The Global Granular Epoxy Mold Compound (EMC) Market was valued at USD 2.5 Billion in 2025 and is projected to reach USD 3.7 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 8.1% during the forecast period (2024–2030). This robust expansion is fueled by escalating demands for miniaturized electronics, the proliferation of 5G infrastructure, the rapid growth of the automotive semiconductor sector, and the accelerating adoption of advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP).

As the semiconductor industry pivots toward higher performance, greater reliability, and more sophisticated packaging solutions, the role of high-performance EMC materials becomes paramount. In this blog, we profile the Top 10 Companies in the Granular Epoxy Mold Compound (EMC) Industry—a group of material science innovators and chemical giants shaping the future of electronic encapsulation and protection.

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🔟 1. Panasonic Industry Co., Ltd.

Headquarters: Osaka, Japan
Key Offering: High Thermal Conductivity EMC, Low Stress EMC, Halogen-Free EMC

Panasonic is a global leader in electronic materials, offering a comprehensive portfolio of granular epoxy mold compounds renowned for their exceptional reliability and performance. Their materials are critical for automotive-grade semiconductors, power devices, and high-frequency applications, meeting stringent industry standards for thermal stability and moisture resistance.

Innovation and R&D Focus:

• Development of EMCs for next-generation power modules (SiC, GaN)

• Advanced formulations for improved warpage control in large-die packages

• Strong focus on sustainable, halogen-free material solutions

Download FREE Sample Report: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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9️⃣ 2. Samsung SDI Co., Ltd.

Headquarters: Seoul, South Korea
Key Offering: EMC for FOWLP, PLP, High-Speed Digital IC Packaging

Samsung SDI is a powerhouse in advanced materials, supplying high-purity granular EMCs tailored for the most demanding semiconductor packaging applications. Its products are integral to memory chips, processors, and sensors, with a strong R&D pipeline focused on supporting the transition to heterogeneous integration and 3D packaging architectures.

Innovation and R&D Focus:

• Pioneering EMC materials for Panel-Level Packaging (PLP) to reduce costs

• Ultra-low dielectric constant (Dk) and dissipation factor (Df) compounds for RF applications

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8️⃣ 3. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Granular EMC for Automotive, High-Tg EMC, Low α-particle EMC

With a deep heritage in phenolic and epoxy resins, Sumitomo Bakelite is a cornerstone of the semiconductor packaging materials market. The company specializes in high-reliability EMCs for automotive and industrial applications, where operational longevity and performance under extreme conditions are non-negotiable.

Innovation and R&D Focus:

• Leading supplier of EMCs for safety-critical automotive electronics (AEC-Q100 qualified)

• Development of low-α particle emitting EMCs for high-density memory packaging

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7️⃣ 4. Hitachi Chemical Company (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Mold Compounds for QFN, BGA, and Advanced Packaging

Hitachi Chemical, now part of Showa Denko Materials, offers a robust lineup of granular EMCs designed for a wide spectrum of package types. The company is known for its meticulous quality control and ability to provide customized solutions for leading-edge packaging foundries and Integrated Device Manufacturers (IDMs).

Innovation and R&D Focus:

• Custom-formulated EMCs for specific customer and application requirements

• Investment in materials enabling higher pin-count and finer-pitch packages

Download FREE Sample Report: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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6️⃣ 5. Hysol (Henkel AG & Co. KGaA)

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® EMC Products, Thermally Conductive EMCs

Henkel’s Hysol brand is synonymous with high-performance adhesives and encapsulants, including a specialized range of granular epoxy mold compounds. Leveraging its global manufacturing and R&D footprint, Henkel provides materials that address key challenges like thermal management and package miniaturization for consumer and industrial electronics.

