The Global Tape for Dicing Market was valued at USD 2.15 Billion in 2023 and is projected to reach USD 3.12 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.8% during the forecast period (2024–2030). This significant growth is being fueled by the relentless expansion of the semiconductor industry, the rise of advanced packaging technologies, and the increasing demand for miniaturized electronic components across consumer electronics, automotive, and IoT sectors.

As semiconductor fabrication processes become more complex and wafer sizes continue to evolve, the critical role of dicing tape in ensuring die integrity and yield has never been more pronounced. In this blog, we profile the Top 10 Companies in the Tape for Dicing Industry—a group of specialized material science innovators and global suppliers who are enabling the precision manufacturing of next-generation chips.

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🔟 1. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: UV-curable dicing tapes, Non-UV (pressure-sensitive) dicing tapes

Nitto Denko is a dominant global leader in the tape for dicing market, renowned for its high-purity, high-performance adhesive solutions. The company’s extensive product portfolio serves a wide range of wafer materials, including silicon, gallium arsenide, and glass. Their R&D focuses on developing tapes for ultra-thin wafers and advanced substrates used in 3D packaging.

Innovation Initiatives:

• Development of low-outgassing tapes for sensitive MEMS and sensor applications

• Advanced release layer technologies for clean die pickup

• Expansion of product lines for compound semiconductors (SiC, GaN)

Download FREE Sample Report:
Global Tape for Dicing Market – View in Detailed Research Report

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9️⃣ 2. Mitsui Chemicals, Inc.

Headquarters: Tokyo, Japan
Key Offering: Alpha-WAVE™ series dicing tapes, Thermal release tapes

Mitsui Chemicals is a key supplier of high-performance materials for the semiconductor industry. Their Alpha-WAVE™ series offers superior adhesion control and UV curability, specifically engineered to handle the challenges of dicing increasingly thin and fragile wafers. The company maintains strong partnerships with major semiconductor foundries and OSATs (Outsourced Semiconductor Assembly and Test) worldwide.

Innovation Initiatives:

• Focus on tapes for fan-out wafer-level packaging (FOWLP)

• Development of environmentally friendly, solvent-free adhesive formulations

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8️⃣ 3. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Evalpha™ dicing tapes, High-heat resistant tapes

Sumitomo Bakelite leverages its deep expertise in phenolic resins and plastics to produce highly reliable dicing tapes. Their products are known for excellent stability under the thermal and mechanical stress of the dicing process. The company is heavily invested in solutions for next-generation power devices and wide-bandgap semiconductors.

Innovation Initiatives:

• Specialized tapes for silicon carbide (SiC) and gallium nitride (GaN) wafers

• Integration with other semiconductor packaging materials for complete solutions

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7️⃣ 4. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Adwill D-series dicing tapes, L&M dicing tapes

LINTEC is a major global player in adhesive technologies, with a strong footprint in the semiconductor sector. Their Adwill series provides precise adhesion control, which is critical for preventing die fly and ensuring high yields during the dicing of complex MEMS and logic devices. The company has a robust global manufacturing and distribution network.

Innovation Initiatives:

• Investment in R&D for tapes compatible with ultra-fine dicing blades and laser dicing

• Expansion of product offerings for the Chinese and Southeast Asian markets

Download FREE Sample Report:
Global Tape for Dicing Market – View in Detailed Research Report

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6️⃣ 5. Denka Company Limited

Headquarters: Tokyo, Japan
Key Offering: Denka Dicing Tapes, Thermoplastic adhesive tapes

Denka leverages its chemical synthesis capabilities to produce specialized dicing tapes with unique adhesive properties. Their products are designed to offer excellent wafer holding power while allowing for clean and easy detachment of diced chips, which is essential for high-throughput assembly lines.

