The Global Substrate Film Adhesive Market was valued at USD 2.4 Billion in 2024 and is projected to reach USD 3.6 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.8% during the forecast period (2024–2030). This expansion is primarily driven by the accelerating adoption of consumer electronics, the deployment of 5G infrastructure, the electrification of the automotive sector, and the increasing complexity of semiconductor packaging.

As the electronics industry advances toward miniaturization, higher performance, and enhanced thermal management, the role of specialized adhesives in device fabrication becomes increasingly critical. In this analysis, we profile the Top 10 Companies in the Substrate Film Adhesive Industry—global leaders in specialty chemicals, adhesives, and electronics materials who are enabling the future of connected and smart devices.

---

🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® Ablestik® and Hysol® film adhesives

Henkel is a global powerhouse in adhesive technologies, with a significant presence in the electronics sector through its LOCTITE brand. The company offers a wide range of substrate film adhesives designed for die-attach, substrate bonding, and lid-sealing applications in semiconductor packaging. Their products are renowned for high thermal conductivity, electrical insulation, and reliability under harsh operating conditions.

Technology Initiatives:

• Development of high-reliability adhesives for automotive and aerospace electronics

• Advanced formulations for transient liquid phase sintering (TLPS) applications

• Strong R&D focus on lead-free and environmentally compliant materials

Download FREE Sample Report: Global Substrate Film Adhesive Market – View in Detailed Research Report

---

9️⃣ 2. H.B. Fuller Company

Headquarters: St. Paul, Minnesota, USA
Key Offering: Specialty film adhesives for electronics assembly

H.B. Fuller provides engineered adhesives for a diverse range of electronics applications, including flexible circuit bonding, display assembly, and component attachment. The company’s substrate film adhesives are tailored to meet the demanding requirements of modern electronics manufacturing, offering excellent adhesion, thermal stability, and resistance to environmental stressors.

Technology Initiatives:

• Innovations in pressure-sensitive adhesives (PSAs) for flexible electronics

• Development of low-outgassing formulations for high-vacuum environments

---

8️⃣ 3. DuPont (formerly DowDuPont)

Headquarters: Wilmington, Delaware, USA
Key Offering: Pyralux® flexible circuit materials, Kapton® polyimide films with adhesives

DuPont is a leader in high-performance materials, particularly in the polyimide film segment essential for flexible printed circuit boards (PCBs). Their substrate film adhesives are integral to creating multi-layer flexible circuits, offering exceptional thermal endurance, chemical resistance, and dimensional stability crucial for advanced electronics.

Technology Initiatives:

• Expansion of product lines for 5G mmWave applications

• Development of adhesives compatible with high-frequency materials (e.g., liquid crystal polymer, LCP)

---

7️⃣ 4. MacDermid Alpha Electronics Solutions (Element Solutions Inc.)

Headquarters: Waterbury, Connecticut, USA
Key Offering: ALPHA® die-attach films and substrate bonding materials

MacDermid Alpha is a premier provider of specialty chemicals and materials for the electronics industry. Their substrate film adhesives are critical for semiconductor packaging, particularly in advanced applications like fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) designs, where precise bond line control and high thermal performance are paramount.

Technology Initiatives:

• Leadership in materials for heterogeneous integration and 3D packaging

• Development of adhesives with low warpage and high thermal conductivity

Download FREE Sample Report: Global Substrate Film Adhesive Market – View in Detailed Research Report

---

6️⃣ 5. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Silicone-based film adhesives and die-bonding films

Shin-Etsu is one of the world’s leading silicone manufacturers, and its expertise extends to high-purity silicone-based adhesives for electronics. These materials offer superior flexibility, UV resistance, and thermal stability, making them ideal for applications involving significant thermal expansion differences between substrates, such as in power electronics and LED packaging.

Technology Initiatives:

• Focus on high-thermal-conductivity silicone adhesives for power devices

• Development of optically clear adhesives (OCAs) for display bonding

---

5️⃣ 6. 3M Company

Headquarters: St. Paul, Minnesota, USA
Key Offering: 3M™ Adhesive Transfer Tapes and specialty bonding films

3M’s extensive portfolio of adhesive technologies includes a wide array of film adhesives designed for electronics manufacturing. Their products are used for bonding displays, touch panels, and various components within devices, offering high clarity, durability, and consistent performance. 3M is known for its innovation in pressure-sensitive adhesive (PSA) films that enable efficient and reliable assembly processes.

