The Global SiC Thinning Grinding Wheel Market was valued at USD 379.1 Million in 2025 and is projected to reach USD 598.4 Million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 6.8% during the forecast period (2025–2032). This robust growth is fueled by the relentless demand for thinner semiconductor wafers in advanced packaging, the rapid expansion of 5G and IoT technologies, and increasing adoption of silicon carbide in electric vehicles and renewable energy systems.

As the semiconductor industry pushes the boundaries of miniaturization and performance, the precision of wafer thinning becomes a critical bottleneck. In this blog, we profile the Top 10 Companies in the SiC Thinning Grinding Wheel Industry—a group of precision engineering specialists and materials scientists who are enabling the production of next-generation electronic devices.

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🔟 1. Disco Corporation

Headquarters: Tokyo, Japan
Key Offering: Metal Bonded Wheels, Resin Bonded Wheels, Ultra-Precision Grinding Systems

Disco Corporation stands as the undisputed global leader in precision cutting and grinding equipment, including SiC thinning grinding wheels. The company’s deep integration of wheel manufacturing with precision machinery gives it a significant competitive edge, allowing for optimized performance and reliability. Disco’s products are considered the industry gold standard, trusted by leading semiconductor fabs worldwide for their consistency and ability to handle advanced node processes.

Technological Innovations:

• Patented bonding technologies for extended wheel life and reduced sub-surface damage

• Integrated grinding and dicing solutions (DBG Process) for ultra-thin wafers

• Continuous R&D investment exceeding 8% of annual revenue

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9️⃣ 2. Asahi Diamond Industrial Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Diamond and CBN Wheels, Electroplated Wheels, Custom Bond Formulations

Asahi Diamond Industrial is a world-renowned manufacturer of diamond and CBN tools, with a formidable presence in the semiconductor thinning segment. The company leverages its extensive expertise in super-abrasive materials to produce grinding wheels that deliver exceptional precision for SiC, silicon, and other hard, brittle materials. Asahi’s strong focus on material science enables it to develop specialized bond systems tailored to specific customer applications.

Technological Innovations:

• Development of high-porosity vitrified bonds for improved cooling and chip removal

• Advanced grain technology for consistent cutting performance and surface finish

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8️⃣ 3. Meister Abrasives AG

Headquarters: Romanshorn, Switzerland
Key Offering: High-Performance Diamond Wheels, CBN Grinding Tools, Technical Ceramics Solutions

Meister Abrasives is a leading European specialist in high-precision diamond and CBN grinding tools. While serving various industries, the company has a strong foothold in the semiconductor sector, providing SiC thinning wheels known for their Swiss precision and quality. Meister focuses on high-value, application-specific solutions, often collaborating closely with customers to solve complex machining challenges.

Technological Innovations:

• Precision dressing technologies for maintaining wheel profile accuracy

• Specialized wheel designs for stress-relief grinding processes

Download FREE Sample Report:
Global SiC Thinning Grinding Wheel Market – View in Detailed Research Report

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7️⃣ 4. Allied Material Corporation (Sumitomo Electric Industries)

Headquarters: Itami, Japan
Key Offering: Sintered Metal Bond Wheels, Resinoid Bond Wheels, Porous Vitrified Bonds

As part of the Sumitomo Electric group, Allied Material Corporation benefits from vast resources and R&D capabilities in advanced materials. The company produces a comprehensive range of super-abrasive grinding tools, with its SiC thinning wheels being particularly recognized for their durability and performance in high-volume semiconductor manufacturing environments. Their position within the supply chain of a major industrial conglomerate provides significant advantages in raw material sourcing and technological development.

Technological Innovations:

• Development of nano-polycrystalline diamond abrasives for superior wear resistance

• Integration with Sumitomo’s broader semiconductor materials portfolio

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6️⃣ 5. Tokyo Diamond Tools Mfg. Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Diamond Wheels, Diamond Dressers, Custom Grinding Solutions

Tokyo Diamond Tools is a key Japanese player with a long history of manufacturing precision diamond tools. The company’s SiC thinning grinding wheels are engineered for applications requiring high accuracy and surface integrity. Tokyo Diamond Tools has built a strong reputation for reliability and technical support, serving a loyal customer base in Japan and across Asia.

