The Global Granular Epoxy Mold Compound (EMC) Market was valued at US$ 2.8 Billion in 2023 and is projected to reach US$ 4.3 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.2% during the forecast period (2024–2030). This growth is being driven by the proliferation of advanced electronics, increasing demand for semiconductor packaging, and the accelerating adoption of Fan-Out Wafer-Level Packaging (FOWLP) and other advanced packaging technologies across consumer electronics, automotive, and industrial sectors.

As the semiconductor industry advances toward miniaturization, higher performance, and improved reliability, the spotlight is on the key material suppliers who are driving innovation in encapsulation and protection. In this blog, we profile the Top 10 Companies in the Granular Epoxy Mold Compound Industry—a mix of chemical giants, specialty material producers, and technology pioneers shaping the future of electronic packaging.

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🔟 1. Panasonic Industry Co., Ltd.

Headquarters: Kadoma, Osaka, Japan
Key Offering: High Thermal Conductivity EMC, Low-Stress EMC, High-Reliability EMC

Panasonic is a global leader in electronic materials, offering a comprehensive portfolio of Granular Epoxy Mold Compounds designed for a wide range of semiconductor applications. Their materials are known for excellent moisture resistance, high thermal performance, and reliability under harsh conditions.

Innovation Initiatives:

• Development of halogen-free and environmentally friendly EMC formulations
• Advanced materials for automotive-grade power semiconductors
• R&D focused on next-generation packaging like FOWLP and System-in-Package (SiP)

Download FREE Sample Report: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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9️⃣ 2. Samsung SDI Co., Ltd.

Headquarters: Yongin-si, Gyeonggi-do, South Korea
Key Offering: EMC for Memory Packaging, Power Device EMC, LED Encapsulation EMC

Samsung SDI is a major supplier of Epoxy Mold Compounds, particularly for memory devices and power semiconductors. Leveraging its position within the Samsung Group, the company develops materials optimized for high-density packaging and demanding automotive applications.

Innovation Initiatives:

• Materials supporting high-bandwidth memory (HBM) packaging
• EMC with enhanced thermal conductivity for electric vehicle power modules
• Collaboration with leading semiconductor manufacturers on custom formulations

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8️⃣ 3. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: EME-G Series Granular EMC, Semiconductor Encapsulation Materials

Sumitomo Bakelite is one of the world’s leading manufacturers of semiconductor encapsulation materials. The company pioneered the development of epoxy molding compounds and offers granular EMC known for its excellent flowability, low warpage, and high reliability.

Innovation Initiatives:

• Ultra-low alpha particle EMC for advanced memory devices
• High thermal conductivity materials exceeding 10 W/mK
• Global production network supporting major semiconductor hubs

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7️⃣ 4. Hitachi Chemical Company (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: CEL series EMC, Moldable Underfill Materials, Advanced Packaging EMC

Hitachi Chemical, now part of Showa Denko Materials, offers high-performance granular EMC for various semiconductor packaging applications. Their products are characterized by high purity, excellent adhesion, and superior electrical properties.

Innovation Initiatives:

• Development of low dielectric constant (Dk) materials for high-frequency applications
• EMC solutions for heterogeneous integration and chiplets
• Materials qualified for automotive AEC-Q100 Grade 0 applications

Download FREE Sample Report: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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6️⃣ 5. Hysol (Henkel AG & Co. KGaA)

Headquarters: Düsseldorf, Germany
Key Offering: Loctite EMC solutions, Underfill Materials, Thermal Interface Materials

Henkel’s Hysol brand is a global leader in electronic adhesives and encapsulation materials. The company provides granular EMC solutions that offer exceptional protection for semiconductors in automotive, industrial, and consumer applications.

Innovation Initiatives:

• One-component granular EMC for simplified processing
• Materials with coefficient of thermal expansion (CTE) matching silicon
• Sustainable EMC formulations with reduced environmental impact

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5️⃣ 6. NAMICS Corporation

Headquarters: Niigata, Japan
Key Offering: NXG Series EMC, High Reliability Encapsulants, Underfill Materials

NAMICS specializes in high-performance electronic materials, including granular epoxy mold compounds for advanced semiconductor packaging. The company is renowned for its technical expertise in material science and close collaboration with customers.

Innovation Initiatives:

• Ultra-high purity EMC for sensitive semiconductor devices
• Advanced filler technology for enhanced thermal and mechanical properties
• Custom formulations for specific application requirements

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4️⃣ 7. Kyocera Chemical Corporation

Headquarters: Yamaguchi, Japan
Key Offering: KC Series EMC, Ceramic Packages, Advanced Packaging Materials

Kyocera Chemical offers comprehensive material solutions for electronic packaging, including granular epoxy mold compounds. Leveraging Kyocera’s expertise in ceramics and materials science, the company provides EMC with exceptional reliability and performance.

Innovation Initiatives:

• EMC for high-temperature applications up to 200°C
• Materials optimized for power semiconductor packaging
• Integration of EMC with ceramic substrates for hybrid packages

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3️⃣ 8. Chang Chun Group

Headquarters: Taipei, Taiwan
Key Offering: CCEL Series EMC, PCB Materials, Electronic Chemicals

Chang Chun Group is a major chemical company with significant presence in the electronic materials market. The company’s granular EMC products serve various semiconductor packaging applications, particularly in the Asia-Pacific region.

Innovation Initiatives:

• Expansion of EMC production capacity to meet growing demand
• Development of cost-effective solutions for consumer electronics
• Materials supporting the growing Chinese semiconductor industry

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2️⃣ 9. HHCK Corporation

Headquarters: Seoul, South Korea
Key Offering: Semiconductor EMC, LED Encapsulation Materials, Adhesive Products

HHCK is a specialized chemical company focused on electronic materials, including granular epoxy mold compounds for semiconductor packaging. The company has established a strong position in the Korean semiconductor supply chain.

Innovation Initiatives:

• EMC formulations for wafer-level chip scale packaging (WLCSP)
• Materials with enhanced flame retardancy for safety-critical applications
• Technical support services for package design and material selection

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1️⃣ 10. Jiangsu Zitian Pharmaceutical & Chemical Co., Ltd.

Headquarters: Jiangsu, China
Key Offering: ZT-EMC Series, Epoxy Resins, Electronic Chemical Materials

Jiangsu Zitian is an emerging player in the electronic materials market, producing granular epoxy mold compounds for various semiconductor packaging applications. The company is expanding its presence in the rapidly growing Chinese electronics industry.

Innovation Initiatives:

• Development of domestic EMC solutions for Chinese semiconductor manufacturers
• Cost-competitive materials for consumer electronics applications
• Expansion of production capabilities to serve global markets

Get Full Report Here: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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🚀 Outlook: The Future of Granular EMC Is Smarter and More Advanced

The granular epoxy mold compound market is undergoing significant transformation. While traditional EMC formulations continue to dominate, the industry is investing heavily in advanced material technologies to meet the evolving requirements of next-generation semiconductor packaging.

📈 Key Trends Shaping the Market:

• Increasing adoption of Fan-Out Wafer-Level Packaging (FOWLP) requiring specialized EMC
• Growing demand for high thermal conductivity materials for power electronics
• Development of low dielectric constant EMC for high-frequency 5G and RF applications
• Stringent reliability requirements for automotive and industrial applications

Get Full Report Here: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

The companies listed above are not only supplying essential materials for semiconductor packaging—they’re enabling the technological advancement of modern electronics.