The Global Low Profile Copper Foil for High-frequency and High-speed Materials Market was valued at USD 1.9 Billion in 2023 and is projected to reach USD 3.2 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 7.8% during the forecast period (2024–2030). This robust growth is driven by the escalating demand for high-performance printed circuit boards (PCBs) in 5G infrastructure, advanced automotive electronics, and high-speed computing applications.

As the electronics industry pushes the boundaries of speed and frequency, the fundamental materials enabling these advancements are gaining critical importance. Low profile copper foil, with its ultra-smooth surface and minimal roughness, is essential for minimizing signal loss and maintaining signal integrity in high-frequency circuits. In this blog, we profile the Top 10 Companies in the Low Profile Copper Foil Industry— a group of specialized manufacturers and global material suppliers shaping the future of electronic connectivity.

Download FREE Sample Report: Low Profile Copper Foil for High-frequency and High-speed Materials Market – View in Detailed Research Report

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🔟 1. Mitsui Mining & Smelting Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: HVLP (Very Low Profile) and Ultra-Low Profile (ULP) Copper Foils

Mitsui Kinzoku is a global leader in advanced copper foil technology, renowned for its high-purity, ultra-thin foils essential for high-frequency applications. The company’s products are integral to 5G base station antennas, server motherboards, and automotive radar systems, where signal integrity is paramount.

Innovation and R&D Initiatives:

• Pioneering development of foils with surface roughness (Rz) below 1.5 micrometers

• Strong focus on foil treatments for enhanced bonding strength with polyimide and other advanced laminates

• Expansion of production capacity to meet surging demand from the telecommunications sector

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9️⃣ 2. Fukuda Metal Foil & Powder Co., Ltd.

Headquarters: Kyoto, Japan
Key Offering: Electrolytic Copper Foil, RTF (Reverse Treated Foil)

Fukuda is a specialist manufacturer with a long history of producing high-quality copper foils. The company’s RTF products are specifically engineered for high-speed digital circuits, offering excellent thermal stability and low dielectric loss, which are critical for next-generation communication equipment.

Innovation and R&D Initiatives:

• Advanced surface treatment technologies to reduce signal attenuation

• Customized foil solutions for Flexible Copper Clad Laminates (FCCL)

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8️⃣ 3. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: HVLP Foil, Low-profile Electrodeposited Copper Foil

Furukawa Electric leverages its expertise in materials science to produce copper foils that meet the stringent requirements of high-frequency PCBs. Their foils are widely used in automotive ADAS (Advanced Driver-Assistance Systems) and high-performance computing hardware.

Innovation and R&D Initiatives:

• Development of foils with ultra-low surface profile for millimeter-wave applications

• Investment in sustainable manufacturing processes and recycling technologies

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7️⃣ 4. Circuit Foil Luxembourg S.A.

Headquarters: Bascharage, Luxembourg
Key Offering: VLP (Very Low Profile) and HVLP (Hyper Very Low Profile) Copper Foils

As a key European producer, Circuit Foil supplies high-performance copper foils to the global PCB industry. The company’s products are critical for applications requiring high-speed data transmission, such as network switches and data center infrastructure.

Innovation and R&D Initiatives:

• Specialization in foils for high-Tg (glass transition temperature) laminates

• Focus on consistency and high yield strength for reliable PCB fabrication

Download FREE Sample Report: Low Profile Copper Foil for High-frequency and High-speed Materials Market – View in Detailed Research Report

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6️⃣ 5. ILJIN Materials Co., Ltd.

Headquarters: Seoul, South Korea
Key Offering: ULP (Ultra Low Profile) Copper Foil, Battery Copper Foil

ILJIN Materials is a major South Korean player with a significant global market share. While also a key supplier for lithium-ion batteries, its dedicated line of ULP foils for high-frequency materials is essential for the country’s thriving electronics and 5G equipment manufacturing sector.

