Top 10 Companies in the Industrial Epoxy Molding Compounds Industry (2025): Key Players Driving Electronics Encapsulation

In Business Insights
January 13, 2026


The Global Industrial Epoxy Molding Compounds Market size is projected to reach approximately USD 2.1 Billion by 2029, from an estimated USD 1.6 Billion in 2024, growing at a Compound Annual Growth Rate (CAGR) of 5.6% during the forecast period (2024–2029). This robust growth is primarily driven by the expanding electronics and semiconductor sectors, increasing demand for miniaturized components, and the critical need for reliable encapsulation materials that offer superior thermal stability, moisture resistance, and mechanical protection.

As industries from automotive to consumer electronics advance toward smarter, more compact, and more durable devices, the spotlight turns to the key material suppliers enabling this transformation. In this blog, we profile the Top 10 Companies in the Industrial Epoxy Molding Compounds Industry—leaders in chemical innovation, material science, and high-performance encapsulation solutions that are shaping the future of modern manufacturing.


🔟 1. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: High-purity EMCs, Low-stress EMCs, High Thermal Conductivity EMCs

Sumitomo Bakelite is a global pioneer in epoxy molding compounds, providing advanced materials for semiconductor encapsulation, LED packaging, and power modules. The company’s products are renowned for their exceptional reliability, which is critical for automotive and high-frequency applications.

Innovation Focus:

  • Development of halogen-free and environmentally friendly compounds

  • Advanced materials for SiC and GaN power devices

  • Global production capacity expansion to meet semiconductor demand

Download FREE Sample Report: Global Industrial Epoxy Molding Compounds Market – View in Detailed Research Report


9️⃣ 2. Hitachi Chemical (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Moldable Underfill EMCs, High-Reliability Compounds, Low Alpha EMCs

Following its integration into Showa Denko Materials, Hitachi Chemical continues to be a leading force in epoxy molding compounds. The company specializes in solutions for advanced packaging, including Fan-Out Wafer Level Packaging (FOWLP) and system-in-package (SiP) applications.

Innovation Focus:

  • Materials for heterogeneous integration and 3D packaging

  • Focus on automotive-grade reliability and long-term performance


8️⃣ 3. Panasonic Corporation

Headquarters: Kadoma, Osaka, Japan
Key Offering: Semiconductor EMCs, LED Encapsulants, Thermal Interface Materials

Panasonic’s electronic materials division is a key supplier of epoxy molding compounds for a wide array of applications. Their materials are designed to meet stringent requirements for thermal cycling performance and resistance to soldering heat.

Innovation Focus:

  • High-reflectivity white EMCs for high-brightness LEDs

  • Compounds with low thermal expansion coefficients


7️⃣ 4. Hysol Huawei Electronics (Shenzhen Hysol Technology)

Headquarters: Shenzhen, Guangdong, China
Key Offering: Epoxy Molding Compounds, Electronic Adhesives, Solder Pastes

Hysol Huawei Electronics is a prominent Chinese manufacturer specializing in electronic packaging materials. The company has gained significant market share by providing cost-effective and reliable epoxy molding compounds for consumer electronics and industrial applications.

Innovation Focus:

  • Rapid-curing formulations for high-volume manufacturing

  • Expansion into automotive and 5G infrastructure markets

Download FREE Sample Report: Global Industrial Epoxy Molding Compounds Market – View in Detailed Research Report


6️⃣ 5. Chang Chun Group

Headquarters: Taipei, Taiwan
Key Offering: EMCs for Discrete Devices, IC Packaging, Optoelectronics

Chang Chun Group is a major chemical company with a strong presence in the epoxy molding compounds market. Their products serve the packaging needs of transistors, diodes, and integrated circuits, with a focus on the Asian semiconductor supply chain.

Innovation Focus:

  • Development of high glass transition temperature (Tg) compounds

  • Enhanced flame-retardant materials meeting UL94 V-0 standards


5️⃣ 6. Eternal Materials Co., Ltd.

Headquarters: Kaohsiung, Taiwan
Key Offering: Epoxy Molding Compounds, Copper Clad Laminates, Green Materials

Eternal Materials is a leading Taiwanese chemical company that produces a diverse portfolio of electronic materials. Their epoxy molding compounds are widely used in the encapsulation of memory chips, microcontrollers, and sensors.

Innovation Focus:

  • Investment in bio-based epoxy resins for sustainable EMCs

  • Tailored solutions for high-density packaging applications


4️⃣ 7. SCIENCHEM

Headquarters: Zhuhai, Guangdong, China
Key Offering: Specialized EMCs, Anhydride Hardeners, Epoxy Resins

SCIENCHEM is a specialized chemical enterprise focused on the research and production of high-performance epoxy systems. The company provides custom-formulated molding compounds for challenging applications requiring extreme environmental stability.

Innovation Focus:

  • Ultra-low viscosity compounds for fine-pitch wire encapsulation

  • Development of materials for high-voltage power modules


3️⃣ 8. Beijing Sino-tech Electronic Material Co., Ltd.

Headquarters: Beijing, China
Key Offering: Electronic Packaging Materials, EMCs, Conductive Adhesives

Beijing Sino-tech is a key player in China’s electronic materials sector, supplying epoxy molding compounds to domestic semiconductor fabs and packaging houses. The company supports China’s strategic push for self-sufficiency in key electronic components.

Innovation Focus:

  • Materials compliant with China’s RoHS and other environmental regulations

  • Collaborations with academic institutions for next-generation materials


2️⃣ 9. Jiangsu Zhongpeng New Material

Headquarters: Jiangsu, China
Key Offering: Industrial EMCs, Specialty Epoxy Resins, Curing Agents

Jiangsu Zhongpeng New Material is an emerging manufacturer focused on the domestic Chinese market. The company produces epoxy molding compounds for a range of industrial applications, including electrical tools and home appliances.

Innovation Focus:

  • Cost-optimized formulations for consumer-grade electronics

  • Expansion of production capacity to serve growing regional demand


1️⃣ 10. HHCK

Headquarters: Suzhou, Jiangsu, China
Key Offering: Epoxy Molding Compounds, Potting Compounds, Thermal Management Materials

HHCK is a specialized material science company providing encapsulation solutions for the electronics industry. While smaller in global scale compared to the leaders, HHCK has carved a niche with responsive customer service and application-specific formulations.

Innovation Focus:

  • Fast-cycle time compounds for improved manufacturing throughput

  • Focus on the rapidly growing electric vehicle component market

Get Full Report Here: Global Industrial Epoxy Molding Compounds Market – View in Detailed Research Report


🔬 Outlook: The Future of Epoxy Molding Compounds Is Smarter and More Integrated

The industrial epoxy molding compounds market is undergoing a significant transformation. As electronic devices become more powerful, compact, and ubiquitous, the encapsulation materials must evolve to provide greater thermal performance, higher reliability, and better environmental compatibility.

📈 Key Trends Shaping the Market:

  • Growing adoption of advanced packaging technologies like 2.5D/3D IC integration

  • Increasing demand for materials capable of withstanding higher operating temperatures in electric vehicles and 5G infrastructure

  • Shift toward halogen-free and sustainable compound formulations

  • Rising investments in semiconductor manufacturing capacity globally, particularly in Asia

Get Full Report Here: Global Industrial Epoxy Molding Compounds Market – View in Detailed Research Report

The companies listed above are not only supplying essential materials for today’s electronics—they’re enabling the technological advancements that will define tomorrow’s connected world.