The Global Back Grinding Tapes Market was valued at USD 220 Million in 2025 and is projected to reach USD 322 Million by 2034, growing at a Compound Annual Growth Rate (CAGR) of 5.7% during the forecast period (2024–2034). This growth is being driven by the relentless push for electronics miniaturization, rising demand for high-performance computing and AI chips, and the accelerating adoption of advanced semiconductor packaging solutions across consumer electronics and automotive sectors.

As the semiconductor industry transforms toward more powerful and compact devices, the spotlight is on the key material suppliers who are driving innovation, precision, and yield enhancement. In this blog, we profile the Top 10 Companies in the Back Grinding Tapes Industry—a mix of Japanese specialists, global chemical giants, and niche innovators shaping the future of global wafer fabrication.

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🔟 1. Mitsui Chemicals Tohcello

Headquarters: Tokyo, Japan
Key Offering: UV and Non-UV Back Grinding Tapes, Dicing Tapes

Mitsui Chemicals Tohcello is a leading global supplier of high-performance tapes for semiconductor processing. The company offers a comprehensive portfolio of back grinding tapes designed for various applications, including ultra-thin wafers and wafers with bump structures. Their products are known for excellent adhesion control, low contamination, and clean peeling characteristics.

Innovation Initiatives:

• Development of advanced UV-curable adhesive systems for stress-free debonding

• Focus on tapes for next-generation packaging like fan-out wafer-level packaging (FOWLP)

• Strong R&D collaboration with leading semiconductor manufacturers

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Back Grinding Tapes Market – View in Detailed Research Report

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9️⃣ 2. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: ELEP HOLDER™ series BGTs, UV and Non-UV types

Nitto is a dominant force in the Back Grinding Tapes market, renowned for its ELEP HOLDER™ series. These tapes provide superior protection for wafer circuits during the back-grinding process, minimizing chipping and cracking. Nitto’s solutions are critical for handling the industry’s shift toward thinner wafers and more complex device architectures.

Innovation Initiatives:

• Pioneering ultra-low residue adhesive formulations

• Expanding product lines for large-diameter and high-bump wafers

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8️⃣ 3. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: ADWILL series BGTs, Specialty adhesive films

LINTEC Corporation is a key global player with its ADWILL series of back grinding tapes. The company’s products are engineered to meet the stringent requirements of advanced semiconductor manufacturing, offering reliable protection and easy release. LINTEC has a strong presence across Asia, serving major foundries and OSAT providers.

Innovation Initiatives:

• Investment in R&D for tapes compatible with new substrate materials like SiC and GaN

• Development of multi-functional tapes that combine grinding and dicing protection

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7️⃣ 4. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Back Grinding Tapes for standard and advanced applications

Furukawa Electric leverages its extensive expertise in materials science to produce high-quality back grinding tapes. The company’s products are designed to ensure high yield in wafer thinning processes, particularly for memory and logic chips. Their tapes are valued for their consistent performance and reliability.

Innovation Initiatives:

• Focus on enhancing tape properties for warpage control in ultra-thin dies

• Collaboration with equipment manufacturers for process optimization

Download FREE Sample Report:
Back Grinding Tapes Market – View in Detailed Research Report

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6️⃣ 5. Denka Company Limited

Headquarters: Tokyo, Japan
Key Offering: Specialty BGTs, High thermal conductivity materials

Denka Company Limited is a significant supplier of functional materials, including back grinding tapes for the semiconductor industry. The company focuses on developing tapes that address specific challenges in advanced packaging, such as thermal management and mechanical stability during processing.

Innovation Initiatives:

• Integration of functional fillers for improved thermal performance

• Research into environmentally friendly adhesive systems

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5️⃣ 6. LG Chem

Headquarters: Seoul, South Korea
Key Offering: Back Grinding Tapes, Semiconductor materials

LG Chem is a major South Korean chemical company with a growing presence in the semiconductor materials market. Their back grinding tapes are developed to support the robust domestic semiconductor industry, offering solutions tailored for high-volume manufacturing and advanced process nodes.

Innovation Initiatives:

• Leveraging polymer expertise for next-generation adhesive development

• Focus on supplying the expanding Korean and global semiconductor ecosystem

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4️⃣ 7. Maxell, Ltd.

Headquarters: Tokyo, Japan
Key Offering: Precision tapes for electronics, BGTs

Maxell, Ltd., known for its expertise in precision manufacturing, produces back grinding tapes that meet the high standards of the semiconductor industry. Their products are designed to provide excellent protection for wafer surfaces, contributing to higher production yields in demanding fabrication environments.

Innovation Initiatives:

• Application of proprietary coating technologies for uniform adhesion

• Development of tapes for emerging applications in MEMS and sensors

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3️⃣ 8. D&X

Headquarters: Gyeonggi-do, South Korea
Key Offering: Back Grinding Tapes, Dicing Tapes

D&X is a specialized South Korean manufacturer focusing on tapes for semiconductor backend processes. The company provides competitive back grinding tape solutions that cater to the cost and performance requirements of various semiconductor manufacturers, particularly in the Asia-Pacific region.

Innovation Initiatives:

• Rapid customization of tape properties for specific customer processes

• Expansion of production capacity to meet growing regional demand

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2️⃣ 9. AI Technology, Inc.

Headquarters: Princeton, New Jersey, USA
Key Offering: Specialty adhesives, BGTs for R&D and low-volume production

AI Technology, Inc. is a U.S.-based company providing specialty adhesive solutions, including back grinding tapes for prototyping and specialized semiconductor applications. They serve a niche market requiring custom formulations and high-reliability performance for advanced R&D and non-standard processes.

Innovation Initiatives:

• Development of high-temperature stable tapes for wide-bandgap semiconductors

• Focus on flexible and hybrid electronics applications

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1️⃣ 10. Taicang Zhanxin Adhesive Material Co., Ltd.

Headquarters: Suzhou, China
Key Offering: Cost-competitive BGTs, Localized semiconductor materials

Taicang Zhanxin is a Chinese manufacturer contributing to the domestic semiconductor supply chain by providing back grinding tapes. The company focuses on offering cost-effective solutions for the growing Chinese semiconductor industry, supporting the nation’s push for self-sufficiency in key technologies.

Innovation Initiatives:

• Localization of tape production to reduce import dependency

• Development of products for mature and leading-edge nodes

Get Full Report Here:
Back Grinding Tapes Market – View in Detailed Research Report

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🌍 Outlook: The Future of Back Grinding Tapes Is Smarter and More Demanding

The back grinding tapes market is undergoing a significant evolution. While standard tapes still dominate in volume, the industry is investing heavily in advanced adhesive systems, specialized film materials, and formulations tailored for next-generation semiconductor processes.

📈 Key Trends Shaping the Market:

• Rapid adoption of UV-release tapes for ultra-thin wafer handling

• Increasing demand for tapes compatible with compound semiconductors like SiC and GaN

• Digitalization of material properties and process integration for yield management

• Semiconductor-tape company collaborations for defect reduction and process optimization

Get Full Report Here:
Back Grinding Tapes Market – View in Detailed Research Report

The companies listed above are not only enabling semiconductor manufacturing—they’re spearheading the innovation pathway for smaller, faster, and more powerful electronics.