Top 10 Companies in the Etchant for Under Bump Metallization (UBM) Market (2026): Innovators Powering Semiconductor Packaging

In Business Insights
February 27, 2026


The Global Etchant for Under Bump Metallization (UBM) Market was valued at USD 34.2 Million in 2025 and is projected to reach USD 51.4 Million by 2034, growing at a Compound Annual Growth Rate (CAGR) of 6.1% during the forecast period (2025–2034). This growth is being driven by the relentless miniaturization of semiconductor devices, the widespread adoption of advanced packaging technologies like 2.5D/3D ICs, and rising demand from high-performance computing and artificial intelligence applications.

As the semiconductor industry pushes the boundaries of performance and integration, the spotlight is on the specialized chemical suppliers who provide the precision materials essential for creating reliable interconnects. In this blog, we profile the Top 10 Companies in the Etchant for Under Bump Metallization (UBM) Industry—a mix of global chemical giants and niche specialists shaping the future of microelectronic packaging.

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Etchant for Under Bump Metallization (UBM) Market – View in Detailed Research Report


🔟 1. Mitsubishi Gas Chemical Company, Inc.

Headquarters: Tokyo, Japan
Key Offering: High-purity Cu, Ti/TiW, and Ni Etchants for UBM

Mitsubishi Gas Chemical is a global leader in high-performance electronic chemicals, with a comprehensive portfolio of etchants tailored for advanced Under Bump Metallization processes. The company’s formulations are renowned for their exceptional selectivity and uniformity, which are critical for defining fine-pitch bump pads in flip-chip and wafer-level packaging.

Innovation Initiatives:

  • Development of next-generation etchants for copper pillars and micro-bumps

  • Focus on eco-friendly formulations with reduced environmental impact

  • Strong R&D partnerships with leading semiconductor manufacturers and OSATs


9️⃣ 2. Technic Inc.

Headquarters: Providence, Rhode Island, USA
Key Offering: Custom UBM Etchants, Electropolishing Solutions, and Equipment

Technic is a prominent supplier of specialty chemicals, equipment, and services for the electronics industry. Their UBM etchant solutions are engineered for high selectivity, particularly for complex multi-layer metal stacks, and are supported by their proprietary dispensing and filtration systems.

Innovation Initiatives:

  • Integrated equipment and chemistry solutions for process optimization

  • Development of low-CoO (Cost of Ownership) etching processes


8️⃣ 3. Uyemura & Co., Ltd.

Headquarters: Osaka, Japan
Key Offering: UBP Series Etchants for Cu, Ni, and Au UBM layers

Uyemura is a specialized surface technology company with deep expertise in plating and etching chemistries for the semiconductor industry. Their UBM etchants are designed to provide precise control over etch rates and profile anisotropy, which is essential for high-density packaging applications.

Innovation Initiatives:

  • Proprietary additive technology to enhance etching uniformity

  • Solutions optimized for both wafer-level and panel-level packaging

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Etchant for Under Bump Metallization (UBM) Market – View in Detailed Research Report


7️⃣ 4. Transene Company, Inc.

Headquarters: Danvers, Massachusetts, USA
Key Offering: High-selectivity Etchants for Au, Ti, Ni, and Cu UBM

Transene is a well-established manufacturer of high-purity chemicals for semiconductor and microelectronics fabrication. The company offers a wide range of etchants known for their reliability and consistency, serving both research institutions and high-volume manufacturing facilities.

Innovation Initiatives:

  • Specialization in etchants for gold and refractory metal UBM layers

  • Focus on formulations with extended bath life and stability


6️⃣ 5. Meltex Inc.

Headquarters: Tokyo, Japan
Key Offering: MEC Etchants for Cu, Al, and TiW UBM processes

Meltex is a key Japanese player in the electroplating and etching chemicals market. Their products are critical for creating the fine-line circuits and bumps used in advanced semiconductor packages, with a strong presence in the Asia-Pacific region.

