The Global Inkjet Printing Solder Market was valued at USD 118 Million in 2023 and is projected to reach USD 182.17 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.40% during the forecast period (2024-2030). This growth stems from increasing demand for high-precision PCB manufacturing, rapid electronics prototyping, and the transition toward lead-free soldering solutions across consumer electronics, automotive, and telecommunications sectors.

As the electronics manufacturing landscape evolves with Industry 4.0 adoption, these market leaders are driving innovation in micro-scale soldering technology. This analysis profiles the Top 10 Companies in the Inkjet Printing Solder Industry—pioneers enabling complex PCB designs and next-generation electronics production.

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🔟 1. Agfa-Gevaert Group

Headquarters: Mortsel, Belgium
Key Offering: M-Press and Jeti industrial printing systems

Agfa leverages its heritage in precision printing to deliver advanced solder deposition solutions. Their systems are particularly valuable for High-Density Interconnect (HDI) PCBs and miniature electronic components requiring micron-level accuracy.

Technological Advantages:

• Patented piezoelectric inkjet technology with sub-10 micron precision
• Integrated quality control systems ensuring uniform solder deposition
• Dual-material capability for solder and conductive adhesives

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9️⃣ 2. Taiyo America, Inc.

Headquarters: Carson City, Nevada, USA
Key Offering: MJS series solder jet printing systems

Taiyo combines material science expertise with advanced deposition technology, offering complete solder solutions for PCB manufacturers. Their no-contact deposition method eliminates stencil contamination issues common in traditional processes.

Technological Advantages:

• Proprietary low-voiding solder paste formulations
• Automated optical inspection integration
• Industry-leading 20-micron deposition accuracy

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8️⃣ 3. SUSS MicroTec SE

Headquarters: Garching, Germany
Key Offering: Delta Picoliter solder deposition technology

SUSS brings semiconductor-level precision to PCB manufacturing through its advanced jetting solutions. The company specializes in ultra-fine pitch applications for advanced packaging and microelectronics.

Technological Advantages:

• Single-digit micron deposition capability
• Multi-material deposition platform (solder, epoxy, inks)
• Industry’s fastest droplet formation at 20 kHz

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7️⃣ 4. Electra Polymers Ltd

Headquarters: Reading, United Kingdom
Key Offering: Specialty solder pastes for inkjet deposition

As a materials specialist, Electra Polymers develops solder formulations specifically engineered for jetting applications. Their pastes maintain optimal rheology from deposition through reflow cycles.

Technological Advantages:

• Halogen-free formulations meeting environmental regulations
• Extended nozzle life through reduced clogging
• High-reliability alloys for automotive applications

Download FREE Sample Report: Inkjet Printing Solder Market – View in Detailed Research Report

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6️⃣ 5. Nordson Corporation

Headquarters: Westlake, Ohio, USA
Key Offering: DIMATIX industrial printheads

Nordson’s precision fluid dispensing solutions power many OEM inkjet solder systems. Their printheads handle a wide range of solder paste viscosities while maintaining deposition accuracy.

Technological Advantages:

• Broad viscosity handling from 5-500 cP
• High-resolution 10 picoliter droplet control
• Quick-change nozzle configurations

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5️⃣ 6. Mycronic AB

Headquarters: Täby, Sweden
Key Offering: JetMove smart deposition systems

Mycronic’s high-speed deposition technology is transforming PCB assembly for automotive and IoT applications. Their systems integrate seamlessly with smart factory environments.

Technological Advantages:

• Real-time process monitoring and adjustment
• Dynamic droplet sizing from 30-100 microns
• Industry 4.0 compliant connectivity

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4️⃣ 7. DruckWege GmbH

Headquarters: Munich, Germany
Key Offering: NanoJet micro-deposition solutions

DruckWege specializes in ultra-precise deposition for research and high-mix production environments. Their systems excel at creating 3D solder structures for advanced packaging.

Technological Advantages:

• 5-axis deposition capability
• 10 picoliter minimum droplet volume
• Sub-5 micron positional accuracy

Read Full Report: Inkjet Printing Solder Market – View in Detailed Research Report

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3️⃣ 8. Fujifilm Dimatix

Headquarters: Santa Clara, California, USA
Key Offering: Materials deposition printheads

Fujifilm adapts its inkjet expertise for specialized solder deposition applications, particularly in research institutions and development labs working on next-generation electronics.

Technological Advantages:

• Broad printhead configuration options
• Compatibility with experimental alloys
• Proven reliability in harsh environments

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2️⃣ 9. PVA

Headquarters: Orangeburg, New York, USA
Key Offering: Delta series automated jetting systems

PVA’s industrial deposition solutions bring reliability to demanding manufacturing environments. Their systems feature robust construction for 24/7 production settings.

Technological Advantages:

• Automated clog detection and recovery
• IP65-rated industrial enclosures
• FDA-compliant cleanroom options

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1️⃣ 10. MicroFab Technologies

Headquarters: Plano, Texas, USA
Key Offering: JetLab R&D deposition platforms

MicroFab specializes in research-grade deposition systems for universities and corporate R&D centers. Their solutions enable breakthroughs in advanced electronics manufacturing.

Technological Advantages:

• Single-nozzle precision for experimental materials
• Customizable deposition patterns
• Material research consultancy services

Download FREE Sample Report: Inkjet Printing Solder Market – View in Detailed Research Report

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🌍 Outlook: Inkjet Solder Technology Driving Electronics Innovation

The inkjet printing solder market is at an inflection point as manufacturers balance precision requirements with production scalability. While traditional methods still dominate high-volume production, inkjet solutions are gaining share in prototyping and specialized applications.

📈 Key Market Trends:

• 22% annual growth in ultra-fine pitch PCB applications
• Accelerating adoption in automotive electronics manufacturing
• Increasing regulatory pressure for lead-free solder adoption
• Advances in multi-material deposition capabilities

These industry leaders are not just equipment suppliers but enablers of next-generation electronics manufacturing. As components continue shrinking and performance demands increase, their innovations will shape the future of PCB production.

Read Full Report: Inkjet Printing Solder Market – View in Detailed Research Report