Top 10 Companies in the Films for Semiconductor Manufacturing Industry (2025): Innovators Driving Chip Production Advancements

In Business Insights
June 05, 2025


The Global Films for Semiconductor Manufacturing Market was valued at USD 24.52 Billion in 2023 and is projected to reach USD 39.63 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 7.1% during the forecast period (2024–2030). This growth is driven by escalating demand for advanced semiconductors, the miniaturization of electronic components, and widespread adoption of flexible electronics across IoT devices, 5G networks, and AI applications.

As semiconductor technology progresses toward smaller nodes and more complex architectures, specialized films have become critical enablers in wafer processing, packaging, and testing. This report analyzes the Top 10 Companies in the Films for Semiconductor Manufacturing Industry—materials science leaders that are shaping the future of semiconductor production through innovative film solutions.


🔟 10. 3M

Headquarters: St. Paul, Minnesota, USA
Key Offering: Die attach films, thermal interface materials

3M brings its materials science expertise to semiconductor manufacturing with high-performance adhesive films that ensure reliability in harsh operating conditions. Their films are widely used in automotive and industrial semiconductor applications.

Technology Leadership:

  • Advanced die attach solutions for power semiconductors
  • High-thermal-conductivity interface materials
  • Reliability testing under extreme conditions

Download FREE Sample Report: Films for Semiconductor Manufacturing Market – View in Detailed Research Report


9️⃣ 9. Mitsubishi Chemical

Headquarters: Tokyo, Japan
Key Offering: Dicing tapes, adhesive films

Mitsubishi Chemical provides comprehensive solutions for wafer processing, specializing in high-performance dicing tapes that maintain wafer integrity during the thinning and separation processes.

Technology Leadership:

  • Ultra-thin wafer handling solutions
  • Low-residue adhesive formulations
  • Packaging films for power devices

8️⃣ 8. Gunze

Headquarters: Kyoto, Japan
Key Offering: Protective films, dicing tapes

Gunze specializes in precision films for semiconductor manufacturing, with particularly strong capabilities in ultra-clean processing films that minimize contamination risks.

Technology Leadership:

  • High-purity polymer films
  • Contamination-control solutions
  • Specialty films for compound semiconductors

7️⃣ 7. Tesa SE

Headquarters: Hamburg, Germany
Key Offering: Semiconductor tapes, adhesive solutions

Tesa SE offers a broad portfolio of adhesive solutions for semiconductor assembly, with particular strengths in temporary bonding applications and precision dicing requirements.

Technology Leadership:

  • UV-curable temporary bonding adhesives
  • Wafer-level packaging solutions
  • Thin die handling technologies

Download FREE Sample Report: Films for Semiconductor Manufacturing Market – View in Detailed Research Report


6️⃣ 6. Taica

Headquarters: Tokyo, Japan
Key Offering: Bump protection films, mold release films

Taica specializes in advanced packaging films that protect delicate semiconductor components during assembly processes, particularly for flip-chip and wafer-level packaging applications.

Technology Leadership:

  • Low-stress protective films
  • High-temperature resistant materials
  • Fine-pitch packaging solutions

5️⃣ 5. Saint-Gobain

Headquarters: Courbevoie, France
Key Offering: Specialty films, thermal management materials

Saint-Gobain applies its materials expertise to semiconductor manufacturing through innovative films that address thermal and mechanical challenges in advanced packaging.

Technology Leadership:

  • Thermal interface films
  • Mechanical stress management solutions
  • High-reliability packaging materials

4️⃣ 4. DELO Industrial

Headquarters: Windach, Germany
Key Offering: Die attach films, conductive adhesives

DELO Industrial provides high-performance adhesive films that enable finer pitch interconnects and improved reliability in semiconductor packaging applications.

Technology Leadership:

  • Nanoparticle-filled conductive films
  • Low-outgassing adhesive formulations
  • Solutions for chip-first packaging

3️⃣ 3. Taicang Zhanxin Adhesive Material

Headquarters: Taicang, China
Key Offering: Wafer tapes, die attach films

Taicang Zhanxin has emerged as a significant Chinese supplier of semiconductor process films, particularly for domestic semiconductor manufacturers.

Technology Leadership:

  • Cost-effective alternative films
  • Localized supply chain solutions
  • High-volume manufacturing capabilities

Download FREE Sample Report: Films for Semiconductor Manufacturing Market – View in Detailed Research Report


2️⃣ 2. Suzhou Anjie Technology

Headquarters: Suzhou, China
Key Offering: Functional films, optical display materials

Suzhou Anjie Technology has successfully expanded from display films into semiconductor applications, leveraging its expertise in thin-film materials for emerging packaging needs.

Technology Leadership:

  • Integrated film solutions for display-driver ICs
  • Low-outgassing adhesive films
  • Flexible hybrid electronics materials

1️⃣ 1. Nitto Denko

Headquarters: Osaka, Japan
Key Offering: Semiconductor process films, dicing tapes, adhesive films

Nitto Denko maintains its market leadership through comprehensive film solutions that span the entire semiconductor manufacturing process, from wafer fabrication to final packaging.

Technology Leadership:

  • Next-generation die attach films
  • Automotive-grade reliability materials
  • Advanced temporary bonding solutions

Get Full Report Here: Films for Semiconductor Manufacturing Market – View in Detailed Research Report


🔮 Future Outlook: Semiconductor Films Driving Next-Generation Chip Technologies

The semiconductor films market faces both challenges and opportunities as chip technologies continue their relentless advancement toward smaller nodes and more complex architectures.

📈 Key Market-Shaping Trends:

  • Growing need for ultra-thin films compatible with sub-3nm process nodes
  • Increasing adoption of hybrid bonding technologies requiring specialized film solutions
  • Expanding material requirements for advanced packaging approaches like 2.5D/3D IC integration
  • Rising importance of thermal management films in high-power applications
  • Development of sustainable film materials to reduce environmental impact

Get Full Report Here: Films for Semiconductor Manufacturing Market – View in Detailed Research Report

The companies profiled above are at the forefront of developing materials solutions that will enable continued progress in semiconductor technology, ultimately powering the next generation of electronic devices across industries.