Innovation Initiatives:

  • Development of low-etch-rate formulations for superior process control

  • Collaborations with packaging foundries to customize chemistries for specific node requirements


5️⃣ 6. Grand Process Technology Corporation

Headquarters: Hsinchu, Taiwan
Key Offering: GPT Etchants for Semiconductor Packaging and PCB Applications

Grand Process Technology (GPT) is a leading Taiwanese supplier of process chemicals for the semiconductor industry. Located in the heart of a major global packaging hub, GPT provides tailored UBM etching solutions to many leading OSATs and foundries.

Innovation Initiatives:

  • Rapid development cycles to meet evolving customer specifications

  • Strong focus on supply chain reliability and technical support for local manufacturers


4️⃣ 7. Chemleader Corporation

Headquarters: Gyeonggi-do, South Korea
Key Offering: Specialty Etchants for Wafer Bumping and RDL Processes

Chemleader is a South Korean specialty chemical company that has carved out a significant niche in the semiconductor materials market. Their expertise lies in developing high-performance etchants for the complex UBM stacks used in memory and logic devices.

Innovation Initiatives:

  • Targeted R&D for etchants compatible with next-generation low-k dielectrics

  • Expansion of product portfolio to serve the growing Korean and Chinese semiconductor sectors

Download FREE Sample Report:
Etchant for Under Bump Metallization (UBM) Market – View in Detailed Research Report


3️⃣ 8. NB Technologies GmbH

Headquarters: Jena, Germany
Key Offering: Precision Etchants for Microstructuring and UBM

NB Technologies is a German specialist in high-purity chemicals for microfabrication. While serving a broad range of industries, their precise and controllable etchants are highly valued in semiconductor packaging for applications requiring impeccable uniformity.

Innovation Initiatives:

  • Expertise in formulations for European R&D centers and specialized IDMs

  • Development of halogen-free and sustainable etching alternatives


2️⃣ 9. Sun Surface Technology Co., Ltd.

Headquarters: Taoyuan City, Taiwan
Key Offering: SST Etchants for IC Substrate and Advanced Packaging

Sun Surface Technology is another key Taiwanese supplier focused on the chemical needs of the packaging and PCB industries. Their products are integral to the UBM processes of many regional OSATs, supporting the massive production volumes of the area.

Innovation Initiatives:

  • Cost-effective solutions for high-volume manufacturing environments

  • Close collaboration with customers for rapid problem-solving and process improvement


1️⃣ 10. Jiangsu Aisen Semiconductor Material Co., Ltd.

Headquarters: Jiangsu, China
Key Offering: Domestic UBM Etchants for the Chinese Semiconductor Market

Jiangsu Aisen is a rising Chinese manufacturer of semiconductor process chemicals. As China intensifies its efforts to build a self-sufficient semiconductor supply chain, companies like Aisen are critical for providing locally sourced, high-quality UBM etchants.

Innovation Initiatives:

  • Focus on import substitution and supporting China’s semiconductor independence goals

  • Investment in scaling production capacity to meet domestic demand

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Etchant for Under Bump Metallization (UBM) Market – View in Detailed Research Report


🔬 Outlook: The Future of UBM Etchants Is More Precise and Sustainable

The etchant for Under Bump Metallization market is undergoing a significant transformation. While traditional wet chemistries dominate, the industry is investing heavily in advanced formulations that offer superior selectivity, environmental compliance, and compatibility with next-generation packaging architectures.

📈 Key Trends Shaping the Market:

  • Transition to etchants for copper pillar and micro-bump applications in 3D IC stacking

  • Growing regulatory pressure driving the adoption of greener, safer chemical formulations

  • Increasing complexity of heterogenous integration, requiring etchants for novel material combinations

  • Closer collaboration between chemical suppliers and packaging foundries for co-development

Get Full Report Here:
Etchant for Under Bump Metallization (UBM) Market – View in Detailed Research Report

The companies listed above are not only supplying critical process chemicals—they’re enabling the next wave of semiconductor innovation by ensuring the reliability and performance of the world’s most advanced chips.