Technology Initiatives:

• Adhesives for wearable electronics and flexible hybrid electronics (FHE)

• Development of thermally conductive but electrically insulating bonding tapes

---

4️⃣ 7. Master Bond Inc.

Headquarters: Hackensack, New Jersey, USA
Key Offering: Epoxy, silicone, and UV-curable film adhesives

Master Bond specializes in the formulation and manufacturing of high-performance adhesives, sealants, and coatings. Their substrate film adhesives are engineered for demanding applications in aerospace, medical electronics, and telecommunications, where resistance to extreme temperatures, chemicals, and thermal cycling is essential.

Technology Initiatives:

• Custom formulations to meet specific customer requirements for thermal and electrical properties

• Focus on one-part, heat-curable systems for simplified processing

---

3️⃣ 8. Sika AG

Headquarters: Baar, Switzerland
Key Offering: SikaMax® and SikaForce® bonding films for specialized applications

While Sika is widely recognized in construction and automotive sealing, its advanced materials division serves the electronics industry with robust bonding solutions. Sika’s film adhesives are used in applications requiring strong, durable bonds between dissimilar materials, such as in sensor housing, battery pack assembly, and electronic control unit (ECU) manufacturing.

Technology Initiatives:

• Development of adhesives for EMI/RFI shielding applications

• Expansion into thermal interface materials (TIMs) for electronics cooling

---

2️⃣ 9. DELO Industrie Klebstoffe GmbH & Co. KGaA

Headquarters: Windach, Germany
Key Offering: DELO MONOPOX and DELO DUALBOND light-curing film adhesives

DELO is a specialist in high-tech adhesives, particularly light-curing systems that offer rapid processing speeds ideal for high-volume electronics production. Their substrate film adhesives provide precise application control, high bond strength, and excellent resistance to environmental factors, making them suitable for miniaturized components and MEMS (Micro-Electro-Mechanical Systems) packaging.

Technology Initiatives:

• Pioneering work in light-curing adhesives for automated assembly lines

• Development of adhesives with very low ionic impurity levels for sensitive semiconductor applications

---

1️⃣ 10. NAMICS Corporation

Headquarters: Niigata, Japan
Key Offering: Anisotropic Conductive Films (ACFs), Non-Conductive Films (NCFs)

NAMICS is a leading global supplier of interconnection materials, especially Anisotropic Conductive Films which are critical for bonding driver ICs to glass panels in displays and connecting fine-pitch components. Their substrate film adhesives enable high-density interconnections with excellent electrical performance and mechanical reliability, which are essential for modern smartphones, tablets, and automotive displays.

Technology Initiatives:

• Innovation in fine-pitch bonding technologies for next-generation displays

• Development of low-temperature curing films for heat-sensitive components

Read Full Report: Global Substrate Film Adhesive Market – View in Detailed Research Report

---

🌍 Outlook: The Future of Substrate Film Adhesives is Smarter and More Integrated

The substrate film adhesive market is undergoing a significant transformation, driven by the relentless push for electronics miniaturization, higher performance, and greater reliability. The materials are evolving from simple bonding agents into multifunctional components that contribute to thermal management, electrical performance, and structural integrity.

📈 Key Trends Shaping the Market:

• Rising demand for adhesives compatible with advanced packaging like 2.5D/3D IC integration and chiplets

• Increasing requirements for low-temperature processes to accommodate heat-sensitive organic substrates and components

• Integration of thermally conductive fillers to manage heat dissipation in high-power devices

• Development of halogen-free and environmentally sustainable adhesive formulations to meet regulatory standards

Read Full Report: Global Substrate Film Adhesive Market – View in Detailed Research Report

The companies profiled are not merely supplying adhesives—they are providing the enabling technologies that underpin the next wave of electronic innovation, from AI servers and autonomous vehicles to foldable displays and IoT devices.