The Global Ultra Thin Copper Foil with Carrier Foil Market was valued at USD 1.55 Billion in 2025 and is projected to reach USD 2.78 Billion by 2032, growing at a Compound Annual Growth Rate (CAGR) of 7.8% during the forecast period (2025–2032). This robust growth is primarily fueled by the relentless push for electronics miniaturization, the global rollout of 5G infrastructure, and the soaring demand for high-density interconnects (HDI) in semiconductor packaging.

As the backbone of modern electronics manufacturing, ultra thin copper foil with carrier foil enables the production of finer circuits and more complex multi-layer boards essential for smartphones, electric vehicles, and advanced computing systems. In this blog, we profile the Top 10 Companies in the Ultra Thin Copper Foil with Carrier Foil Industry—a group of specialized material science leaders and manufacturing innovators shaping the technological frontier.

Download FREE Sample Report:
Ultra Thin Copper Foil with Carrier Foil Market – View in Detailed Research Report

---

🔟 1. Mitsui Mining & Smelting Co., Ltd. (Mitsui Kinzoku)

Headquarters: Tokyo, Japan
Key Offering: Ultra Thin Copper Foils (3-12µm), High-Performance Carrier Foils, Advanced Surface-Treated Foils

Mitsui Mining & Smelting is a global leader in advanced materials, renowned for its high-purity ultra thin copper foils that are critical for IC substrates and HDI PCBs. The company’s proprietary manufacturing processes ensure exceptional thickness uniformity and low surface roughness, which are essential for high-frequency applications. Mitsui Kinzoku supplies major electronics manufacturers worldwide and is heavily invested in R&D for next-generation foils.

Innovation Initiatives:

• Pioneering foils thinner than 5µm for advanced semiconductor packaging

• Developing carrier foils with enhanced peel strength and thermal stability

• Expanding production capacity to meet rising global demand

Download FREE Sample Report:
Ultra Thin Copper Foil with Carrier Foil Market – View in Detailed Research Report

---

9️⃣ 2. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Furukawa Circuit Foil, Ultra Thin Electrodeposited Copper Foil, Low-Profile Foils

Furukawa Electric is a key player with a strong focus on electrodeposited copper foils for high-end applications. The company’s products are known for their excellent elongation properties and dimensional stability, making them ideal for flexible printed circuits and rigid-flex boards. Furukawa has a significant market presence in Asia and is expanding its global footprint through strategic partnerships.

Innovation Initiatives:

• Investment in roll-to-roll processing technologies for higher yield

• Development of foils optimized for high-speed signal transmission

---

8️⃣ 3. Circuit Foil Luxembourg

Headquarters: Luxembourg City, Luxembourg
Key Offering: Ultra Thin Rolled Copper Foils, High-Temperature Resistant Carrier Foils

Circuit Foil specializes in rolled copper foils, which offer superior flexibility and fatigue resistance compared to electrodeposited variants. This makes their products particularly valuable for automotive electronics and aerospace applications where reliability under stress is critical. The company serves a global clientele from its European manufacturing base.

Innovation Initiatives:

• Advanced annealing processes for enhanced mechanical properties

• Focus on foils for high-reliability automotive and industrial applications

---

7️⃣ 4. Kingboard Holdings Limited

Headquarters: Hong Kong
Key Offering: Laminates, Copper-Clad Laminates, Ultra Thin Copper Foils

Kingboard is a vertically integrated manufacturer with a significant presence in the copper foil and laminate markets. The company’s strength lies in its ability to provide integrated solutions from raw foil to finished laminates, offering cost efficiencies and supply chain stability to its customers, particularly in the consumer electronics sector.

Innovation Initiatives:

• Expansion of ultra thin foil production capacity in Mainland China

• Development of halogen-free and environmentally friendly foil products

---

6️⃣ 5. Nan Ya Plastics Corporation

Headquarters: Taipei, Taiwan
Key Offering: Electrodeposited Copper Foil, Copper Clad Laminates, Ultra Thin Foils for HDI

As part of the Formosa Plastics Group, Nan Ya Plastics is a major supplier of copper foils to the global PCB industry. The company has substantial manufacturing capacity and a strong technological foundation, allowing it to compete effectively in both standard and high-performance foil segments. Nan Ya is particularly strong in the Asian market.

