The Global Dicing Die Bonding Tape Market was valued at USD 852.7 Million in 2024 and is projected to reach USD 1.52 Billion by 2032, growing at a Compound Annual Growth Rate (CAGR) of 7.6% during the forecast period (2025–2032). This significant growth is being fueled by the relentless expansion of the semiconductor industry, the proliferation of advanced packaging technologies, and increasing demand for electronics across automotive, consumer goods, and industrial sectors.

As semiconductor fabrication processes become more complex and move towards smaller nodes and 3D architectures, the role of specialized materials like dicing die bonding tape has become increasingly critical. These tapes are essential for precisely dicing wafers into individual dies and securely attaching them to substrates or other dies. In this blog, we profile the Top 10 Companies in the Dicing Die Bonding Tape Industry—a group of material science pioneers and established giants shaping the future of semiconductor packaging.

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🔟 1. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: Non-Conductive Tapes, Conductive Tapes, UV Curable Tapes

Nitto Denko is a global leader in pressure-sensitive adhesive tapes, holding a commanding position in the dicing die bonding tape market. The company’s extensive R&D capabilities have led to the development of high-performance tapes for ultra-thin wafers and advanced packaging applications like Fan-Out Wafer-Level Packaging (FOWLP).

Innovation Initiatives:

• Development of low-outgassing tapes for high-reliability applications

• Investments in next-generation materials for sub-5nm node compatibility

• Global expansion of production capacity to meet growing semiconductor demand

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9️⃣ 2. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Dicing Tapes, Die Attach Films, Specialized Adhesives

LINTEC Corporation is a prominent supplier of adhesive products with a strong focus on semiconductor materials. The company offers a comprehensive portfolio of dicing and die bonding solutions known for their precise thickness control and excellent adhesion properties, catering to both mainstream and high-performance semiconductor applications.

Innovation Initiatives:

• Focus on eco-friendly and halogen-free tape formulations

• Development of tapes with enhanced thermal conductivity for power devices

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8️⃣ 3. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-Thin Dicing Tapes, Thermal Interface Materials

Furukawa Electric has built a strong reputation in the semiconductor materials sector with its advanced dicing tape solutions. The company specializes in products that address the challenges of ultra-thin wafer processing and high-density integration, making it a key partner for leading semiconductor manufacturers.

Innovation Initiatives:

• R&D in materials for heterogeneous integration and chiplet architectures

• Expansion of product lines for wide-bandgap semiconductor applications

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7️⃣ 4. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Loctite-branded Adhesives, Die Attach Films, Advanced Encapsulants

Henkel is a global leader in adhesive technologies with a significant presence in the semiconductor packaging market. Through its Electronics business, Henkel provides innovative die attach materials and bonding solutions that offer superior reliability for automotive, industrial, and consumer electronics applications.

Innovation Initiatives:

• Development of high-thermal-conductivity materials for advanced power modules

• Sustainability-focused product development and manufacturing processes

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6️⃣ 5. LG Chem Ltd.

Headquarters: Seoul, South Korea
Key Offering: High-Performance Adhesive Films, Functional Materials

As a major chemical company, LG Chem has strategically expanded into electronic materials, including dicing die bonding tapes. Leveraging its expertise in polymer science, the company develops advanced adhesive solutions that meet the rigorous demands of modern semiconductor fabrication processes.

Innovation Initiatives:

• Vertical integration of raw material production for supply chain stability

• Collaborative development with major Korean semiconductor manufacturers

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5️⃣ 6. Mitsui Chemicals, Inc.

Headquarters: Tokyo, Japan
Key Offering: Specialty Films, Adhesive Materials, Packaging Solutions

Mitsui Chemicals is a diversified chemical company with a strong electronic materials division. The company offers dicing and die bonding tapes that are engineered for high precision and reliability, serving a global customer base across various semiconductor applications.

Innovation Initiatives:

• Development of materials compatible with lead-free and high-temperature processes

• Strategic partnerships with equipment manufacturers for integrated solutions

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4️⃣ 7. AI Technology, Inc.

Headquarters: Princeton, New Jersey, USA
Key Offering: Specialty Adhesives, Thermally Conductive Tapes, Custom Formulations

AI Technology is a specialty materials company focused on high-performance adhesives for demanding electronic applications. The company differentiates itself through customer-specific formulations and rapid prototyping capabilities, serving niche markets with unique technical requirements.

Innovation Initiatives:

• Customized solutions for aerospace, defense, and medical applications

• Development of room-temperature cure adhesives for energy-efficient manufacturing

Download FREE Sample Report: Dicing Die Bonding Tape Market – View in Detailed Research Report

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3️⃣ 8. Hitachi Chemical (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Semiconductor Packaging Materials, Advanced Adhesives

Now operating as part of Showa Denko Materials following a merger, Hitachi Chemical brings decades of experience in semiconductor materials. The company offers a comprehensive range of dicing and bonding solutions optimized for various semiconductor packaging architectures and process requirements.

Innovation Initiatives:

• Integration of materials expertise from merged entities for enhanced product portfolios

• Focus on materials for automotive-grade semiconductor applications

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2️⃣ 9. DuPont de Nemours, Inc.

Headquarters: Wilmington, Delaware, USA
Key Offering: High-Performance Polymers, Electronic Materials, Specialty Adhesives

DuPont is a global science and technology leader with a strong presence in electronic materials. The company’s expertise in polymer science enables it to develop advanced bonding solutions that meet the evolving requirements of semiconductor packaging, particularly for high-reliability applications.

Innovation Initiatives:

• Development of materials for extreme environment applications

• Sustainable material solutions with reduced environmental impact

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1️⃣ 10. 3M Company

Headquarters: Saint Paul, Minnesota, USA
Key Offering: Broad Portfolio of Adhesive Tapes, Electronic Materials

3M is a diversified technology company with extensive capabilities in adhesive technologies. While not exclusively focused on semiconductor applications, 3M provides reliable dicing and bonding solutions that leverage the company’s deep expertise in material science and manufacturing excellence.

Innovation Initiatives:

• Application of core adhesive technologies to semiconductor packaging challenges

• Global supply chain capabilities ensuring consistent product availability

Get Full Report Here: Dicing Die Bonding Tape Market – View in Detailed Research Report

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🔬 Outlook: The Future of Dicing Die Bonding Tape Is Smarter and More Specialized

The dicing die bonding tape market is undergoing a significant transformation as semiconductor technology advances toward smaller geometries and more complex packaging architectures. While conventional tapes continue to serve established applications, the industry is increasingly focused on advanced material formulations that can address the challenges of next-generation semiconductor manufacturing.

📈 Key Trends Shaping the Market:

• Development of ultra-thin tapes for wafer thinning below 50μm

• Growing adoption of conductive tapes for power electronics and RF applications

• Integration of functional properties like thermal management and EMI shielding

• Increased focus on sustainable and environmentally friendly material solutions

Get Full Report Here: Dicing Die Bonding Tape Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials for today’s semiconductor industry—they’re developing the innovative solutions that will enable the next generation of electronic devices.