Innovation and R&D Focus:

• Strong portfolio of thermally conductive EMCs for power electronics

• Global technical support and co-development partnerships with major OSATs (Outsourced Semiconductor Assembly and Test providers)

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5️⃣ 6. Kyocera Chemical Corporation

Headquarters: Kagoshima, Japan
Key Offering: High-Purity EMC, Ceramic-Filled EMC for Harsh Environments

Kyocera brings its expertise in ceramics and fine chemicals to the EMC market, producing high-purity, high-performance compounds. Their materials are often specified for applications requiring exceptional resistance to thermal cycling, humidity, and corrosive environments, making them ideal for automotive and aerospace semiconductors.

Innovation and R&D Focus:

• Expertise in ceramic filler technology for enhanced thermal performance

• Specialization in materials for sensors and MEMS (Micro-Electro-Mechanical Systems) packaging

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4️⃣ 7. Chang Chun Group

Headquarters: Taipei, Taiwan
Key Offering: Cost-Effective EMC, EMC for Discrete Semiconductors

Chang Chun Group is a major chemical conglomerate and a significant player in the Asian EMC market. The company offers a broad range of granular epoxy mold compounds that balance performance with cost-effectiveness, serving the high-volume discrete semiconductor and standard IC packaging segments.

Innovation and R&D Focus:

• Focus on expanding product portfolio for medium- to high-performance applications

• Growing capacity to serve the booming semiconductor market in China and Southeast Asia

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3️⃣ 8. NAMICS Corporation

Headquarters: Niigata, Japan
Key Offering: Specialty EMC for Advanced Packaging, Low Warpage EMC

NAMICS is a specialized chemical company known for its innovative adhesive and encapsulant technologies. Its granular EMCs are engineered to address specific processing challenges, such as minimizing warpage in thin and large-body packages, which is critical for yield improvement in advanced packaging.

Innovation and R&D Focus:

• R&D focused on warpage control and flowability for complex package geometries

• Developing materials compatible with copper wire bonding and lead-free soldering processes

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2️⃣ 9. Huawei (Huawei’s Investment in Materials R&D)

Headquarters: Shenzhen, China
Key Offering: EMC for Communications ICs, In-house Material Development

While primarily a technology and telecommunications giant, Huawei has made significant strategic investments in upstream materials science, including semiconductor packaging materials, to secure its supply chain. Its focus is on developing EMCs optimized for the high-frequency, high-power demands of its networking and 5G infrastructure products.

Innovation and R&D Focus:

• Vertical integration strategy for key component materials

• R&D into EMCs with superior electrical properties for RF and power management ICs (PMICs)

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1️⃣ 10. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-High Purity EMC, Silicon-Based Materials for Semiconductors

Shin-Etsu Chemical, a global leader in silicon wafers and semiconductor materials, also produces high-quality granular epoxy mold compounds. Leveraging its deep understanding of semiconductor manufacturing, the company offers EMCs characterized by ultra-high purity and consistency, which are essential for leading-edge logic and memory devices.

Innovation and R&D Focus:

• Synergy with silicon business for material purity and quality assurance

• Development of next-generation EMCs for 3D IC stacking and heterogeneous integration

Get Full Report Here: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

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🌍 Outlook: The Future of Granular EMC Is Smarter and More Demanding

The granular epoxy mold compound market is at a critical inflection point. As semiconductor packages become more complex and performance requirements more stringent, EMC suppliers are pushed to innovate relentlessly. The shift toward heterogeneous integration, the rise of wide-bandgap semiconductors, and the relentless pursuit of miniaturization are defining the next chapter for these essential materials.

📈 Key Trends Shaping the Market:

• Accelerated adoption of Fan-Out Wafer-Level Packaging (FOWLP) and Panel-Level Packaging (PLP) driving demand for specialized EMCs

• Stringent reliability requirements from the automotive electronics sector, demanding higher thermal cycling performance and longer lifespans

• Growing need for low-Dk/Df materials to support 5G mmWave and high-speed computing applications

• Increased R&D investment in sustainable, halogen-free, and recyclable material formulations

Get Full Report Here: Global Granular Epoxy Mold Compound (EMC) Market – View in Detailed Research Report

The companies profiled above are not merely supplying materials; they are enabling the technological advancements that power our digital world, from smartphones and data centers to autonomous vehicles and smart infrastructure.