Innovation Initiatives:

• Development of low-static tapes to prevent electrostatic discharge (ESD) damage

• Focus on cost-performance optimization for high-volume manufacturing

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5️⃣ 6. AI Technology, Inc. (AIT)

Headquarters: Princeton Junction, New Jersey, USA
Key Offering: Specialty temporary bonding adhesives and dicing tapes

AIT is a prominent US-based specialty materials company focusing on innovative adhesive solutions for harsh environments. While serving a broad market, they have developed a niche in high-temperature and high-reliability dicing tapes for military, aerospace, and automotive-grade semiconductors, where performance under extreme conditions is paramount.

Innovation Initiatives:

• Pioneering flexible and stretchable adhesive systems for unconventional substrates

• Custom formulation services for specific customer dicing challenges

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4️⃣ 7. Ultron Systems, Inc.

Headquarters: Colorado Springs, Colorado, USA
Key Offering: Ultron D-Tape, Laser dicing compatible tapes

Ultron Systems specializes in high-purity consumables for the semiconductor industry. Their dicing tapes are engineered to meet the stringent contamination control requirements of leading-edge fabs. The company is recognized for its expertise in supplying tapes that are compatible with both mechanical blade dicing and advanced laser dicing processes.

Innovation Initiatives:

• Tape solutions for dicing after grinding (DAG) processes on ultra-thin wafers

• Focus on reducing adhesive residue for post-dicing cleaning efficiency

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3️⃣ 8. Pantech Tape Co., Ltd.

Headquarters: Seoul, South Korea
Key Offering: Pantech Dicing Tapes, UV and Non-UV types

Pantech Tape is a leading South Korean manufacturer of industrial tapes, with a growing presence in the semiconductor materials sector. They supply a range of dicing tapes to the robust electronics manufacturing ecosystem in Asia, offering competitive products that meet the demanding specifications of memory and display driver IC manufacturers.

Innovation Initiatives:

• Rapid response to the needs of local semiconductor giants like Samsung and SK Hynix

• Investment in capacity expansion to serve the growing Asian market

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2️⃣ 9. QES GROUP BERHAD

Headquarters: Selangor, Malaysia
Key Offering: Equipment and consumables distribution, including dicing tapes

QES Group is a leading distributor of semiconductor equipment and materials in Southeast Asia. While not a primary manufacturer, they play a crucial role in the supply chain by providing various brands of dicing tapes and technical support to numerous fabs and OSATs in the region, ensuring just-in-time availability and local expertise.

Innovation Initiatives:

• Supply chain integration and logistics optimization

• Technical service and support for equipment-tape compatibility

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1️⃣ 10. Shenzhen Xinst Technology Co., Ltd.

Headquarters: Shenzhen, Guangdong, China
Key Offering: XINST dicing tapes for various applications

Shenzhen Xinst Technology is a key Chinese player in the semiconductor consumables market. Capitalizing on China’s massive investments in domestic semiconductor production, the company supplies dicing tapes tailored for the mid-range market, supporting the country’s goal of achieving self-sufficiency in key electronic components.

Innovation Initiatives:

• Localized production to reduce costs and lead times for Chinese customers

• Development of products for the burgeoning Chinese MEMS and sensor industry

Get Full Report Here:
Global Tape for Dicing Market – View in Detailed Research Report

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🌍 Outlook: The Future of Tape for Dicing Is Smarter and More Specialized

The tape for dicing market is undergoing a significant transformation. While standard tapes continue to serve a large volume of the market, the industry is innovating rapidly to meet the demands of advanced semiconductor nodes, new substrate materials, and complex heterogeneous integration schemes like chiplets.

📈 Key Trends Shaping the Market:

• R&D focus on tapes for dicing ultra-thin wafers (<50µm) for 3D IC stacking

• Development of specialized formulations for wide-bandgap semiconductors (SiC, GaN) used in electric vehicles and 5G infrastructure

• Integration of functional properties, such as electrical conductivity for grounding during dicing

• Growing demand for environmentally sustainable, low-VOC, and recyclable tape solutions

Get Full Report Here:
Global Tape for Dicing Market – View in Detailed Research Report

The companies listed above are not only supplying a critical consumable—they are enabling the precision and reliability that underpins the entire global electronics industry.