Technological Innovations:

• Focus on wheels for large-diameter wafer processing (200mm/300mm)

• Development of hybrid bond systems combining the benefits of metal and resin bonds

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5️⃣ 6. Kinik Company

Headquarters: New Taipei City, Taiwan
Key Offering: Diamond Grinding Wheels, CBN Wheels, Grinding Segments

Kinik Company is a major Taiwanese manufacturer of grinding and cutting tools, with a growing presence in the precision semiconductor market. The company offers a cost-effective alternative to the dominant Japanese suppliers while maintaining a strong commitment to quality. Kinik’s strategic location in Taiwan, a global semiconductor hub, provides it with excellent access to key customers and a deep understanding of market needs.

Technological Innovations:

• Expansion of production capacity for fine and ultra-fine grain wheels

• Investment in automated manufacturing to ensure product consistency

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4️⃣ 7. Henan Moresuperhard Materials Co., Ltd.

Headquarters: Zhengzhou, China
Key Offering: Synthetic Diamond Abrasives, Metal Bond Grinding Wheels, Electroplated Tools

Henan Moresuperhard is a leading Chinese producer of synthetic diamond materials and super-abrasive tools. The company has vertically integrated operations, from diamond synthesis to final tool manufacturing, which allows for tight cost control. It is increasingly focusing on the high-value semiconductor tooling market, leveraging China’s growing domestic semiconductor industry.

Technological Innovations:

• In-house production of high-purity diamond abrasives

• Development of wheels tailored for the Chinese semiconductor supply chain

Download FREE Sample Report:
Global SiC Thinning Grinding Wheel Market – View in Detailed Research Report

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3️⃣ 8. Zhengzhou Qisheng Precision Manufacturing Co., Ltd.

Headquarters: Zhengzhou, China
Key Offering: Precision Grinding Wheels, Diamond Dicing Blades, Custom Tooling

Zhengzhou Qisheng is a specialized manufacturer focusing on precision tools for the electronics and semiconductor industries. The company has built expertise in producing grinding wheels for brittle materials like silicon carbide and sapphire. Its strategy is centered on providing responsive service and customized solutions to meet the specific requirements of its customers, particularly within the burgeoning Asian market.

Technological Innovations:

• Capability for small-batch, custom wheel production

• Focus on improving grinding efficiency and reducing total cost of ownership

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2️⃣ 9. NDS

Headquarters: Hsinchu, Taiwan
Key Offering: Diamond Grinding Wheels, Dicing Blades, Reclaim Services

NDS (Nippon Dendo Shoji) has a significant operational presence in Taiwan, a critical region for semiconductor manufacturing. The company provides a range of precision grinding and dicing tools to major foundries and OSAT (Outsourced Semiconductor Assembly and Test) providers. NDS leverages its proximity to customers to offer rapid technical support and logistics, which is a key advantage in the fast-paced semiconductor industry.

Technological Innovations:

• Strong focus on wheels for backgrinding and thinning applications

• Partnerships with equipment manufacturers for integrated solutions

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1️⃣ 10. Henan Keen Superhard Materials Technology Co., Ltd.

Headquarters: Zhengzhou, China
Key Offering: Diamond Powder, Metal/Ceramic Bond Wheels, Electroplated Tools

Henan Keen Superhard is another prominent Chinese company in the super-abrasives space. It produces both the raw diamond materials and the finished grinding tools. The company is aggressively expanding its portfolio to include higher-value products for the semiconductor industry, competing on price and aiming to capture market share as China’s semiconductor capabilities mature.

Technological Innovations:

• Investment in R&D for finer grit sizes and more consistent diamond quality

• Expansion of product lines to address the full wafer fabrication process

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Global SiC Thinning Grinding Wheel Market – View in Detailed Research Report

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🌍 Outlook: The Future of SiC Thinning is Smarter and More Integrated

The SiC thinning grinding wheel market is undergoing a significant technological evolution. While precision mechanical thinning remains fundamental, the future lies in smarter, more integrated processes that minimize damage and maximize yield.

📈 Key Trends Shaping the Market:

• Shift towards ultra-fine grit sizes and advanced bond materials for near-mirror surface finishes

• Integration of grinding with hybrid processes like laser ablation and CMP in cluster tools

• Growing demand for wheels compatible with larger wafer diameters (300mm and beyond)

• Increasing emphasis on total cost of ownership, driving innovations in wheel longevity and performance

Get Full Report Here:
Global SiC Thinning Grinding Wheel Market – View in Detailed Research Report

The companies listed above are not only supplying essential tools for manufacturing—they are enabling the miniaturization and performance gains that define the future of electronics.