The Global Electronic Die Attach Adhesives Market was valued at USD 890 Million in 2025 and is projected to reach USD 1.65 Billion by 2034, growing at a Compound Annual Growth Rate (CAGR) of 7.8% during the forecast period (2026–2034). This growth is intrinsically linked to the expansion of the semiconductor industry and is driven by the relentless miniaturization of electronics, the automotive sector’s shift to electrification, and the proliferation of 5G and IoT technologies.

As semiconductor packages become more complex and demand higher performance, the role of advanced adhesives in providing mechanical support, electrical connectivity, and thermal management is more critical than ever. In this blog, we profile the Top 10 Companies in the Electronic Die Attach Adhesives Industry—global materials science leaders and specialized innovators shaping the future of microelectronics assembly.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® Ablestik® and Hysol® die attach adhesives, thermally conductive films

Henkel is a global leader in adhesive technologies, offering a comprehensive portfolio of die attach solutions under its LOCTITE Ablestik and Hysol brands. Its products are critical for a wide range of applications, from consumer electronics to high-reliability automotive and aerospace systems, known for their excellent thermal conductivity and reliability under thermal cycling.

Innovation Initiatives:

• Development of next-generation, halogen-free, and lead-free formulations

• Advanced materials for power semiconductors (SiC, GaN) and heterogenous integration

• Strong focus on sustainability with products enabling smaller, more energy-efficient devices

Download FREE Sample Report: Electronic Die Attach Adhesives Market – View in Detailed Research Report

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9️⃣ 2. Dow Inc.

Headquarters: Midland, Michigan, USA
Key Offering: DOWSIL™ EA conductive adhesives, silicone-based and epoxy formulations

Dow is a major materials science company providing innovative die attach adhesives that offer superior performance in harsh environments. Its DOWSIL EA series is renowned for high purity, low stress, and excellent adhesion to various substrates, making it a preferred choice for automotive and industrial applications.

Innovation Initiatives:

• Expanding solutions for electric vehicle power modules and advanced sensors

• Investment in R&D for fast-cure and UV-curable adhesive technologies

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8️⃣ 3. Hitachi Chemical Company (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Aimside® series of die attach adhesives, films, and pastes

Hitachi Chemical, now part of Showa Denko Materials, is a key supplier in the Asia-Pacific region and globally. Its Aimside products are widely used in semiconductor packaging for smartphones, servers, and automotive electronics, known for their high thermal conductivity and reliability.

Innovation Initiatives:

• Focus on adhesives for fan-out wafer-level packaging (FOWLP) and 3D integration

• Development of low-temperature cure adhesives for heat-sensitive components

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7️⃣ 4. Kyocera Corporation

Headquarters: Kyoto, Japan
Key Offering: Ceramic substrates, packages, and specialized die attach materials

While primarily known for its ceramic packages, Kyocera develops compatible die attach adhesives that ensure optimal performance for high-power and high-frequency devices. Its solutions are critical for applications requiring excellent thermal dissipation and mechanical stability.

Innovation Initiatives:

• Integrated materials solutions for power electronics and RF modules

• R&D into adhesives for extreme environment applications

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6️⃣ 5. DELO Industrie Klebstoffe

Headquarters: Windach, Germany
Key Offering: Light-curing and thermally curing die attach adhesives

DELO is a specialist in high-performance industrial adhesives, offering a range of products known for rapid curing speeds and high bond strength. Its adhesives are used in demanding applications like MEMS sensors, camera modules, and automotive electronics.

Innovation Initiatives:

• Pioneering light-curing adhesives for high-volume, automated assembly lines

• Development of adhesives with very low ion content for high-reliability applications

Download FREE Sample Report: Electronic Die Attach Adhesives Market – View in Detailed Research Report

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5️⃣ 6. Heraeus Holding

Headquarters: Hanau, Germany
Key Offering: Silver-filled epoxy and sintered silver die attach adhesives

Heraeus is a leading technology group with a strong presence in electronic materials. Its die attach adhesives, particularly silver-based formulations, are valued for their high thermal and electrical conductivity, making them ideal for power semiconductor devices and LED packaging.

Innovation Initiatives:

• Leadership in sintered silver technology for high-temperature applications

• Focus on materials for wide-bandgap semiconductors (SiC, GaN)

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4️⃣ 7. Nordson EFD

Headquarters: Westlake, Ohio, USA
Key Offering: Precision dispensing systems and specialized die attach fluids

Nordson EFD specializes in precision fluid dispensing systems and the adhesives designed for them. Its expertise lies in ensuring precise, repeatable application of die attach materials, which is crucial for manufacturing yield and reliability in microelectronics.

Innovation Initiatives:

• Integration of dispensing equipment with advanced adhesive formulations

• Solutions for miniaturized components and ultra-fine pitch dispensing

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3️⃣ 8. Engineered Materials Systems (EMS)

Headquarters: Westerville, Ohio, USA
Key Offering: Electrically conductive adhesives (ECAs), silver epoxies

EMS is a specialized manufacturer of electrically conductive adhesives used for die attachment and interconnectivity. The company serves a broad range of markets, including automotive, medical, and telecommunications, with a focus on high-reliability applications.

Innovation Initiatives:

• Development of low-temperature cure and snap-cure adhesives

• Formulations compliant with stringent automotive and aerospace standards

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2️⃣ 9. AI Technology, Inc. (AIT)

Headquarters: Princeton, New Jersey, USA
Key Offering: Flexible, low-stress, and reworkable die attach adhesives

AIT is known for its innovative adhesive formulations that address challenging assembly requirements, such as bonding dissimilar materials or components prone to thermal stress. Its products are often used in flexible electronics and applications requiring reworkability.

Innovation Initiatives:

• Specialization in low-modulus, stress-absorbing adhesives

• Development of thermally conductive but electrically insulating materials

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1️⃣ 10. Shenmao Technology Inc.

Headquarters: Taoyuan City, Taiwan
Key Offering: Solder pastes, conductive inks, and die attach pastes

Shenmao Technology is a major player in the Asian market, supplying a wide array of electronic bonding materials. Its die attach pastes are used extensively in the region’s vast consumer electronics and semiconductor manufacturing ecosystem, known for their consistency and performance.

Innovation Initiatives:

• Expansion of product portfolio to meet demands for higher thermal performance

• Focus on cost-effective solutions for high-volume manufacturing

Get Full Report Here: Electronic Die Attach Adhesives Market – View in Detailed Research Report

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🚀 Outlook: The Future of Electronic Die Attach Adhesives Is Smarter and More Integrated

The electronic die attach adhesives market is at the forefront of semiconductor innovation. As packages evolve to meet the demands of AI, 5G, and electric vehicles, adhesive formulations must deliver unprecedented levels of thermal performance, electrical conductivity, and mechanical stability.

📈 Key Trends Shaping the Market:

• Rising demand for adhesives compatible with wide-bandgap semiconductors (SiC, GaN)

• Accelerated adoption of advanced packaging techniques like 2.5D/3D IC integration

• Shift towards lead-free, halogen-free, and sustainable material formulations

• Increasing integration of adhesive dispensing into fully automated smart factories

Get Full Report Here: Electronic Die Attach Adhesives Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials—they are enabling the next generation of electronic devices by providing the foundational bonding solutions that make advanced packaging possible.