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The Global Semiconductor and IC Packaging Materials Market was valued at USD 26.48 Billion in 2023 and is projected to reach USD 36.28 Billion by 2030 growing at a Compound Annual Growth Rate (CAGR) of 4.6% during the forecast period (2023-2030). This growth is driven by increasing demand for advanced electronics, the proliferation of 5G/IoT technologies, and the automotive industry’s digital transformation.

As semiconductor devices become smaller and more powerful, the materials protecting these components become increasingly critical. In this blog, we profile the Top 10 Companies in Semiconductor and IC Packaging Materials – innovators developing substrates, bonding solutions, and protective materials enabling next-generation electronics.

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🔟 1. Hitachi Chemical Company

Headquarters: Tokyo, Japan
Key Offerings: Semiconductor packaging materials, build-up films, epoxy molding compounds

As a subsidiary of Showa Denko Materials, Hitachi Chemical leads in advanced packaging solutions for high-performance computing and automotive applications. Their wafer-level packaging materials enable miniaturization without sacrificing thermal performance.

Innovation Focus:

• Developed ultra-low CTE molding compounds for high-reliability packages
• Pioneered halogen-free flame retardant materials for environmental compliance
• Expanding advanced substrate materials for 2.5D/3D packaging

Download FREE Sample Report: Semiconductor and IC Packaging Materials Market – View Detailed Research Report

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9️⃣ 2. LG Chem Ltd.

Headquarters: Seoul, South Korea
Key Offerings: Epoxy molding compounds, underfill materials, conductive pastes

LG Chem has emerged as a critical supplier to major semiconductor manufacturers, particularly in mobile and display applications. Their thermally conductive packaging materials help address heat dissipation challenges in compact devices.

Innovation Focus:

• Developing ultra-thin encapsulation materials for foldable displays
• High-thermal conductivity epoxy compounds for power semiconductors
• Advanced EMI shielding solutions for 5G RF packaging

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8️⃣ 3. Mitsui High-Tec Inc.

Headquarters: Fukuoka, Japan
Key Offerings: Leadframes, heat spreaders, precision stamped components

Mitsui High-Tec specializes in precision metal components for semiconductor packaging, holding over 30% global market share in leadframes. Their products are essential for power devices and automotive ICs requiring high reliability.

Innovation Focus:

• Ag-plated leadframes for improved solderability
• Thin-wall leadframe technology enabling package miniaturization
• Thermal management solutions for high-power applications

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7️⃣ 4. Kyocera Corporation

Headquarters: Kyoto, Japan
Key Offerings: Ceramic packages, LTCC substrates, heat dissipation components

Kyocera dominates the ceramic packaging market, providing high-reliability solutions for aerospace, automotive and industrial applications. Their alumina and aluminum nitride packages offer superior thermal and mechanical properties.

Innovation Focus:

• Advanced ceramic packages for RF and power semiconductor devices
• 3D packaging solutions using multilayer ceramic technology
• High-thermal-conductivity substrates for EV power modules

Download FREE Sample Report: Semiconductor and IC Packaging Materials Market – View Detailed Research Report

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6️⃣ 5. Toppan Printing Co., Ltd.

Headquarters: Tokyo, Japan
Key Offerings: Organic substrates, photomasks, wafer-level packaging solutions

Toppan provides critical packaging substrates for leading chip manufacturers, with particular strength in flip-chip and system-in-package applications. Their advanced photolithography expertise enables next-generation packaging designs.

Innovation Focus:

• High-density interconnect (HDI) substrates for advanced packaging
• Low-loss materials for high-frequency applications
• Fan-out wafer-level packaging (FOWLP) technology

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5️⃣ 6. 3M Company

Headquarters: St. Paul, Minnesota, USA
Key Offerings: Thermal interface materials, adhesives, conductive pastes

3M’s diversified materials portfolio serves semiconductor packaging needs across thermal management, electrical interconnection, and device protection. Their solutions optimize performance while addressing manufacturing challenges.

Innovation Focus:

• Next-generation thermal interface materials with graphene additives
• Electrically conductive adhesives for heterogeneous integration
• Low-stress encapsulation compounds for MEMS packaging

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4️⃣ 7. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offerings: Epoxy molding compounds, liquid encapsulants, build-up films

A global leader in semiconductor encapsulation materials, Sumitomo Bakelite serves over 500 customers worldwide. Their products balance performance requirements with environmental sustainability goals.

Innovation Focus:

• Low-thermal-stress molding compounds for large packages
• High-reliability materials for automotive-grade semiconductors
• Biodegradable resin systems for sustainable packaging

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3️⃣ 8. Shinko Electric Industries Co., Ltd.

Headquarters: Nagano, Japan
Key Offerings: FC-BGA substrates, leadframes, flip-chip interposers

Shinko ranks among the top three global substrate manufacturers, supporting advanced packaging architectures from major foundries. Their technologies enable high-bandwidth communication between chiplets in modern processors.

Innovation Focus:

• Coreless substrate technology for high-speed computing
• Through-silicon via (TSV) interposers for 3D IC packaging
• Ultra-thin substrates for mobile applications

Read Full Report: Semiconductor and IC Packaging Materials Market – View Detailed Research Report

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2️⃣ 9. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offerings: Underfill materials, die attach adhesives, thermal interface materials

Henkel’s electronics materials division addresses critical bonding and protection challenges in semiconductor packaging. Their solutions enhance reliability while enabling manufacturing efficiency.

Innovation Focus:

• Fast-flow underfill materials for high-throughput production
• Silver sintering materials for power semiconductor packaging
• Low-outgassing materials for space applications

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1️⃣ 10. STATS ChipPAC (JCET Group)

Headquarters: Singapore
Key Offerings: Advanced packaging solutions, substrates, test services

As one of the world’s largest OSAT providers, JCET develops cutting-edge packaging technologies and the materials enabling them. Their vertical integration benefits material optimization.

Innovation Focus:

• Fan-out packaging (FOWLP/FOEB) technology
• Heterogeneous integration solutions
• Wafer-level CSP and system-in-package (SiP) solutions

Read Full Report: Semiconductor and IC Packaging Materials Market – View Detailed Research Report

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📈 Outlook: Semiconductor Packaging Materials Drive Next-Generation Electronics

The semiconductor packaging materials market continues evolving alongside chiplet architectures, 3D integration, and advanced thermal management requirements. As devices push performance boundaries, packaging materials must deliver enhanced electrical, thermal, and mechanical properties in increasingly constrained form factors.

🔑 Key Trends Shaping the Market:

• Expansion of heterogeneous integration and advanced packaging architectures
• Growing demand for high-performance thermal management solutions
• Material innovations supporting higher frequency and power applications
• Sustainable packaging solutions meeting environmental regulations

The companies profiled above are not just supplying materials – they’re enabling the semiconductor innovations powering our digital future. Their continued R&D investments and manufacturing scale ensure the electronics industry can overcome packaging challenges as chip complexity increases.

Read Full Report: Semiconductor and IC Packaging Materials Market – View Detailed Research Report