The Global Non Conductive Chip Adhesive Film Market was valued at USD 250 million in 2024 and is projected to reach USD 420 million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 5.7% during the forecast period (2025–2032). This growth is being driven by the relentless miniaturization of electronics, the global expansion of 5G infrastructure, and the accelerating adoption of advanced semiconductor packaging solutions across consumer, automotive, and industrial sectors.

As the electronics industry evolves toward higher performance and greater integration, the spotlight is on the key material suppliers enabling this progress. In this blog, we profile the Top 10 Companies in the Non Conductive Chip Adhesive Film Industry—a group of specialty chemical giants and advanced materials innovators shaping the future of semiconductor assembly and packaging.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® ABLESTIK® NCF (Non Conductive Film)

Henkel is a global leader in adhesive technologies, and its electronics materials division is a dominant force in the NCF market. The company provides high-performance, non-conductive films designed for precision die-attach in advanced packaging, including fan-out wafer-level packaging (FO-WLP) and 3D IC stacking. Their solutions are critical for applications requiring ultra-fine pitch and high thermal reliability.

Innovation & Application Focus:

• Development of ultra-thin films (under 10µm) for next-generation miniaturization.
• Focus on low-stress, high-thermal-stability formulations for automotive power modules.
• Strategic collaborations with major foundries and OSATs (Outsourced Semiconductor Assembly and Test providers).

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Non Conductive Chip Adhesive Film Market – View in Detailed Research Report

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9️⃣ 2. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: SUMIKON® NCF Series

Sumitomo Bakelite is a premier supplier of semiconductor packaging materials. Its Non Conductive Film offerings are integral to the wafer-level lamination process, providing exceptional insulation and adhesion for leading-edge logic and memory devices. The company is heavily invested in R&D for films compatible with hybrid bonding and thermal compression processes.

Innovation & Application Focus:

• Providing materials for high-density interconnects in high-performance computing (HPC) and AI chips.
• Developing halogen-free and environmentally friendly film variants.
• Expanding production capacity to meet surging demand from advanced packaging lines.

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8️⃣ 3. H.B. Fuller Company

Headquarters: St. Paul, Minnesota, USA
Key Offering: Non Conductive Die Attach Films

H.B. Fuller’s advanced electronics adhesives segment offers robust non-conductive film solutions that ensure reliable, void-free bonding in sensitive applications. The company leverages its polymer science expertise to create films that withstand the harsh thermal cycling required in automotive and industrial electronics.

Innovation & Application Focus:

• Tailored formulations for power device packaging and sensor integration.
• Focus on processability, enabling high throughput in manufacturing.
• Commitment to developing sustainable adhesive chemistries.

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7️⃣ 4. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Silicone and Specialty Non Conductive Adhesive Films

Shin-Etsu Chemical, a global leader in silicon-based products, offers unique non-conductive adhesive film solutions that leverage silicone chemistry. These films provide excellent flexibility, moisture resistance, and thermal stability, making them ideal for applications in LEDs, automotive sensors, and devices exposed to challenging environments.

Innovation & Application Focus:

• Specialization in films for LED packaging and COB (Chip-on-Board) applications.
• Developing materials with low modulus to absorb stress in large-die applications.
• Expanding product lines to support the growth of wide-bandgap semiconductor packaging.

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6️⃣ 5. Showa Denko Materials Co., Ltd. (SDK)

Headquarters: Tokyo, Japan
Key Offering: Non Conductive Die Bonding Films

As part of the Resonac Group, Showa Denko Materials is a key enabler of advanced electronics packaging. Its non-conductive films are engineered for high-speed lamination processes and offer superior reliability for fine-pitch semiconductor devices, playing a crucial role in the smartphone and data center supply chains.

Innovation & Application Focus:

• Focus on compatibility with mass-scale panel-level packaging (PLP) technologies.
• Providing comprehensive material sets that include films, underfills, and molding compounds.
• Targeting applications in 5G mmWave modules and advanced CMOS image sensors.

Download FREE Sample Report:
Non Conductive Chip Adhesive Film Market – View in Detailed Research Report

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5️⃣ 6. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: NITTO™ Non Conductive Adhesive Films

Nitto Denko is a diversified materials company with a strong presence in functional films. Its electronics division produces high-precision non-conductive adhesive films used in semiconductor packaging and component assembly. The company is known for its mastery of thin-film coating and slitting technologies, producing consistent and reliable materials.

