering: High‑reliability die‑attach films for automotive electronics.

Henkel’s die‑attach films deliver consistent performance across a range of temperatures and mechanical stresses, making them a preferred choice for automotive and industrial applications.

The company is advancing eco‑friendly adhesive chemistries and is partnering with OEMs to integrate low‑VOC solutions into production lines.

• High‑reliability automotive die‑attach film
• Low‑VOC adhesive formulation
• Customizable adhesion profiles

5. LG Chem (South Korea)

Headquarters: Seoul, South Korea
Key Offering: Thermally releasable tapes for power semiconductor packaging.

LG Chem’s thermally releasable tapes support the growing power semiconductor segment, particularly in electric vehicle battery management systems. The company’s focus on high‑temperature stability aligns with the demands of power electronics.

LG Chem is expanding its research into bio‑based polymers to meet sustainability targets in the semiconductor supply chain.

• High‑temperature thermally releasable tape
• Power semiconductor‑specific formulation
• Bio‑based adhesive option

6. AI Technology, Inc. (USA)

Headquarters: San Jose, California, USA
Key Offering: Customizable die‑attach solutions for advanced packaging.

AI Technology specializes in tailoring tape properties to match the unique requirements of fan‑out wafer‑level packaging (FOWLP) and 3D IC stacking. Its modular approach allows customers to adjust adhesion strength and release characteristics on demand.

The company partners with semiconductor fabs to integrate its solutions into automated assembly lines, reducing cycle time.

• Modular adhesion strength range
• Release‑type customization
• Automation‑ready packaging integration

7. Resonac Corporation (Japan) – formerly Hitachi Chemical

Headquarters: Tokyo, Japan
Key Offering: Eco‑friendly die‑attach tapes for automotive and industrial electronics.

Resonac leverages its heritage in adhesive chemistry to offer tapes that meet stringent environmental regulations while maintaining high performance. The company’s product line includes both conductive and non‑conductive options.

Resonac is actively collaborating with OEMs to develop low‑VOC, recyclable tape formulations.

• Eco‑friendly conductive tape
• Non‑conductive low‑VOC tape
• Recyclable film base

8. Shin‑Etsu Chemical (Japan)

Headquarters: Tokyo, Japan
Key Offering: Ultra‑thin die‑attach films for high‑density packaging.

Shin‑Etsu’s ultra‑thin films support the latest high‑density packaging trends, delivering reliable die attachment while minimizing material usage. The company’s focus on process compatibility ensures smooth integration with existing fabs.

Shin‑Etsu is investing in research to improve adhesion durability under thermal cycling.

• Ultra‑thin die‑attach film
• High‑temperature stability
• Process‑compatible adhesion profile

9. Samsung Electronics (South Korea)

Headquarters: Suwon, South Korea
Key Offering: Integrated packaging solutions including die‑attach tapes.

Samsung’s packaging arm supplies die‑attach tapes that complement its advanced 3D packaging lines. The company’s integrated approach reduces assembly steps and improves yield.

Samsung is expanding its tape portfolio to support emerging power‑semiconductor applications.

• Integrated 3D packaging tape
• Power‑semiconductor‑compatible formulation
• Process‑integration support

10. Tokyo Ohka Kogyo Co., Ltd. (Japan)

Headquarters: Osaka, Japan
Key Offering: High‑performance die‑attach tapes for automotive and industrial electronics.

Tokyo Ohka Kogyo delivers tapes that meet the rigorous reliability standards of automotive electronics, offering both conductive and non‑conductive options. The company’s focus on thermal stability supports high‑temperature packaging environments.

Tokyo Ohka Kogyo collaborates with OEMs to develop low‑VOC formulations and to support the adoption of bio‑based adhesives.

• High‑temperature conductive tape
• Non‑conductive low‑VOC tape
• Thermal stability certification

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Global Dicing Die‑Attach Tape Market – View in Detailed Research Report

Outlook

The trajectory of the global Dicing Die‑Attach Tape market remains upward, driven by the need for reliable die attachment in increasingly dense and high‑temperature semiconductor packages. The market is expected to reach USD 0.70 billion by 2034, reflecting a steady expansion as new packaging technologies mature and automotive electronics continue to grow.

Future Trends

• Growth of thermally releasable tapes for power‑semiconductor and automotive applications.
• Increased demand for DBG‑compatible solutions that reduce adhesive bleeding and improve yield.
• Expansion into MEMS and sensor packaging, requiring low‑contamination, high‑adhesion tapes.
• Accelerated adoption of bio‑based adhesive chemistries to meet sustainability goals.
• Enhanced integration of tape solutions with automated assembly lines, reducing cycle time and improving consistency.