The Global Epoxy Molding Compound (EMC) for Advanced Packaging Market was valued at US$ 598 Million in 2025 and is projected to reach US$ 941 Million by 2034, growing at a Compound Annual Growth Rate (CAGR) of 6.9% during the forecast period (2024–2034). This robust growth is primarily fueled by the escalating demand for high-performance semiconductors, the proliferation of artificial intelligence (AI) and 5G technologies, and the accelerating adoption of advanced packaging solutions like Fan-Out Wafer-Level Packaging (FOWLP) and System-in-Package (SiP).

As the electronics industry strives for greater miniaturization, enhanced thermal performance, and superior reliability, the spotlight falls on the key material suppliers who are driving innovation at the molecular level. In this blog, we profile the Top 10 Companies in the Epoxy Molding Compound for Advanced Packaging Industry—a mix of chemical giants, specialized material science leaders, and regional champions shaping the future of electronic encapsulation.

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Epoxy Molding Compound (EMC) for Advanced Packaging Market – View in Detailed Research Report

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🔟 1. Resonac Corporation (formerly Showa Denko)

Headquarters: Tokyo, Japan
Key Offering: High-purity, Low-alpha EMCs for BGA, FCBGA, and FOWLP

Resonac stands as a global powerhouse in advanced semiconductor materials, offering a comprehensive portfolio of EMCs engineered for leading-edge packaging technologies. Their products are renowned for exceptional reliability, low moisture absorption, and superior flow properties critical for filling intricate and dense interconnects.

Innovation & Market Focus:

• Development of low thermal expansion coefficient (LTEC) EMCs for large-body packages
• Advanced halogen-free and low-stress formulations
• Strategic focus on materials for AI, HPC (High-Performance Computing), and automotive applications

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9️⃣ 2. Eternal Materials Co., Ltd.

Headquarters: Kaohsiung, Taiwan
Key Offering: Solid and Liquid EMCs for QFN, SiP, and Discrete Devices

Eternal Materials is a leading supplier of electronic chemicals with a significant market share in Asia-Pacific. The company provides a wide array of EMC solutions tailored for various applications, from consumer electronics to automotive power modules, emphasizing cost-effectiveness and performance.

Innovation & Market Focus:

• Expansion of production capacity to meet surging demand
• Focus on high thermal conductivity compounds for power semiconductor packaging
• Strong presence in the Chinese and Southeast Asian markets

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8️⃣ 3. Panasonic Industry Co., Ltd.

Headquarters: Kadoma, Osaka, Japan
Key Offering: Specialty EMCs for Automotive, High-Frequency Applications

Leveraging its vast electronics expertise, Panasonic Industry develops high-performance EMCs that meet the stringent requirements of the automotive and industrial sectors. Their materials are designed for high-temperature stability, excellent adhesion, and resistance to harsh environmental conditions.

Innovation & Market Focus:

• EMCs compliant with AEC-Q100 automotive standards
• Materials optimized for high-frequency 5G mmWave applications
• Integration of functional fillers for enhanced performance

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7️⃣ 4. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: High-reliability EMCs for Advanced SiP and MEMS Packaging

With a long history in phenolic and epoxy resins, Sumitomo Bakelite is a key innovator in encapsulation materials. The company’s EMCs are critical for protecting sensitive MEMS sensors, image sensors, and complex SiP modules found in smartphones and IoT devices.

Innovation & Market Focus:

• Pioneering low warpage and low chloride EMCs
• Development of transparent EMCs for optical sensors
• Strong R&D focus on next-generation packaging architectures

Download FREE Sample Report:
Epoxy Molding Compound (EMC) for Advanced Packaging Market – View in Detailed Research Report

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6️⃣ 5. Kyocera Chemical Corporation

Headquarters: Yamaguchi, Japan
Key Offering: High Thermal Conductivity EMCs for Power Devices

Kyocera leverages its ceramic expertise to develop EMCs with exceptional thermal management properties. Their products are essential for packaging power semiconductors, such as IGBTs and MOSFETs, used in electric vehicles and renewable energy systems, where heat dissipation is paramount.

Innovation & Market Focus:

• Leading provider of EMCs with thermal conductivity exceeding 3 W/mK
• Focus on large-area molding compounds for power modules
• Materials designed for high voltage isolation and reliability

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5️⃣ 6. Samsung SDI Co., Ltd.

