The Global Semiconductor Die Encapsulants Market was valued at USD 2.85 Billion in 2025 and is projected to reach USD 4.12 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 7.6% during the forecast period (2024–2030). This robust growth is being driven by the relentless expansion of the electronics sector, the proliferation of IoT devices, the automotive electronics revolution, and the critical need for advanced packaging solutions that ensure reliability and longevity of semiconductor components.

As the demand for smaller, faster, and more powerful electronic devices intensifies, the role of die encapsulants in protecting delicate semiconductor dies from moisture, contaminants, and mechanical stress has become paramount. In this blog, we profile the Top 10 Companies in the Semiconductor Die Encapsulants Industry—a mix of chemical giants, material science innovators, and specialty manufacturers that are defining the standards for performance and protection in the microelectronics world.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Loctite® E-20-series, Hysol® ECCOBOND® encapsulants

Henkel is a global leader in adhesive technologies, and its electronics portfolio includes a comprehensive range of high-performance semiconductor die encapsulants. These materials are engineered for exceptional thermal stability, low stress, and superior protection in demanding applications from automotive to consumer electronics.

Innovation and R&D Focus:

• Development of low-outgassing and ultra-low alpha particle emitting materials for high-reliability applications

• Advanced formulations for fan-out wafer-level packaging (FOWLP) and 2.5D/3D IC packaging

• Global technical support and customization services for major foundries and OSATs (Outsourced Semiconductor Assembly and Test providers)

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9️⃣ 2. DuPont de Nemours, Inc.

Headquarters: Wilmington, Delaware, USA
Key Offering: DuPont™ E&I materials, including specialty epoxy and silicone encapsulants

DuPont’s Electronics & Industrial (E&I) segment is a cornerstone of the semiconductor materials market. Their encapsulant solutions are renowned for high purity, excellent electrical insulation, and reliability under extreme thermal cycling, serving the most advanced logic and memory chip manufacturers.

Innovation and R&D Focus:

• Pioneering high thermal conductivity encapsulants for power semiconductor devices

• Sustainable material development with a focus on reduced environmental impact

• Collaborative R&D with leading semiconductor companies on next-generation packaging architectures

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8️⃣ 3. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: KER-2500 series silicone gels, epoxy molding compounds (EMCs)

Shin-Etsu is a world-leading manufacturer of semiconductor silicon wafers and essential electronic materials. Their silicone-based die encapsulants and EMCs offer superb flexibility, humidity resistance, and long-term stability, making them ideal for automotive and industrial power modules.

Innovation and R&D Focus:

• Leading in silicone gel technology for stress-sensitive power devices like IGBTs and MOSFETs

• Expansion of high-refractive-index materials for LED encapsulation

• Continuous improvement of flame-retardant properties in epoxy molding compounds

Download FREE Sample Report: Semiconductor Die Encapsulants Market – View in Detailed Research Report

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7️⃣ 4. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Epoxy molding compounds (EMCs), Granite® series encapsulants

Sumitomo Bakelite is a specialist in high-performance plastics and phenolic resins, with a strong focus on semiconductor encapsulation materials. Their products are critical for protecting memory chips, microprocessors, and sensors from physical and environmental damage.

Innovation and R&D Focus:

• Development of low thermal expansion coefficient (LTEC) EMCs to minimize package warpage

• Halogen-free and antimony-free green materials compliant with global environmental regulations (e.g., RoHS, REACH)

• Materials optimized for advanced packaging techniques like Chip-on-Wafer-on-Substrate (CoWoS)

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6️⃣ 5. Hitachi Chemical Company (part of Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Epoxy molding compounds, underfill materials, liquid encapsulants

As part of Showa Denko Materials, Hitachi Chemical brings decades of expertise in material science to the semiconductor industry. Their encapsulants are known for high reliability, low ionic impurity levels, and excellent flow properties for complex mold designs.

Innovation and R&D Focus:

• Advanced underfill encapsulants for flip-chip packages and high-density interconnects

• Thermal interface materials (TIMs) integrated with encapsulation solutions

• Focus on materials for harsh-environment applications in aerospace and defense

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5️⃣ 6. Panasonic Corporation

Headquarters: Kadoma, Osaka, Japan
Key Offering: Panasonic® conductive pastes, epoxy and silicone encapsulants

Panasonic’s Industrial Devices division supplies a wide array of electronic materials, including specialized die encapsulants. Their solutions are tailored for high-volume manufacturing, offering fast cure times and consistent performance for consumer electronics and automotive systems.

