The Global Back Grinding Tapes (BGT) Market was valued at USD 220 Million in 2025 and is projected to reach USD 322 Million by 2034, growing at a Compound Annual Growth Rate (CAGR) of 5.7% during the forecast period. This growth is propelled by the relentless demand for thinner and more powerful semiconductor devices in smartphones, artificial intelligence (AI), and high-performance computing (HPC), which necessitates highly precise wafer thinning processes.

As the semiconductor industry pushes the boundaries of miniaturization and advanced packaging, the role of back grinding tapes in protecting delicate wafers becomes increasingly critical. In this blog, we profile the Top 10 Companies in the Back Grinding Tapes Industry—specialty chemical and materials giants whose innovations are foundational to the integrity and performance of modern electronics.

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🔟 1. Mitsui Chemicals Tohcello, Inc.

Headquarters: Tokyo, Japan
Key Offering: UV and Non-UV Back Grinding Tapes, Dicing Tapes

Mitsui Chemicals Tohcello stands as the undisputed global leader in the Back Grinding Tapes market, commanding a dominant market share exceeding 30%. The company offers a comprehensive portfolio of high-performance tapes designed for a wide range of semiconductor applications, from standard die thinning to complex bump processes. Their products are renowned for exceptional purity, consistent performance, and high yield rates.

Innovation Initiatives:

• Pioneering development of advanced UV-curable adhesive systems for clean residue-free de-taping

• Focus on tapes for ultra-thin wafers (below 50μm) and large-diameter substrates

• Deep integration with leading global semiconductor foundries and IDMs

Download FREE Sample Report: Back Grinding Tapes (BGT) Market – View in Detailed Research Report

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9️⃣ 2. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: ELEP HOLDER™ Series BGTs, Specialty Adhesive Films

Nitto is a powerhouse in functional films and adhesive technologies, with a significant presence in the BGT market. Its ELEP HOLDER™ series is widely adopted for its reliability in protecting wafer surfaces during back-grinding and other semiconductor processes. The company leverages its extensive R&D capabilities to develop solutions that meet the evolving demands of advanced node manufacturing.

Innovation Initiatives:

• Development of low-dielectric-constant tapes for high-frequency applications

• Expansion of product lines for Fan-Out Wafer-Level Packaging (FO-WLP)

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8️⃣ 3. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: ADWILL series BGTs, Adhesive Sheets for Semiconductor Processing

LINTEC is another major Japanese player with a strong foothold in the semiconductor materials sector. The company’s ADWILL series of back grinding tapes are engineered for high adhesion strength during grinding and easy release properties, minimizing stress on ultra-thin wafers. LINTEC’s expertise in precision coating technologies ensures high product quality and uniformity.

Innovation Initiatives:

• Specialization in tapes for challenging materials like silicon carbide (SiC) and gallium nitride (GaN)

• Investment in capacity expansion to cater to the growing global semiconductor market

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7️⃣ 4. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: BACK GRINDING TAPES (Brand Name Typically Understood), Functional Polymer Products

Furukawa Electric leverages its deep materials science expertise to produce high-quality back grinding tapes. The company’s products are designed to provide excellent protection against chipping and contamination, which is critical for maintaining high yields in advanced semiconductor fabrication. Their focus on material purity and process compatibility makes them a key supplier.

Innovation Initiatives:

• R&D focused on thermal stability and mechanical strength for next-generation processes

• Collaborations with equipment manufacturers for optimized process integration

Download FREE Sample Report: Back Grinding Tapes (BGT) Market – View in Detailed Research Report

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6️⃣ 5. Denka Company Limited

Headquarters: Tokyo, Japan
Key Offering: Back Grinding Tapes, High-Performance Plastics and Elastomers

Denka is a diversified chemical company with a strong portfolio of electronic materials. Its back grinding tapes are known for their consistent quality and performance in demanding semiconductor manufacturing environments. Denka’s chemical synthesis capabilities allow it to develop specialized adhesive formulations that meet the stringent requirements of leading chipmakers.

