The Global Semiconductor Encapsulation Adhesive Market was valued at US$ 1.85 Billion in 2022 and is projected to reach US$ 2.64 Billion by 2029, growing at a Compound Annual Growth Rate (CAGR) of 5.2% during the forecast period (2023–2029). This growth is being driven by the explosive demand for advanced electronics, the proliferation of 5G and IoT devices, and the accelerating adoption of high-performance materials for protecting sensitive semiconductor components from moisture, thermal stress, and mechanical damage.

As the semiconductor industry pushes the boundaries of miniaturization and performance, the role of high-reliability encapsulation adhesives has become critically important. In this blog, we profile the Top 10 Companies in the Semiconductor Encapsulation Adhesive Industry—a mix of chemical giants, specialty material innovators, and adhesive specialists shaping the future of electronic protection and performance.

---

🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® epoxy, silicone, and polyimide adhesives

Henkel is a global leader in adhesive technologies, offering a comprehensive portfolio of encapsulation solutions for semiconductor packaging. Their products are engineered for superior thermal conductivity, low stress, and high reliability in demanding applications like automotive electronics and advanced IC packages.

Innovation Initiatives:

• Development of low-temperature cure and high-Tg materials

• Advanced formulations for fan-out wafer-level packaging (FOWLP)

• Sustainable adhesive solutions with reduced environmental impact

Download FREE Sample Report: Semiconductor Encapsulation Adhesive Market – View in Detailed Research Report

---

9️⃣ 2. Panasonic Corporation

Headquarters: Kadoma, Osaka, Japan
Key Offering: Thermally conductive epoxy and silicone encapsulants

Panasonic’s Industrial Devices division is a key supplier of high-performance encapsulation adhesives, serving major semiconductor manufacturers worldwide. Their materials are known for excellent moisture resistance and reliability in harsh environments.

Innovation Initiatives:

• Focus on automotive-grade encapsulation materials

• Development of halogen-free and environmentally friendly formulations

---

8️⃣ 3. DELO Industrie Klebstoffe

Headquarters: Windach, Germany
Key Offering: High-precision light-curing and thermally curing adhesives

DELO specializes in high-performance adhesives for microelectronics and optoelectronics. Their encapsulation products offer rapid curing, low shrinkage, and exceptional protection for sensitive semiconductor components.

Innovation Initiatives:

• UV-curing adhesives for high-throughput manufacturing

• Specialized formulations for MEMS and sensor encapsulation

---

7️⃣ 4. Master Bond Inc.

Headquarters: Hackensack, New Jersey, USA
Key Offering: Epoxy, silicone, and UV curing encapsulation compounds

Master Bond manufactures over 3,000 adhesive formulations, with specialized products for semiconductor encapsulation that provide excellent electrical insulation and environmental protection.

Innovation Initiatives:

• One-part and two-part systems for various application methods

• Thermally conductive formulations for power semiconductor devices

---

6️⃣ 5. Nissan Chemical Corporation

Headquarters: Tokyo, Japan
Key Offering: Silica-based and organic polymer encapsulants

Nissan Chemical is a leading supplier of high-purity materials for the semiconductor industry, including encapsulation adhesives with superior planarization and gap-filling capabilities.

Innovation Initiatives:

• Advanced SiO2-based materials for interlayer dielectrics

• Low-k and ultra-low-k dielectric materials for advanced nodes

Download FREE Sample Report: Semiconductor Encapsulation Adhesive Market – View in Detailed Research Report

---

5️⃣ 6. Lord Corporation

Headquarters: Cary, North Carolina, USA
Key Offering: Specialty adhesives and coatings for electronics

Lord Corporation, a Parker Hannifin company, develops advanced encapsulation solutions that provide mechanical shock absorption and thermal management for semiconductor packages.

Innovation Initiatives:

• Thermally conductive interface materials

• Encapsulants for high-vibration and extreme environment applications

---

4️⃣ 7. Ajinomoto Fine-Techno Co., Inc.

Headquarters: Tokyo, Japan
Key Offering: Ajinomoto Build-up Film (ABF) and encapsulation materials

Ajinomoto Fine-Techno is a dominant player in substrate materials, particularly known for their ABF used in flip-chip packages. Their encapsulation adhesives offer excellent reliability for high-density interconnects.

Innovation Initiatives:

• Advanced build-up films for下一代封装技术

• Materials enabling finer line and space capabilities

---

3️⃣ 8. Momentive Performance Materials

Headquarters: Waterford, New York, USA
Key Offering: Silicone-based encapsulation gels and adhesives

Momentive specializes in silicone technology, offering soft encapsulation gels that provide excellent stress relief and protection for delicate semiconductor components and LED packages.

Innovation Initiatives:

• High-refractive-index silicones for optoelectronics

• Thermally conductive silicone formulations

---

2️⃣ 9. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Epoxy molding compounds and encapsulation resins

Sumitomo Bakelite is a major supplier of epoxy molding compounds for semiconductor encapsulation, with products designed for automotive, industrial, and consumer electronics applications.

Innovation Initiatives:

• High-heat-resistant materials for power devices

• Low-stress formulations for large-die packages

---

1️⃣ 10. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Silicone resins and epoxy-based encapsulation materials

Shin-Etsu is the world’s largest manufacturer of silicones and a significant supplier of semiconductor encapsulation materials, known for their high purity and reliability.

Innovation Initiatives:

• High-transparency silicones for optical applications

• Advanced formulations for 3D packaging and heterogeneous integration

Get Full Report Here: Semiconductor Encapsulation Adhesive Market – View in Detailed Research Report

---

🌍 Outlook: The Future of Semiconductor Encapsulation Is Smarter and More Specialized

The semiconductor encapsulation adhesive market is undergoing a fundamental transformation. While epoxy resins continue to dominate in volume, the industry is rapidly adopting specialty silicones, advanced epoxies, and hybrid materials that meet the demanding requirements of next-generation semiconductor packages.

📈 Key Trends Shaping the Market:

• Growing demand for high-thermal-conductivity materials in power electronics

• Development of low-stress encapsulants for large-die and wafer-level packages

• Increasing adoption of halogen-free and environmentally friendly formulations

• Advancements in capillary underfill materials for flip-chip applications

Get Full Report Here: Semiconductor Encapsulation Adhesive Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials to the semiconductor industry—they’re enabling the next generation of electronic innovation.