Innovation and R&D Focus:

• Integration of passive components within encapsulation materials

• Development of low-stress encapsulants for large-die and thin-wafer applications

• Materials supporting the miniaturization trend in mobile and wearable devices

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4️⃣ 7. Nagase & Co., Ltd.

Headquarters: Osaka, Japan
Key Offering: DENATITE® series epoxy resins and encapsulants

Nagase is a prominent specialty chemical company with a strong presence in electronic materials. Their DENATITE® product line includes high-purity encapsulants designed for superior electrical performance and moisture resistance in sensitive semiconductor packages.

Innovation and R&D Focus:

• Custom-formulated encapsulants for specific customer and application requirements

• Focus on materials with high glass transition temperatures (Tg) for improved thermal performance

• Expansion of product portfolio for gallium nitride (GaN) and silicon carbide (SiC) power devices

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3️⃣ 8. BASF SE

Headquarters: Ludwigshafen, Germany
Key Offering: Elastosil® silicone encapsulants, Ultradur® engineering plastics

BASF, a global chemical powerhouse, offers a range of materials for electronics protection, including silicone-based die encapsulants. Their products are valued for their weatherability, UV resistance, and ability to protect components in outdoor and automotive lighting applications.

Innovation and R&D Focus:

• Development of thermally conductive but electrically insulating silicone gels

• Sustainable chemistry initiatives to reduce the carbon footprint of material production

• Collaboration with automotive OEMs on encapsulants for LiDAR and other ADAS (Advanced Driver-Assistance Systems) sensors

Download FREE Sample Report: Semiconductor Die Encapsulants Market – View in Detailed Research Report

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2️⃣ 9. Kyocera Corporation

Headquarters: Kyoto, Japan
Key Offering: Ceramic packages with integrated encapsulation, specialty glass encapsulants

Kyocera is unique in this list as a manufacturer that provides both the package and the encapsulation solution. Their expertise in fine ceramics allows them to create hermetic packages with integrated glass or ceramic lids that offer the ultimate protection for high-frequency and military-grade semiconductors.

Innovation and R&D Focus:

• Advanced LTCC (Low-Temperature Co-fired Ceramic) packages with cavity encapsulation

• Materials for RF and microwave applications requiring minimal signal loss

• Development of transparent encapsulants for optical sensors and imaging devices

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1️⃣ 10. Lord Corporation (Parker Hannifin)

Headquarters: Cary, North Carolina, USA
Key Offering: Stycast® epoxy encapsulants, Tra-Bond® adhesives

As part of Parker Hannifin’s engineered materials group, Lord Corporation specializes in high-performance adhesives and coatings. Their Stycast® series of epoxy encapsulants are renowned for their exceptional thermal conductivity and electrical insulation properties, making them a top choice for power electronics and aerospace applications.

Innovation and R&D Focus:

• Epoxy systems with thermal conductivity exceeding 10 W/mK for efficient heat dissipation

• Encapsulants capable of withstanding extreme temperatures and thermal shock

• Materials qualified for use in satellites, aviation, and other mission-critical systems

Get Full Report Here: Semiconductor Die Encapsulants Market – View in Detailed Research Report

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🌍 Outlook: The Future of Semiconductor Encapsulation Is Smarter and More Integrated

The semiconductor die encapsulants market is undergoing a fundamental transformation. While traditional epoxy molding compounds continue to dominate in volume, the industry is rapidly adopting next-generation materials and multi-functional solutions that offer not just protection, but enhanced thermal management, signal integrity, and even embedded functionality.

📈 Key Trends Shaping the Market:

• Rise of advanced packaging technologies like Fan-Out, 3D IC, and System-in-Package (SiP), demanding more sophisticated encapsulants

• Explosive growth in electric vehicles and renewable energy systems, driving demand for high-reliability encapsulants for power semiconductors

• Increasing miniaturization of consumer electronics, requiring ultra-low stress and fine-feature encapsulation materials

• Growing emphasis on sustainability, pushing manufacturers toward halogen-free, bio-based, and recyclable material formulations

Get Full Report Here: Semiconductor Die Encapsulants Market – View in Detailed Research Report

The companies listed above are not only supplying essential materials—they are active partners in enabling the next wave of electronic innovation, from AI chips and 5G infrastructure to autonomous vehicles and smart medical devices.