Headquarters: Yongin-si, Gyeonggi-do, South Korea
Key Offering: EMCs for Memory Packaging and Consumer Electronics

As part of the Samsung conglomerate, Samsung SDI has a strategic position in supplying materials for the company’s vast electronics production. Their EMCs are optimized for packaging memory chips and application processors, focusing on high yield and miniaturization.

Innovation & Market Focus:

• Vertical integration within the Samsung supply chain
• Development of ultrafine filler technology for thin-profile packages
• Focus on materials supporting high-bandwidth memory (HBM) packaging

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4️⃣ 7. Hysol Huawei Electronics Co., Ltd.

Headquarters: Jiangyin, Jiangsu, China
Key Offering: Cost-Competitive EMCs for a Broad Range of Applications

Hysol Huawei Electronics is a major Chinese player specializing in epoxy molding compounds for the domestic and international markets. The company offers a diverse product portfolio catering to standard and advanced packages, with a strong emphasis on manufacturing efficiency.

Innovation & Market Focus:

• Rapid scaling of production to serve China’s growing semiconductor industry
• Development of green, environmentally friendly EMC formulations
• Competitive pricing strategy for mass-market applications

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3️⃣ 8. Jiangsu HHCK Advanced Materials Co., Ltd.

Headquarters: Changzhou, Jiangsu, China
Key Offering: Specialty EMCs for LED Packaging and Discrete Semiconductors

Jiangsu HHCK is a specialized manufacturer focusing on high-performance EMCs for niche applications, including LED packaging where high reflectivity and thermal stability are critical. The company is increasingly targeting the advanced packaging segment with new product developments.

Innovation & Market Focus:

• Expertise in high-reflectivity white EMCs for LED applications
• Investment in R&D for low-stress molding compounds
• Expansion into packaging materials for optoelectronics

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2️⃣ 9. Shanghai Doitech Fine Chemical Co., Ltd.

Headquarters: Shanghai, China
Key Offering: Liquid EMCs and Underfill Materials

Shanghai Doitech specializes in liquid epoxy formulations, including liquid molding compounds and capillary underfill materials essential for flip-chip packages and other advanced interconnects. Their expertise lies in materials with precise flow characteristics and fast cure times.

Innovation & Market Focus:

• Specialization in liquid encapsulation solutions for fine-pitch applications
• Development of fast-curing underfills for high-throughput manufacturing
• Serving a growing base of domestic Chinese semiconductor fabs and OSATs

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1️⃣ 10. Beijing Sinotech Electronic Material Co., Ltd.

Headquarters: Beijing, China
Key Offering: EMCs for RF and Microwave Applications

Beijing Sinotech focuses on developing EMCs with specific dielectric properties for radio frequency (RF) and microwave semiconductor packages. Their materials are critical for 5G infrastructure, automotive radar, and communication devices where signal integrity is a top priority.

Innovation & Market Focus:

• Materials with low dielectric constant (Dk) and low dissipation factor (Df)
• Focus on supporting China’s push for self-sufficiency in key semiconductor materials
• Collaboration with research institutions for next-gen material development

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Epoxy Molding Compound (EMC) for Advanced Packaging Market – View in Detailed Research Report

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🌍 Outlook: The Future of EMC is Smarter, Cooler, and More Integrated

The Epoxy Molding Compound market is undergoing a significant transformation, evolving from a basic protective material to a critical enabler of performance. As package architectures become more complex and power densities increase, material properties like thermal conductivity, coefficient of thermal expansion (CTE) matching, and electrical characteristics are paramount.

📈 Key Trends Shaping the Market:

• Accelerated adoption of FOWLP and FOPLP for heterogeneous integration
• Rising demand for high thermal conductivity EMCs (>4 W/mK) for power electronics in EVs and data centers
• Development of low-loss materials for high-frequency 5G and millimeter-wave applications
• Increased regulatory and industry focus on halogen-free and sustainable “green” EMC formulations

Get Full Report Here:
Epoxy Molding Compound (EMC) for Advanced Packaging Market – View in Detailed Research Report

The companies listed above are not only supplying essential materials—they are at the forefront of enabling the next generation of electronic innovation, from AI accelerators to the connected, electric vehicles of tomorrow.