Innovation & Application Focus:

• Developing ultra-smooth, low-dielectric-constant films for high-frequency applications.
• Investing in roll-to-roll manufacturing for cost-effective, high-volume production.
• Expanding into films for flexible and wearable electronics substrates.

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4️⃣ 7. AI Technology, Inc.

Headquarters: Princeton, New Jersey, USA
Key Offering: AIT-CF™ Customizable Chip Film Adhesives

AI Technology specializes in high-reliability, custom-formulated adhesives for demanding applications. The company offers a range of non-conductive chip adhesive films that can be tailored for specific thermal, mechanical, and processing requirements, serving niche markets in aerospace, defense, and medical electronics.

Innovation & Application Focus:

• Expertise in formulating high-glass-transition-temperature (Tg) films for extreme environments.
• Providing rapid prototyping and small-batch production for R&D and low-volume, high-mix manufacturing.
• Developing films that cure at lower temperatures to protect sensitive components.

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3️⃣ 8. Kyocera Corporation

Headquarters: Kyoto, Japan
Key Offering: Advanced Ceramic and Film Packaging Solutions

While Kyocera is widely known for its ceramics, its components division develops sophisticated materials for semiconductor packaging. Its non-conductive adhesive films are part of a broader ecosystem of packaging solutions, often designed to work seamlessly with its ceramic substrates for superior thermal and mechanical performance.

Innovation & Application Focus:

• Integrating film adhesive technology with ceramic packages for power semiconductor modules.
• Focus on materials for automotive-grade reliability and longevity.
• Leveraging vertical integration to ensure material consistency and supply chain security.

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2️⃣ 9. Caplinq Europe B.V.

Headquarters: Amsterdam, Netherlands
Key Offering: Specialty Semiconductor Bonding Films and Tapes

Caplinq operates as a specialized distributor and manufacturer of high-tech materials. The company sources and supplies high-performance non-conductive adhesive films from leading Asian producers to the European and North American markets, serving the needs of specialized fabs and R&D centers with critical, high-quality materials.

Innovation & Application Focus:

• Bridging the supply gap for high-end film adhesives in Western markets.
• Providing technical support and custom die-cutting services for prototype and pilot production.
• Focus on supplying materials for micro-electromechanical systems (MEMS) and sensor packaging.

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1️⃣ 10. Permabond (A Part of Arkema Group)

Headquarters: Montataire, France
Key Offering: Engineering Adhesive Films for Electronics

Permabond, backed by the global chemical giant Arkema, offers a range of non-conductive film adhesives based on epoxy, acrylic, and other chemistries. Their products are used in a variety of electronics assembly applications where strong, reliable, and insulating bonds are required for components like sensors and small chips.

Innovation & Application Focus:

• Providing versatile film formats, including B-stage thermoset films for precise bonding.
• Developing UV-curable and thermal-cure films for different manufacturing process flows.
• Emphasizing ease of handling and processing for cost-sensitive, high-volume consumer electronics assembly.

Get Full Report Here:
Non Conductive Chip Adhesive Film Market – View in Detailed Research Report

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🌍 Outlook: The Future of Semiconductor Assembly is Smarter and More Integrated

The non-conductive chip adhesive film market is undergoing a significant transformation. As traditional wire-bonding gives way to heterogeneous integration and 3D stacking, these films are becoming indispensable. The industry is investing heavily in material science innovations, process optimization, and supply chain resilience to support the next wave of electronic devices, from smarter vehicles to ambient IoT.

📈 Key Trends Shaping the Market:

• Accelerated R&D in films for hybrid bonding, a key technology for chiplet-based architectures.
• Growing demand for ultra-thin, low-dielectric-loss films for high-frequency 5G/6G and RF applications.
• Increased focus on sustainable and green chemistry in adhesive formulations.
• Vertical integration and strategic partnerships between material suppliers and semiconductor manufacturers to co-develop next-generation solutions.

Get Full Report Here:
Non Conductive Chip Adhesive Film Market – View in Detailed Research Report

The companies listed above are not merely supplying materials—they are providing the foundational technologies that enable the continued evolution of Moore’s Law and the seamless connectivity of the modern world.