The Global Die Bonding Film Market was valued at USD 645.8 Million in 2023 and is projected to reach USD 985.2 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.8% during the forecast period (2024–2030). This robust growth is fueled by the relentless expansion of the semiconductor industry, the proliferation of advanced electronics, and the increasing demand for high-performance, miniaturized devices across automotive, consumer electronics, and telecommunications sectors.

As the backbone of modern microelectronic assembly, die bonding films provide critical adhesion for semiconductor dies, ensuring reliability and performance in everything from smartphones to electric vehicles. In this blog, we profile the Top 10 Companies in the Die Bonding Film Market—a group of material science leaders and adhesive specialists driving innovation in semiconductor packaging and assembly worldwide.

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🔟 1. Henkel Adhesives

Headquarters: Düsseldorf, Germany
Key Offering: Non-Conductive Paste (NCP) Films, Conductive Films, High-Temperature Adhesives

Henkel is a global powerhouse in adhesive technologies, providing a comprehensive portfolio of die bonding films for a wide range of semiconductor packaging applications. Their LOCTITE® brand is synonymous with reliability in die attachment for power devices, MEMS sensors, and advanced IC packaging.

Innovation and Market Focus:

• Leading R&D in thermally conductive and electrically insulating films
• Strong focus on materials for automotive-grade electronics and 5G infrastructure
• Global manufacturing and technical support network

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Die Bonding Film Market – View in Detailed Research Report

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9️⃣ 2. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Adwill D-series Die Bonding Films, Non-Conductive Types, UV-curable Films

LINTEC is a major player in the semiconductor materials market, renowned for its Adwill series of die bonding films. The company specializes in high-precision films that enable ultra-thin die stacking and enhance the performance and reliability of semiconductor packages.

Innovation and Market Focus:

• Pioneering developments in film materials for fan-out wafer-level packaging (FOWLP)
• Expansion of product lines to support 3D IC integration
• Strong presence across Asia-Pacific semiconductor supply chains

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8️⃣ 3. Hitachi Chemical (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Anisotropic Conductive Films (ACF), Non-Conductive Adhesives, Epoxy-based Bonding Films

Following its integration into Showa Denko Materials, the former Hitachi Chemical division remains a critical supplier of advanced materials for semiconductor packaging. The company’s die bonding films are essential for applications requiring high thermal stability and electrical performance.

Innovation and Market Focus:

• Expertise in materials for high-power semiconductor devices like IGBTs and SiC modules
• Development of halogen-free and environmentally friendly adhesive films
• Strategic partnerships with major automotive and industrial semiconductor manufacturers

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7️⃣ 4. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Heat-resistant Die Bonding Films, Low Stress Adhesive Films, Laser-reactive Materials

Furukawa Electric leverages its deep expertise in functional materials to produce high-performance die bonding films. Their products are designed to withstand the demanding thermal and mechanical stresses encountered in advanced semiconductor packaging processes.

Innovation and Market Focus:

• Specialization in films for high-brightness LEDs and power semiconductor modules
• Innovation in laser debonding technologies for temporary wafer bonding
• Focus on improving manufacturing yield and package reliability

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Die Bonding Film Market – View in Detailed Research Report

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6️⃣ 5. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: Non-Conductive Films (NCF), Wafer Back Coating Films, Dicing Die Bonding Films (DDF)

Nitto Denko is a leading global manufacturer of precision tapes and films, with a significant footprint in the semiconductor materials sector. Their dicing die bonding films (DDF) integrate the dicing and die attach processes, streamlining manufacturing for high-volume production.

Innovation and Market Focus:

• Market leader in dicing die bonding films for thin-wafer processing
• Development of ultra-thin films for 3D stacked memory and logic devices
• Continuous improvement in film adhesion control and contamination reduction

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5️⃣ 6. LG Chem

Headquarters: Seoul, South Korea
Key Offering: Epoxy Mold Compounds, Conductive Die Attach Films, Thermal Interface Materials

LG Chem, a titan in the chemical industry, applies its material science prowess to the semiconductor sector with a range of advanced die bonding films. The company is strategically expanding its electronic materials division to capture a larger share of the high-growth semiconductor packaging market.

Innovation and Market Focus:

• Investment in R&D for next-generation semiconductor packaging materials
• Focus on high-thermal-conductivity films for power electronics and AI processors
• Vertical integration benefits from its strong petrochemical and advanced materials businesses

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4️⃣ 7. AI Technology, Inc. (AIT)

Headquarters: Princeton Junction, New Jersey, USA
Key Offering: Thermally Conductive Adhesive Films, Flexible Circuit Bonding Films, Low-outgassing Epoxies

AI Technology is a specialized manufacturer of high-performance adhesives and films for demanding electronic applications. The company is known for solving complex bonding challenges in aerospace, defense, and high-reliability industrial electronics.

Innovation and Market Focus:

• Expertise in customized film formulations for extreme environments
• Development of reworkable and void-free bonding films
• Strong focus on materials for heterogenous integration and chiplets

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3️⃣ 8. DuPont (DuPont Electronic Materials)

Headquarters: Wilmington, Delaware, USA
Key Offering: Specialty Die Attach Adhesives, Thermally Conductive Films, Low-Stress Encapsulants

DuPont is a historic leader in materials science, with its Electronic Materials division providing critical solutions for semiconductor manufacturing. Their die bonding films are engineered for high reliability in automotive, medical, and high-frequency applications.

Innovation and Market Focus:

• Pioneering sustainable material solutions for electronics manufacturing
• Development of films with exceptional thermal and mechanical properties for advanced nodes
• Global technical support and co-development partnerships with leading OEMs

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2️⃣ 9. NAMICS Corporation

Headquarters: Niigata, Japan
Key Offering: Anisotropic Conductive Films, Silicone-based Adhesives, Underfill Materials

NAMICS is a specialist chemical company with a strong focus on adhesives and encapsulants for the electronics industry. Their die bonding films are known for high purity and consistency, which are critical for fine-pitch and high-density interconnects.

Innovation and Market Focus:

• Leadership in materials for display driver IC (DDI) bonding and camera module assembly
• Development of low-temperature cure films for heat-sensitive components
• Expansion into films for wearable electronics and IoT devices

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1️⃣ 10. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Epoxy Molding Compounds, Semiconductor Adhesive Films, High-Tg Laminates

Sumitomo Bakelite is a key supplier of high-performance plastics and semiconductor packaging materials. Their die bonding films are integral to packages requiring exceptional moisture resistance, thermal stability, and long-term reliability.

Innovation and Market Focus:

• Extensive expertise in epoxy chemistry for semiconductor encapsulation and adhesion
• Focus on materials for automotive semiconductors with high reliability standards (AEC-Q100)
• Strategic investments to increase production capacity for semiconductor materials

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Die Bonding Film Market – View in Detailed Research Report

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🌍 Outlook: The Future of Die Bonding Film is Smarter and More Integrated

The die bonding film market is undergoing a significant transformation. While traditional epoxy-based films continue to dominate, the industry is rapidly innovating to meet the demands of advanced packaging architectures, heterogeneous integration, and the relentless push for miniaturization.

📈 Key Trends Shaping the Market:

• Accelerated adoption of Dicing Die Bonding Films (DDF) for wafer-level packaging
• Development of films compatible with chiplet-based architectures and 3D integration
• Growing demand for high-thermal-conductivity films to manage heat in power electronics and high-performance computing
• Increasing regulatory focus on green materials, driving development of halogen-free and low-outgassing films

Get Full Report Here:
Die Bonding Film Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials for today’s electronics—they are enabling the next generation of semiconductor innovation that will power the digital transformation across industries.