The Global Electrodeposited Copper Foil for PCB Market was valued at USD 3,636.9 Million in 2023 and is projected to reach USD 4,582.03 Million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 2.6% during the forecast period (2024-2032). This growth is being driven by escalating demand for printed circuit boards across consumer electronics, automotive electronics, and advanced 5G/6G infrastructure.

As the backbone of modern electronics manufacturing, electrodeposited copper foil is undergoing rapid technological advancements to meet the needs of miniaturization and high-frequency applications. In this analysis, we profile the Top 10 Companies in the Electrodeposited Copper Foil for PCB Industry—sector leaders who are redefining electronic connectivity through material science innovations.

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🔟 1. Mitsui Mining & Smelting Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-thin electrodeposited copper foils (3-70μm)

Mitsui dominates the global PCB copper foil market with approximately 25% share. Their UTF (Ultra-Thin Foil) series enables high-density interconnect PCBs for smartphones, wearables, and advanced packaging applications.

Technical Advancements:

• Pioneered carrier-based ultra-thin foils down to 3μm thickness
• Developed specialized surface treatments for 5G mmWave applications
• Maintains strategic partnerships with major Asian PCB manufacturers

Download FREE Sample Report: Electrodeposited Copper Foil for PCB Market – View in Detailed Research Report

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9️⃣ 2. Fukuda Metal Foil & Powder Co., Ltd.

Headquarters: Kyoto, Japan
Key Offering: High-frequency and reverse-treated copper foils

Fukuda specializes in surface-engineered copper foils that optimize PCB substrate bonding. The company is particularly strong in materials for automotive radar systems and telecommunications infrastructure.

Technical Advancements:

• Developed proprietary nano-roughened surface technology
• Optimized foils for 77GHz automotive radar applications
• Maintains full vertical integration from refining to foil production

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8️⃣ 3. Chang Chun Petrochemical Co., Ltd.

Headquarters: Taipei, Taiwan
Key Offering: Standard and high-performance copper foils

As Taiwan’s largest copper foil manufacturer, Chang Chun supplies over 15% of global demand. The company operates extensive production facilities across Taiwan and China.

Technical Advancements:

• Key supplier to Apple’s PCB supply chain
• Proprietary anti-oxidation treatment extends product shelf life
• Expanding production capacity in Southeast Asia

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7️⃣ 4. Nan Ya Plastics Corporation

Headquarters: Taipei, Taiwan
Key Offering: Standard foil, low-profile foil, reverse treated foil (RTF)

Part of the Formosa Plastics Group, Nan Ya combines material science expertise with vertical integration to serve global PCB manufacturers.

Technical Advancements:

• Developed ultra-smooth foils with sub-micron surface roughness
• Strategic partnerships with copper mining operations
• Implemented AI-driven quality control systems

Download FREE Sample Report: Electrodeposited Copper Foil for PCB Market – View in Detailed Research Report

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6️⃣ 5. JX Nippon Mining & Metals Corporation

Headquarters: Tokyo, Japan
Key Offering: Hyper Very Low Profile (HVLP) copper foils

JX Nippon leverages mining expertise to produce specialty copper foils for high-reliability applications in aerospace, medical, and automotive sectors.

Technical Advancements:

• Pioneered HVLP foil with 0.3μm profile for ADAS systems
• Developed patented thermal-resistant foil formulations
• Maintains >90% manufacturing byproduct recycling rate

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5️⃣ 6. Jiangxi Copper Corporation

Headquarters: Guixi, China
Key Offering: Cost-competitive standard and mid-range foils

China’s largest copper producer has rapidly expanded into foil manufacturing, leveraging domestic raw material advantages.

Technical Advancements:

• Operates world’s largest single-site foil plant (45,000 t/yr)
• Government-supported expansion targeting 20% global share by 2025
• Developing high-performance foil capabilities

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4️⃣ 7. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-thin carrier-based copper foils

Furukawa’s innovative peelable carrier technology enables production of 2μm foils for advanced electronics packaging.

Technical Advancements:

• Patented carrier system reduces ultra-thin foil breakage
• Developed specialty foils for lithium-ion battery applications
• Active R&D in foil-polymer composite materials

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3️⃣ 8. LS Mtron Ltd.

Headquarters: Seoul, South Korea
Key Offering: Advanced copper foil production systems

LS Mtron combines foil manufacturing expertise with equipment innovation to serve Korea’s electronics industry.

Technical Advancements:

• Pioneered pulse-reverse electroplating technology
• Automated systems maintain <1% thickness variation
• Key supplier to Samsung’s PCB vendor network

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2️⃣ 9. Circuit Foil Luxembourg

Headquarters: Luxembourg
Key Offering: High-reliability foils for harsh environments

This European specialist focuses on premium copper foils for automotive and industrial applications requiring superior performance.

Technical Advancements:

• Industry-leading high-temperature performance
• Direct partnerships with European PCB manufacturers
• TÜV-certified automotive production processes

Download FREE Sample Report: Electrodeposited Copper Foil for PCB Market – View in Detailed Research Report

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1️⃣ 10. Kingboard Holdings Limited

Headquarters: Hong Kong
Key Offering: Comprehensive copper foil portfolio

Kingboard has grown rapidly through strategic acquisitions to become a major force in China’s PCB materials market.

Technical Advancements:

• Fully integrated from copper refining to foil production
• Proprietary plating additives for enhanced uniformity
• Expanding into lithium battery foil production for EVs

Get Full Report Here: Electrodeposited Copper Foil for PCB Market – View in Detailed Research Report

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⚡ Outlook: Thinner, Smarter Copper Foils Driving Next-Gen Electronics

The electrodeposited copper foil industry is transforming to meet demands from 5G, AI, and advanced packaging technologies.

🔑 Key Market Trends:

• Shift to ultra-thin (<3μm) and carrier-based foils for HDI PCBs
• Advanced surface treatments enabling finer circuit geometries
• Growing adoption of high-frequency/low-loss foils
• Integration of AI and automation in manufacturing

Get Full Report Here: Electrodeposited Copper Foil for PCB Market – View in Detailed Research Report

These industry leaders aren’t just supplying materials—they’re enabling the next wave of electronic innovation through advanced copper foil technologies.