Innovation Initiatives:

• Continuous investment in foil thinning technologies

• Focus on cost-competitive manufacturing for mass-market applications

Download FREE Sample Report:
Ultra Thin Copper Foil with Carrier Foil Market – View in Detailed Research Report

---

5️⃣ 6. Fukuda Metal Foil & Powder Co., Ltd.

Headquarters: Kyoto, Japan
Key Offering: Ultra Thin Copper Foils, Metal Powders, Specialized Surface Treatments

Fukuda is a specialty manufacturer with expertise in both foil and powder metallurgy. The company’s ultra thin foils are known for their high purity and consistent quality, catering to demanding applications in telecommunications and computing. Fukuda’s smaller scale allows for flexibility in serving niche market segments.

Innovation Initiatives:

• Development of foils with customized surface characteristics

• Research into novel alloy foils for specific performance requirements

---

4️⃣ 7. Co-Tech Development Corp.

Headquarters: Taoyuan City, Taiwan
Key Offering: Electrodeposited Copper Foil, Lithium Battery Copper Foil, Ultra Thin Variants

Co-Tech is a significant Taiwanese player with growing capabilities in ultra thin foils for both PCB and battery applications. The company has been expanding its production capacity to capitalize on the electronics boom in Southeast Asia and has established relationships with major PCB fabricators in the region.

Innovation Initiatives:

• Diversification into foils for energy storage applications

• Geographical expansion to serve emerging Southeast Asian markets

---

3️⃣ 8. JX Nippon Mining & Metals Corporation

Headquarters: Tokyo, Japan
Key Offering: High-Purity Copper Foils, Sputtering Targets, Ultra Thin Foils for Advanced Packaging

JX Nippon Mining & Metals brings extensive experience in non-ferrous metals to the copper foil market. The company’s strengths include high-purity material sourcing and advanced processing technologies, positioning it well for semiconductor packaging applications that demand exceptional material quality and consistency.

Innovation Initiatives:

• Development of foils for fan-out wafer-level packaging (FOWLP)

• Integration with other electronic materials in the company’s portfolio

---

2️⃣ 9. Guangzhou Fang Bang Electronics Co., Ltd.

Headquarters: Guangzhou, China
Key Offering: Ultra Thin Copper Foil, Electrodeposited Copper Foil, Specialized Copper Products

As a leading Chinese manufacturer, Guangzhou Fang Bang Electronics has been rapidly expanding its capabilities in ultra thin copper foils to serve the domestic electronics market. The company benefits from proximity to China’s massive PCB manufacturing base and has been investing in advanced production technologies to move up the value chain.

Innovation Initiatives:

• Significant capital investment in new production lines

• Focus on import substitution for the Chinese market

---

1️⃣ 10. LS Mtron Ltd.

Headquarters: Anyang, South Korea
Key Offering: Ultra Thin Copper Foils, PCB Materials, Industrial Components

LS Mtron, part of the LS Group, is a key South Korean player in the copper foil market. The company leverages South Korea’s strong position in semiconductors and displays to develop foils tailored for these high-tech applications. LS Mtron’s integrated approach allows for close collaboration with leading electronics manufacturers.

Innovation Initiatives:

• Development of foils for flexible displays and wearable electronics

• Strategic partnerships with major Korean electronics conglomerates

Read Full Report:
Ultra Thin Copper Foil with Carrier Foil Market – View in Detailed Research Report

---

🌍 Outlook: Smarter, Thinner, and More Integrated Future

The ultra thin copper foil with carrier foil market is at the forefront of electronics innovation. While traditional thicknesses still dominate volume production, the industry is aggressively investing in sub-5µm technologies, advanced carrier systems, and integrated manufacturing processes.

📈 Key Trends Shaping the Market:

• Accelerated adoption in advanced semiconductor packaging like 2.5D/3D IC integration

• Growing demand for ultra thin foils in automotive radar and AI hardware applications

• Development of recyclable and environmentally sustainable foil production processes

• Vertical integration between foil manufacturers and PCB fabricators for supply chain optimization

Read Full Report:
Ultra Thin Copper Foil with Carrier Foil Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials—they’re enabling the next generation of electronic innovation that will power everything from foldable smartphones to autonomous vehicles.

About 24chemicalresearch

24chemicalresearch is a leading provider of market research insights and consulting services for the chemical and materials industries. Our reports offer comprehensive analysis, reliable data, and actionable intelligence to help businesses navigate complex markets and make informed decisions.