The Global Copper Foil for IC Substrate Market was valued at USD 1.085 Billion in 2023 and is projected to reach USD 1.578 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.5% during the forecast period (2023-2030). This growth is driven by increasing demand for advanced electronics, 5G infrastructure deployment, and the rapid expansion of electric vehicle production worldwide.
As electronic devices become smaller yet more powerful, the demand for ultra-thin, high-performance copper foil used in IC substrates continues to rise. In this blog, we profile the Top 10 Companies in the Copper Foil for IC Substrate Industry – a mix of established manufacturers and innovators driving technological advancements in this critical electronic materials sector.
🔟 1. Kingboard Holdings Limited
Headquarters: Hong Kong, China
Key Offering: Ultra-thin copper foil (3-18μm), high-frequency copper foil
Kingboard is a global leader in copper foil production with advanced manufacturing facilities across Asia. Their IC substrate copper foils are renowned for excellent surface roughness control and thermal stability, making them ideal for high-end semiconductor packaging applications.
Technological Advantages:
- Proprietary electrodeposition technology for uniform thickness
- Specialized treatments for improved bonding with resin substrates
- R&D focus on 5G-optimized copper foil formulations
Download FREE Sample Report: Copper Foil for IC Substrate Market – View in Detailed Research Report
9️⃣ 2. Nan Ya Plastics Corporation
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