Innovation Initiatives:

• Development of tapes with enhanced adhesion control for complex 3D IC structures

• Focus on environmentally friendly materials and manufacturing processes

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5️⃣ 6. LG Chem

Headquarters: Seoul, South Korea
Key Offering: Back Grinding Tapes, Electronic Chemicals

As South Korea’s leading chemical company, LG Chem is a significant contender in the BGT market, benefiting from its proximity to one of the world’s largest semiconductor manufacturing hubs. The company produces a range of back grinding tapes that cater to the high standards of memory and logic chip producers, with a strong emphasis on purity and reliability.

Innovation Initiatives:

• Leveraging petrochemical expertise to create high-purity polymer bases for tapes

• Strategic focus on supplying the domestic Korean semiconductor industry

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4️⃣ 7. Maxell Holdings, Ltd.

Headquarters: Tokyo, Japan
Key Offering: Semiconductor Process Tapes, Precision Components

Maxell, widely known for its consumer electronics, also has a specialized division producing high-performance materials for the semiconductor industry. Their back grinding tapes are designed for precision and cleanliness, supporting the production of advanced microchips. Maxell’s experience in miniaturized components informs its approach to developing tapes for ultra-thin wafers.

Innovation Initiatives:

• Integration of nanotechnology to improve tape surface properties and adhesion control

• Custom tape development for specific customer process flows

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3️⃣ 8. D&X

Headquarters: Gyeonggi-do, South Korea
Key Offering: Back Grinding Tapes, Surface Protection Films

D&X is a specialized South Korean manufacturer focusing on adhesive tapes for the electronics industry. The company has carved out a niche by providing reliable and cost-effective back grinding tape solutions. It serves both domestic and international semiconductor assembly and test (OSAT) companies, offering products that balance performance with value.

Innovation Initiatives:

• Focus on improving de-taping speed and cleanliness for high-throughput manufacturing

• Expansion of product offerings to include tapes for emerging packaging technologies

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2️⃣ 9. AI Technology, Inc.

Headquarters: Princeton Junction, New Jersey, USA
Key Offering: Specialty Adhesives and Tapes, including BGTs for R&D and Low-Volume Production

AI Technology is a notable US-based player specializing in high-temperature and high-performance adhesives. While smaller in scale compared to the Japanese leaders, the company provides innovative back grinding tape solutions, particularly for prototyping, R&D, and specialized applications where custom formulations are required.

Innovation Initiatives:

• Development of tapes with extreme thermal stability for wide-bandgap semiconductors

• Quick-turnaround custom adhesive formulation services

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1️⃣ 10. Taicang Zhanxin Adhesive Material Co., Ltd.

Headquarters: Suzhou, China
Key Offering: Back Grinding Tapes, PET-based Adhesive Tapes

As a key Chinese supplier, Taicang Zhanxin is part of the growing domestic ecosystem supporting China’s semiconductor industry. The company manufactures back grinding tapes that meet the needs of local fabs and OSATs, focusing on cost-competitive solutions for mainstream applications while gradually advancing its technological capabilities.

Innovation Initiatives:

• Investment in scaling up production capacity to serve the expanding local market

• Technology partnerships to improve product performance for advanced nodes

Get Full Report Here: Back Grinding Tapes (BGT) Market – View in Detailed Research Report

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🔬 Outlook: The Future of Back Grinding Tapes Is Smarter and More Specialized

The Back Grinding Tapes market is undergoing a significant evolution. While standard products still serve a large volume of the market, the industry is heavily investing in advanced adhesive formulations, ultra-clean manufacturing processes, and tapes tailored for next-generation semiconductor materials and architectures.

📈 Key Trends Shaping the Market:

• Accelerated adoption of UV-type tapes for superior, clean release in advanced packaging

• Increasing demand for tapes capable of handling ultra-thin wafers below 50μm for 3D IC stacking

• Development of specialized solutions for compound semiconductors like SiC and GaN for power electronics

• Integration of digital quality control and traceability into tape manufacturing

Get Full Report Here: Back Grinding Tapes (BGT) Market – View in Detailed Research Report

The companies listed above are not only supplying a critical consumable—they are enabling the continued miniaturization and performance gains that define the future of electronics.