Innovation and R&D Initiatives:

• Continuous investment in R&D to further reduce foil profile for 6G readiness

• Strategic partnerships with global PCB and laminate manufacturers

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5️⃣ 6. Nan Ya Plastics Corporation

Headquarters: Taipei, Taiwan
Key Offering: Electrolytic Copper Foil, Reverse Treated Foil (RTF)

As part of the Formosa Plastics Group, Nan Ya Plastics possesses integrated production capabilities from raw materials to finished foil. This vertical integration allows for stringent quality control and cost-effective production of low-profile foils for a wide range of high-speed applications.

Innovation and R&D Initiatives:

• Expansion of high-end foil production capacity to serve the server and automotive markets

• Development of anti-corrosion treatments for enhanced foil longevity

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4️⃣ 7. Chang Chun Group

Headquarters: Taipei, Taiwan
Key Offering: VLP Copper Foil, High-Temperature Elongation Foil

Chang Chun Group is a diversified chemical company with a strong presence in the copper foil market. Its products are known for their dimensional stability and reliability, making them suitable for complex, multi-layer PCBs used in advanced telecommunications equipment.

Innovation and R&D Initiatives:

• Focus on developing foils compatible with low-loss dielectric materials like PTFE

• R&D into copper foils for IC substrates and advanced packaging

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3️⃣ 8. LCY TECHNOLOGY CORP.

Headquarters: Kaohsiung, Taiwan
Key Offering: HVLP Copper Foil, RTF Foil

LCY Technology is a dedicated copper foil manufacturer with a focus on the high-end segment. The company’s technological expertise lies in creating foils that enable higher data rates with minimal insertion loss, a key requirement for modern high-speed digital designs.

Innovation and R&D Initiatives:

• Specialized surface treatments to improve adhesion with high-frequency laminates

• Active pursuit of certifications for automotive and aerospace applications

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2️⃣ 9. Co-tech Development Corporation

Headquarters: Taoyuan, Taiwan
Key Offering: Low Profile Electrodeposited Copper Foil

Co-tech is another leading Taiwanese manufacturer with a significant global footprint. The company supplies a broad portfolio of copper foils, with its low-profile variants being critical for manufacturers of high-performance computing and networking hardware.

Innovation and R&D Initiatives:

• Investment in advanced rolling and electrodeposition technologies

• Development of thinner foils (below 9µm) for miniaturized electronic devices

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1️⃣ 10. Kingboard Holdings Limited (via its foil divisions)

Headquarters: Hong Kong
Key Offering: Full range of copper foils including VLP and HVLP grades

While Kingboard is a conglomerate with interests in laminates and chemicals, its copper foil production arm is a major force in the market. The company supplies foils to PCB manufacturers worldwide, with a growing emphasis on high-speed, low-loss materials to keep pace with industry trends.

Innovation and R&D Initiatives:

• Integrated supply chain from copper foil to laminate, offering bundled solutions

• Continuous improvement of foil properties to reduce transmission loss at higher frequencies

Get Full Report Here: Low Profile Copper Foil for High-frequency and High-speed Materials Market – View in Detailed Research Report

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🔬 Outlook: The Future of Electronics is Faster and More Connected

The low profile copper foil market is at the heart of the digital transformation. As data rates continue to climb with the rollout of 5G-Advanced and the early research into 6G, the demand for materials that can minimize signal loss will only intensify.

📈 Key Trends Shaping the Market:

• Transition to Higher Frequencies: The shift towards millimeter-wave spectrum in 5G and beyond requires foils with exceptionally smooth surfaces to manage signal integrity.

• Advanced Packaging and Heterogeneous Integration: The growth of advanced packaging techniques like Fan-Out and 3D ICs creates new demands for thin, reliable copper foils for interconnects.

• Automotive Electrification and Autonomy: The proliferation of sensors, radars, and high-speed in-vehicle networks in electric and autonomous vehicles is a major growth driver.

• Supply Chain Diversification: Geopolitical factors are prompting electronics manufacturers to diversify their sources of key materials like copper foil, benefiting suppliers in regions outside of traditional hubs.

The companies listed above are not just supplying a raw material; they are providing the foundational elements that enable the high-speed, low-latency connectivity defining the future of technology.

Get Full Report Here: Low Profile Copper Foil for High-frequency and High-speed Materials Market – View in Detailed Research Report