The Global Semiconductor Non-UV Tape Market was valued at USD 359 Million in 2023 and is projected to reach USD 572.71 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.90% during the forecast period (2024-2030). This growth is driven by increasing semiconductor production, rising demand for consumer electronics, and advancements in wafer-level packaging technologies.
As the semiconductor industry expands to meet global chip demands, specialized materials like non-UV tapes are becoming critical for wafer processing. In this blog, we profile the Top 10 Companies in the Semiconductor Non-UV Tape Industry—leaders in adhesive technology who are enabling next-generation chip manufacturing.
🔟 1. Nitto Denko Corporation
Headquarters: Osaka, Japan
Key Offering: Revalpha™ Thermal Release Tape, Setfa™ Wafer Backgrinding Tape
Nitto Denko dominates the semiconductor tape market with its comprehensive portfolio of non-UV adhesive solutions. The company holds over 30% of the global market share for wafer processing tapes.
Innovation Focus:
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Ultra-thin thermal release tapes for 3D IC packaging
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Low-outgassing adhesives for advanced nodes
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Expanding production capacity in Southeast Asia
Download FREE Sample Report:
Semiconductor Non-UV Tape Market – View in Detailed Research Report
9️⃣ 2. 3M Company
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