The Global DDAF Film Market was valued at USD 298.6 Million in 2023 and is projected to reach USD 452.8 Million by 2029, growing at a Compound Annual Growth Rate (CAGR) of 7.2% during the forecast period (2024–2029). This robust growth is primarily driven by the relentless miniaturization of semiconductor devices, the global expansion of 5G infrastructure, increasing demand for advanced consumer electronics, and the accelerating adoption of high-performance computing solutions.

As the semiconductor industry advances toward more compact and powerful chip designs, the critical role of Dicing Die Attach Film (DDAF) in ensuring reliable and efficient assembly processes has come to the forefront. This specialized adhesive film, used in combination with dicing tape, is essential for securing semiconductor dies during the dicing process and their subsequent attachment to substrates. In this blog, we profile the Top 10 Companies in the DDAF Film Industry—a group of material science innovators and specialty chemical leaders shaping the future of electronics manufacturing.

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🔟 1. Showa Denko Materials

Headquarters: Tokyo, Japan
Key Offering: Non-Conductive DDAF, Conductive DDAF, Specialty Adhesive Films

Showa Denko Materials (formerly Hitachi Chemical) is a global leader in advanced materials for the semiconductor industry. Their DDAF products are renowned for high thermal stability, strong adhesion, and exceptional reliability, making them a preferred choice for packaging advanced logic and memory chips.

Technological Innovations:

• Development of ultra-thin DDAF for 3D IC packaging

• Advanced materials for high-frequency 5G applications

• Focus on halogen-free and environmentally friendly formulations

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9️⃣ 2. Henkel Adhesives

Headquarters: Düsseldorf, Germany
Key Offering: LOCTITE® DDAF, Non-Conductive Adhesives, Thermally Conductive Films

Henkel is a powerhouse in adhesive technologies, with a significant presence in the electronics assembly market. Their LOCTITE brand DDAF films offer superior performance for a wide range of semiconductor packages, from small-outline integrated circuits to complex system-in-package designs.

Technological Innovations:

• High-thermal-conductivity films for power electronics

• Rapid-cure formulations for high-volume manufacturing

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8️⃣ 3. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: ELECRYL® DDAF, Dicing Tapes, Wafer Back Grinding Tapes

Nitto Denko is a specialist in precision tapes and films for the semiconductor industry. The company offers a comprehensive portfolio of DDAF products designed for various wafer types and dicing processes, ensuring high yield and reliability in chip manufacturing.

Technological Innovations:

• Integration of dicing tape and DDAF for process simplification

• UV-curable adhesive systems for easy die pickup

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7️⃣ 4. LINTEC Corporation

Headquarters: Tokyo, Japan
Key Offering: Adwill DDAF Series, Semiconductor Process Tapes

LINTEC Corporation is a leading manufacturer of adhesive products, including a specialized range of DDAF films under its Adwill brand. Their products are engineered to meet the demanding requirements of next-generation semiconductor packaging, including fine-pitch applications.

Technological Innovations:

• Low-outgassing films for sensitive MEMS and sensor applications

• High-precision films for wafer-level packaging

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6️⃣ 5. Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: DAF (Die Attach Film), Advanced Electronic Materials

The Furukawa Electric Group develops and manufactures a wide array of electronic materials, including high-performance DDAF. Their expertise in material science allows them to create films with optimized properties for thermal management and mechanical stability in harsh operating environments.

Technological Innovations:

• Thermally conductive DDAF for automotive power modules

• Developments in lead-free and RoHS-compliant materials

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5️⃣ 6. LG Chem

Headquarters: Seoul, South Korea
Key Offering: Semiconductor Adhesive Films, Encapsulants, Advanced Materials

LG Chem, a major global chemical company, has a growing portfolio of materials for the electronics industry. Their DDAF offerings are part of a broader strategy to supply critical materials for the semiconductor supply chain, leveraging their expertise in polymer science.

Technological Innovations:

• Investment in R&D for next-generation packaging materials

• Expansion of production capacity for electronic chemicals

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4️⃣ 7. AI Technology, Inc.

Headquarters: Princeton, New Jersey, USA
Key Offering: Specialty DDAF, Thermally Conductive Adhesives, Low-Stress Encapsulants

AI Technology is a specialty materials company focused on developing advanced adhesives and films for demanding electronic applications. Their DDAF products are known for solving complex assembly challenges, particularly in high-reliability sectors like aerospace and defense.

Technological Innovations:

• Custom-formulated films for specific application requirements

• Focus on materials with extended temperature range performance

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3️⃣ 8. Dow Chemical Company

Headquarters: Midland, Michigan, USA
Key Offering: DOW™ Electronic Materials, Specialty Adhesives

Dow brings its vast expertise in polymer science to the semiconductor packaging market. Their electronic materials division develops advanced DDAF solutions that address the evolving needs of chip manufacturers for higher performance and reliability.

Technological Innovations:

• Development of sustainable material solutions

• Collaborations with leading semiconductor manufacturers

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2️⃣ 9. DuPont de Nemours, Inc.

Headquarters: Wilmington, Delaware, USA
Key Offering: DuPont™ DDAF, Interconnect Solutions, Advanced Packaging Materials

DuPont is a long-standing innovator in materials science, with a strong presence in the electronics industry. Their DDAF products are designed to meet the stringent requirements of advanced semiconductor packaging, offering excellent thermal and electrical properties.

Technological Innovations:

• Materials enabling heterogeneous integration

• Solutions for high-density fan-out wafer-level packaging

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1️⃣ 10. Indium Corporation

Headquarters: Clinton, New York, USA
Key Offering: Specialty Die Attach Materials, Solder Pastes, Thermal Interface Materials

Indium Corporation specializes in materials for electronics assembly, including innovative DDAF solutions. While traditionally known for solders and pastes, the company has expanded its portfolio to include advanced film adhesives for semiconductor packaging applications.

Technological Innovations:

• Expertise in materials for power semiconductor devices

• Custom formulations for unique assembly challenges

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🌍 Outlook: The Future of DDAF Film Is Smarter and More Integrated

The DDAF film market is undergoing a significant transformation. As semiconductor packages become more complex and demanding, material suppliers are innovating to provide films that offer not just adhesion but also enhanced thermal management, electrical properties, and process compatibility.

📈 Key Trends Shaping the Market:

• Increasing demand for ultra-thin DDAF for 3D IC and chiplet integration

• Growth in thermally conductive DDAF for high-power applications like EVs and 5G base stations

• Development of films compatible with panel-level packaging technologies

• Focus on environmentally friendly, halogen-free material formulations

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DDAF Film Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials for semiconductor manufacturing—they’re enabling the next generation of electronic devices that will power our connected world.