The Global Semiconductor Non-UV Tape Market was valued at USD 359 Million in 2023 and is projected to reach USD 572.71 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.9% during the forecast period (2025-2030). This expansion is driven by increasing semiconductor production, advancements in chip packaging technologies, and the rising demand for consumer electronics and automotive semiconductors globally.
As semiconductor fabrication processes become more complex with smaller node technologies, the need for high-performance temporary bonding solutions has intensified. In this report, we analyze the Top 10 Companies in the Semiconductor Non-UV Tape Industry—pioneers developing innovative adhesive solutions for wafer processing, dicing, and package assembly.
🔟 1. Nitto Denko Corporation
Headquarters: Osaka, Japan
Key Offering: Semiconductor tapes, including thermal release and UV tapes
Nitto Denko leads the global semiconductor tape market with its comprehensive portfolio of temporary bonding solutions. The company’s non-UV tapes are widely used in wafer thinning and package processing applications across leading semiconductor fabs.
Innovation Highlights:
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Advanced thermal slide technology for stress-free debonding
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High-temperature resistant formulations for 3D packaging
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Low-residue adhesives for delicate wafer surfaces
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9️⃣ 2. 3M Company
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