The Global Tape for Dicing Market was valued at USD 1.24 Billion in 2023 and is projected to reach USD 1.86 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.9% during the forecast period (2024–2030). This growth is fueled by the explosive demand for semiconductors across consumer electronics, automotive, and AI infrastructure, alongside the continuous push for miniaturization and higher wafer yields in the semiconductor manufacturing process.

As semiconductor nodes shrink and wafer sizes increase, the role of high-performance dicing tape becomes more critical than ever. These specialized tapes ensure the integrity of delicate dies during the dicing process, directly impacting production efficiency and final product reliability. In this blog, we profile the Top 10 Companies in the Tape for Dicing Industry—a group of material science innovators and specialty chemical leaders shaping the future of semiconductor fabrication.

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🔟 1. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: Semiconductor Dicing Tapes, UV Curable Tapes, Thermal Release Tapes

Nitto Denko is a global leader in pressure-sensitive adhesive tapes, holding a significant market share in the semiconductor dicing tape segment. The company’s product portfolio includes a wide range of high-performance tapes tailored for various wafer types, including ultra-thin wafers and those for advanced packaging applications.

Innovation Initiatives:

• Development of low-adhesion contamination tapes for high-quality dicing

• Advanced UV tape systems for efficient post-dicing die pickup

• Focus on eco-friendly materials and manufacturing processes

Download FREE Sample Report:
Global Tape for Dicing Market – View in Detailed Research Report

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9️⃣ 2. Mitsui Chemicals Inc.

Headquarters: Tokyo, Japan
Key Offering: Alpha-Wrap Tape, Wettack Tape, Thermal-Slide Tape

Mitsui Chemicals provides a comprehensive lineup of dicing and processing tapes for the semiconductor industry. Their products are known for high adhesion control and stability, which are crucial for handling next-generation semiconductor materials like silicon carbide (SiC) and gallium nitride (GaN).

Innovation Initiatives:

• R&D into tapes for wide-bandgap semiconductor materials

• Expansion of product lines for fan-out wafer-level packaging (FOWLP)

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8️⃣ 3. Sumitomo Bakelite Co. Ltd.

Headquarters: Tokyo, Japan
Key Offering: Evalpha Series (UV Tapes), Benda-Lift Tape

Sumitomo Bakelite specializes in high-purity semiconductor materials, including a robust portfolio of dicing tapes. The company’s Evalpha series of UV-curable dicing tapes is widely adopted for their precise adhesion control and minimal residue, ensuring high die strength and yield.

Innovation Initiatives:

• Development of tapes for ultra-thin wafer dicing (below 50µm)

• Integration of materials for 2.5D and 3D IC packaging processes

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7️⃣ 4. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Adwill Dicing Tapes, Adwill P-Level Tape

LINTEC is a major global supplier of dicing tapes, with a strong focus on the Asia-Pacific semiconductor market. Their Adwill series offers solutions for a wide range of applications, from standard silicon dicing to challenging materials like compound semiconductors and glass substrates.

Innovation Initiatives:

• Introduction of multi-functional tapes that combine dicing and die-attach properties

• Enhanced products for dicing-after-grind processes

Download FREE Sample Report:
Global Tape for Dicing Market – View in Detailed Research Report

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6️⃣ 5. Denka Company Limited

Headquarters: Tokyo, Japan
Key Offering: Denka Dicing Tapes, Heat-Resistant Tapes

Denka leverages its expertise in polymer chemistry to produce specialized dicing tapes that meet the stringent requirements of modern fabs. The company’s products are engineered to provide excellent heat resistance and dimensional stability during high-temperature processes.

Innovation Initiatives:

• Focus on tapes for power device manufacturing

• Development of low-outgassing tapes for vacuum environments

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5️⃣ 6. AI Technology, Inc. (AIT)

Headquarters: Princeton, New Jersey, USA
Key Offering: ThermTape, UltraTape, Snapcure Adhesives

AIT is a prominent US-based company providing specialty tapes and adhesives for the semiconductor industry. Their product line includes thermally conductive and electrically insulating dicing tapes, particularly suited for high-power and high-frequency applications.

Innovation Initiatives:

• Pioneering work in thermally conductive but electrically insulating dicing tapes

• Custom formulation services for unique semiconductor fabrication needs

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4️⃣ 7. Ultron Systems Inc.

Headquarters: San Jose, California, USA
Key Offering: UV Dicing Tapes, Non-UV Dicing Tapes, Specialty Backgrinding Tapes

Ultron Systems specializes in high-performance tapes for semiconductor wafer processing. As a key supplier to North American and Asian semiconductor manufacturers, the company focuses on delivering consistent quality and performance for high-volume production environments.

Innovation Initiatives:

• Optimization of tape properties for advanced blade and laser dicing techniques

• Development of low-static tapes to prevent electrostatic discharge damage

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3️⃣ 8. Pantech Tape Co. Ltd.

Headquarters: Gyeonggi-do, South Korea
Key Offering: PT Dicing Tapes, Back Grinding Tapes

Pantech Tape is a leading South Korean manufacturer of adhesive tapes for the electronics industry. The company has a strong presence in the domestic semiconductor market and is expanding its global footprint with competitively priced, high-performance dicing tape solutions.

Innovation Initiatives:

• Investment in R&D for next-generation memory device dicing

• Expansion of manufacturing capacity to meet growing global demand

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2️⃣ 9. QES GROUP BERHAD

Headquarters: Selangor, Malaysia
Key Offering: Semiconductor Process Materials, Dicing Tapes, Equipment Services

QES Group is a diversified company providing materials and equipment services to the semiconductor industry across Southeast Asia. Their dicing tape offerings are part of a broader portfolio designed to support the entire semiconductor manufacturing value chain.

Innovation Initiatives:

• Integration of material supply with equipment service and support

• Strategic partnerships with global material suppliers

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1️⃣ 10. Shenzhen Xinst Technology Co. Ltd.

Headquarters: Shenzhen, China
Key Offering: XINST Dicing Tapes, Protective Tapes, Adhesive Films

Shenzhen Xinst Technology is a rapidly growing Chinese manufacturer specializing in functional films and tapes for the electronics industry. The company is capitalizing on China’s booming semiconductor sector by providing cost-effective and reliable dicing tape solutions.

Innovation Initiatives:

• Localized R&D to serve the specific needs of China’s semiconductor fabs

• Expansion of product portfolio to include tapes for MEMS and sensor applications

Get Full Report Here:
Global Tape for Dicing Market – View in Detailed Research Report

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🌍 Outlook: The Future of Tape for Dicing is Smarter and More Specialized

The tape for dicing market is undergoing a significant evolution. While standard tapes continue to serve mainstream applications, the industry is investing heavily in advanced material formulations, application-specific solutions, and integration with next-generation dicing technologies.

📈 Key Trends Shaping the Market:

• Rising demand for tapes compatible with ultra-thin wafers (≤50µm) for 3D packaging

• Development of specialized tapes for compound semiconductors (SiC, GaN) in power electronics and electric vehicles

• Integration of functional properties, such as thermal conductivity and electrical insulation, directly into the tape

• Increasing automation in tape application and removal processes to improve yield and throughput

Get Full Report Here:
Global Tape for Dicing Market – View in Detailed Research Report

The companies listed above are not only supporting semiconductor manufacturing—they are enabling the next wave of electronic innovation by providing the critical materials needed for precise and reliable die separation.