The Global Dicing Die Bonding Tape Market was valued at USD 1.12 Billion in 2025 and is projected to reach USD 1.65 Billion by 2034, growing at a Compound Annual Growth Rate (CAGR) of 5.8% during the forecast period (2024–2030). This growth is being driven by the relentless expansion of the semiconductor industry, the proliferation of advanced packaging technologies, and the escalating demand for electronics across consumer, automotive, and industrial sectors.

As semiconductor devices become smaller, more powerful, and more integrated, the critical role of dicing die bonding tape—a specialized adhesive material used to mount and hold silicon wafers during the dicing and die-attach processes—has come into sharp focus. In this blog, we profile the Top 10 Companies in the Dicing Die Bonding Tape Industry—a group of material science innovators and specialty chemical giants shaping the future of microelectronic fabrication.

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🔟 1. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: Non-Conductive Tapes, Conductive Tapes, UV Curable Tapes

Nitto Denko is a global leader in pressure-sensitive adhesive tapes, with a dominant position in the dicing die bonding tape market. Their extensive product portfolio, including the renowned Elep系列, is engineered for high precision, low contamination, and excellent adhesion control, serving leading semiconductor foundries worldwide.

Innovation and Market Focus:

• Development of ultra-thin tapes for ultra-thin wafer processing

• Advanced UV tape technology for easy die pick-up

• Strong focus on R&D for next-generation packaging like 2.5D/3D IC integration

Download FREE Sample Report: Dicing Die Bonding Tape Market – View in Detailed Research Report

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9️⃣ 2. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Dicing Tapes, Die Attach Tapes, Speciality Adhesives

LINTEC is another Japanese powerhouse, renowned for its high-performance adhesive products. The company’s dicing tapes are critical for processing a wide range of semiconductor wafers, including silicon, gallium arsenide, and glass. Their products are known for consistent performance under high-speed dicing conditions.

Innovation and Market Focus:

• Broad portfolio catering to various wafer sizes and materials

• Investment in tapes for fan-out wafer-level packaging (FOWLP)

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8️⃣ 3. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Conductive Dicing Tapes, Non-Conductive Tapes

Furukawa Electric leverages its expertise in materials science to produce high-reliability dicing die bonding tapes. The company is particularly strong in the development of electrically conductive tapes, which are essential for applications requiring grounding or electrical connection through the adhesive layer.

Innovation and Market Focus:

• Specialization in conductive adhesive technologies

• Focus on thermal and electrical performance characteristics

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7️⃣ 4. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® Brand Die Attach Films, Adhesive Solutions

Henkel, through its renowned LOCTITE brand, is a major force in electronic adhesives. While widely recognized for liquid die-attach materials, Henkel also provides advanced die-attach films and tapes that offer high thermal conductivity and reliability for power semiconductors and automotive applications.

Innovation and Market Focus:

• Material solutions for high-power and high-temperature applications

• Strong alignment with automotive electronics megatrends

Download FREE Sample Report: Dicing Die Bonding Tape Market – View in Detailed Research Report

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6️⃣ 5. LG Chem

Headquarters: Seoul, South Korea
Key Offering: Electronic Chemical Materials, Adhesive Films

LG Chem, a leading chemical company, has a growing electronic materials division that supplies critical components to the semiconductor supply chain. Their dicing tape solutions are designed to meet the rigorous demands of memory and logic chip manufacturers, particularly within South Korea’s robust semiconductor ecosystem.

Innovation and Market Focus:

• Integration with domestic semiconductor giants like Samsung and SK Hynix

• Development of environmentally friendly material formulations

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5️⃣ 6. AI Technology, Inc. (AIT)

Headquarters: Princeton Junction, New Jersey, USA
Key Offering: Specialty Adhesives, Thermally Conductive Tapes, Solder Alternatives

AI Technology is a specialty manufacturer focusing on high-performance adhesives for demanding applications. While a smaller player compared to the Asian giants, AIT is recognized for its innovative approaches, particularly in thermally conductive and electrically insulating tapes used in power device packaging.

Innovation and Market Focus:

• Niche focus on thermal management solutions

• Flexible, customer-specific formulations

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4️⃣ 7. Hitachi Chemical (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Semiconductor Process Materials, Adhesive Tapes

Following its integration into Showa Denko Materials, the former Hitachi Chemical business continues to be a key supplier of semiconductor packaging materials. The company offers a range of tapes known for high purity and reliability, crucial for advanced semiconductor manufacturing processes.

Innovation and Market Focus:

• Legacy of reliability in the semiconductor industry

• Focus on materials for high-density integration

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3️⃣ 8. Mitsui Chemicals Tohcello, Inc.

Headquarters: Tokyo, Japan
Key Offering: Tohcello™ Dicing Tapes, Surface Protection Films

Mitsui Chemicals Tohcello specializes in functional films and tapes. Their dicing tapes are engineered to provide excellent hold-down force during the dicing process while allowing for clean, residue-free release during die pick-up, a critical requirement for high-yield production.

Innovation and Market Focus:

• Expertise in film engineering and adhesive chemistry

• Products tailored for specific wafer types and dicing saws

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2️⃣ 9. DuPont de Nemours, Inc.

Headquarters: Wilmington, Delaware, USA
Key Offering: Specialty Interconnect Materials, Adhesives

DuPont brings its vast expertise in material science to the semiconductor industry. While its presence in dicing tapes is more specialized, the company offers high-performance adhesive solutions for critical die-attach applications, particularly where exceptional thermal stability or electrical properties are required.

Innovation and Market Focus:

• Focus on high-value, high-performance segments

• R&D in materials for heterogeneous integration

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1️⃣ 10. 3M Company

Headquarters: Saint Paul, Minnesota, USA
Key Offering: 3M™ Adhesive Tapes, Electronic Specialty Materials

3M’s massive portfolio of adhesive technologies includes solutions relevant to the semiconductor industry. The company’s expertise in substrate films and precision coating allows it to supply specialized tapes for certain dicing and temporary bonding applications, leveraging its global manufacturing and distribution network.

Innovation and Market Focus:

• Broad R&D capabilities across multiple adhesive technologies

• Strong global supply chain and technical support

Get Full Report Here: Dicing Die Bonding Tape Market – View in Detailed Research Report

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🔬 Outlook: The Future of Dicing Die Bonding Tape is Smarter and More Specialized

The dicing die bonding tape market is evolving in lockstep with the semiconductor industry. As chips become more complex and packaging architectures advance, the demand for tapes with tailored properties—such as ultra-low warpage, high thermal conductivity, and compatibility with newer substrate materials—is accelerating.

📈 Key Trends Shaping the Market:

• R&D in tapes for ultra-thin wafers and chip-on-wafer (CoW) packaging

• Growing demand for thermally conductive tapes to manage heat in power devices

• Development of eco-friendly and halogen-free adhesive formulations

• Integration of digital tracking and quality control in tape manufacturing

Get Full Report Here: Dicing Die Bonding Tape Market – View in Detailed Research Report

The companies listed above are not only supplying essential materials—they are enabling the miniaturization and performance gains that define the future of electronics.