Top 10 Companies in the Thick‑Film Paste for Electric Vehicle Market (2026): Market Leaders Powering Global EV Electrification

Thick‑Film Paste for Electric Vehicle Market Insights

Thick‑film paste for electric vehicles refers to a class of functional thick‑film materials used in EVs for electronics, power‑control, sensing and thermal‑management systems. These pastes are formulated from metal powders, glass frits, inorganic oxides and organic binders, then screen‑printed onto ceramic or metal substrates and cured to create conductive, resistive, dielectric or protective layers. Typical applications include battery‑management systems (BMS), on‑board chargers (OBC), DC‑DC converters, inverters, sensors, LED thermal substrates and high‑voltage ceramic heaters (HVCH) for battery temperature control.

1. Sumitomo Metal Mining

Headquarters: Tokyo, Japan

Key Offering: High‑purity silver‑based conductive paste for battery‑management systems.

Sumitomo’s vertically integrated supply chain secures precious‑metal powders, enabling consistent rheology and high conductivity essential for high‑voltage modules.

Sustainability & Growth Initiatives: Investment in low‑temperature curing processes reduces energy consumption during manufacturing.

• Expansion of domestic powder refining capacity.
• Collaboration with OEMs on next‑generation BMS architectures.
• Research into recyclable binder systems to lower environmental impact.

2. TANAKA Precious Metals

Headquarters: Osaka, Japan

Key Offering: Silver‑glass hybrid paste with enhanced dielectric performance for inverters.

TANAKA’s formulation balances high conductivity with low dielectric loss, supporting compact inverter modules.

Sustainability & Growth Initiatives: Development of low‑VOC binders aligns with tightening emission standards.

• Partnerships with semiconductor fabs for integrated substrate solutions.
• Scaling production lines to meet rising EV OEM demand.
• Investing in process automation to reduce waste.

3. Heraeus Electronics

Headquarters: Hanau, Germany

Key Offering: Dielectric and resistor paste for high‑voltage ceramic heaters.

Heraeus leverages proprietary glass frit chemistry to deliver low‑loss dielectric layers critical for thermal‑management subsystems.

Sustainability & Growth Initiatives: Focus on reducing lead content and adopting green solvents.

• Collaboration with EU EV manufacturers on safety‑compliant formulations.
• Development of high‑temperature resistant pastes for next‑generation batteries.
• Continuous improvement of firing processes to cut energy use.

4. Celanese

Headquarters: Chicago, USA

Key Offering: Chemically engineered carrier resin for conductive and resistive pastes.

Celanese’s resins provide high processability and low viscosity, enabling rapid screen‑printing for high‑volume production.

Sustainability & Growth Initiatives: Investment in bio‑based binder alternatives to reduce fossil‑fuel dependence.

• Partnership with Tier‑1 EV OEMs to integrate high‑throughput printing lines.
• Development of low‑temperature curing formulations to shorten cycle times.
• Active R&D into recyclable resin systems.

5. Vibrantz Technologies

Headquarters: Cleveland, USA

Key Offering: High‑performance conductive paste for DC‑DC converters.

Vibrantz’s formulation delivers superior current handling while maintaining low thermal resistance.

Sustainability & Growth Initiatives: Focus on reducing heavy‑metal content and improving recyclability.

• Scaling production to support growing 48‑V mild‑hybrid platforms.
• Collaboration with battery manufacturers on integrated thermal‑management solutions.
• Investing in automated coating equipment to lower labor costs.

6. Xi’an Hongxing Electronic Paste

Headquarters: Xi’an, China

Key Offering: Cost‑effective conductive paste for LED thermal substrates.

Hongxing’s local powder production reduces lead times and supports high‑volume OEM orders.

Sustainability & Growth Initiatives: Adoption of low‑VOC binders and energy‑efficient curing.

• Expansion of domestic metal‑powder capacity.
• Partnerships with regional EV assembly plants.
• R&D into high‑temperature resistant formulations.

7. Hunan LEED Electronic Ink

Headquarters: Changsha, China

Key Offering: Resistor paste for sensor integration modules.

LEED’s formulations provide precise resistance values and high reliability for sensor circuits.

Sustainability & Growth Initiatives: Development of environmentally friendly binders and reduced energy consumption.

• Collaboration with sensor manufacturers on custom resistive profiles.
• Scaling production to meet growing sensor demand.
• Investing in automation to improve consistency.

8. Kunming Guyou Technology

Headquarters: Kunming, China

Key Offering: Dielectric paste for high‑voltage ceramic heaters.

Guyou’s high‑purity glass frits deliver low dielectric loss essential for battery temperature control.

Sustainability & Growth Initiatives: Focus on reducing heavy‑metal usage and enhancing recyclability.

• Partnership with OEMs for integrated heater solutions.
• Investment in advanced firing technology to lower energy use.
• R&D into multi‑functional pastes combining dielectric and heating.

9. Xinbei Electronic Paste

Headquarters: Nanjing, China

Key Offering: Conductive paste for high‑frequency power modules.

Xinbei’s formulations support rapid signal routing with minimal loss, crucial for ADAS modules.

Sustainability & Growth Initiatives: Development of low‑temperature curing processes to reduce manufacturing footprint.

• Collaboration with ADAS suppliers on custom paste formulations.
• Scaling production to match rising demand for safety‑critical components.
• Investing in process optimization to lower cycle times.

10. Axalta Coating Systems

Headquarters: Irving, USA

Key Offering: Advanced protective paste for high‑temperature environments.

Axalta’s protective layers shield critical components from thermal degradation in extreme operating conditions.

Sustainability & Growth Initiatives: Emphasis on reducing volatile organic compound content and enhancing recyclability.

• Partnerships with OEMs for protective coatings on power modules.
• Research into bio‑based binder systems.
• Investment in low‑energy curing technologies.

Market Outlook

The next decade will see a shift toward higher‑voltage architectures and tighter thermal budgets, driving demand for advanced conductive and dielectric pastes. OEMs will prioritize suppliers that can deliver low‑temperature curing, high‑current density, and low‑loss performance, while also meeting evolving environmental regulations.

Future Trends

• Integration of advanced powder metallurgy to enhance conductivity and reduce weight.
• Co‑development of low‑loss pastes for ADAS and mixed‑signal modules.
• Adoption of 48‑V mild‑hybrid platforms creating new opportunities for thin‑profile power conversion pastes.
• Digitalization of the supply chain to improve traceability and reduce lead times.
• Increased focus on recyclable binder systems to meet tightening environmental standards.