The Global Heat Dissipation Materials Market was valued at USD 16.8 Billion in 2024 and is projected to reach USD 25.9 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 7.5% during the forecast period (2024–2030). This robust growth is fueled by the escalating power density of electronics in data centers, electric vehicles (EVs), 5G infrastructure, and consumer devices, driving unprecedented demand for efficient thermal management solutions.

As electronic components become more powerful and compact, effective heat dissipation is no longer a luxury but a critical requirement for performance, reliability, and longevity. In this blog, we profile the Top 10 Companies in the Heat Dissipation Materials Industry—a group of chemical giants, material science innovators, and thermal engineering specialists shaping the future of electronic cooling.

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🔟 1. 3M Company

Headquarters: St. Paul, Minnesota, USA
Key Offering: Thermally Conductive Tapes, Adhesives, Gap Fillers, Phase Change Materials

3M is a global leader in material science, with a comprehensive portfolio of thermal management solutions. Its products are critical in a wide array of applications, from smartphones and laptops to automotive power electronics and telecommunications equipment, ensuring heat is efficiently transferred away from sensitive components.

Innovation Initiatives:

• Development of high-performance thermally conductive adhesive tapes

• Advanced gap filler materials for irregular surface interfaces

• Focus on sustainable and halogen-free material formulations

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9️⃣ 2. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Thermal Interface Materials (TIMs), Potting Compounds, Gap Pads

Henkel’s electronics materials division, particularly through its Bergquist and Loctite brands, is a dominant force in thermal management. The company provides essential materials that bridge the microscopic gaps between heat-generating components and heat sinks, maximizing thermal conductivity and device efficiency.

Innovation Initiatives:

• Leading portfolio of thermally conductive adhesives and gels

• Innovations in phase-change materials and graphite sheets

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8️⃣ 3. Boyd Corporation

Headquarters: Pleasanton, California, USA
Key Offering: Aavid Thermal Products, Elastomeric Pads, Heat Sinks, Liquid Cooling Plates

Boyd Corporation, following its acquisition of Aavid Thermal, is a premier provider of comprehensive thermal management solutions. The company specializes in engineering and manufacturing advanced heat sinks, liquid cold plates, and integrated thermal systems for high-performance computing and automotive applications.

Innovation Initiatives:

• Custom-engineered two-phase liquid cooling systems

• Lightweight, high-performance heat sinks for aerospace and defense

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7️⃣ 4. Parker Hannifin Corporation

Headquarters: Cleveland, Ohio, USA
Key Offering: Chomerics Thermal Materials, Thermoplastics, EMI Shielding

Parker Hannifin’s Chomerics division is a key player in thermally conductive materials, often integrating thermal management with electromagnetic interference (EMI) shielding. Their products are vital for protecting sensitive electronics in harsh environments, from automotive radar to medical imaging systems.

Innovation Initiatives:

• Multifunctional materials providing both thermal conduction and EMI shielding

• Silicone-free thermal gap pads for challenging applications

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6️⃣ 5. DuPont de Nemours, Inc.

Headquarters: Wilmington, Delaware, USA
Key Offering: Bergquist-brand TIMs, Kapton® Polyimide Films, Thermally Conductive Plastics

Following its acquisition of a significant portion of the DuPont electronics business, which included the Bergquist brand, DuPont remains a powerhouse. The company offers a wide range of high-performance polymers and thermal interface materials critical for managing heat in next-generation electronics.

Innovation Initiatives:

• Development of high-temperature stable polyimide films

• Advanced thermally conductive plastics for lightweighting

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5️⃣ 6. Laird Performance Materials

Headquarters: London, United Kingdom
Key Offering: Tflex™ Thermal Materials, Graphite Sheets, Thermal Tapes

Laird Performance Materials, now part of a private equity group, continues to be a leading global supplier of high-performance thermal management and EMI shielding solutions. Their Tflex™ series of gap fillers and thermally conductive tapes are industry standards for reliability and performance.

Innovation Initiatives:

• Pyrathon™ pyrolytic graphite sheets for ultra-high thermal conductivity

• Soft, conformable gap filler pads for high-power density applications

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4️⃣ 7. BASF SE

Headquarters: Ludwigshafen, Germany
Key Offering: Elastollan® Thermoplastic Polyurethanes, Epoxy Systems, Ceramic Fillers

As a global chemical leader, BASF develops advanced materials that form the basis for many thermal management products. Its specialty plastics, epoxy molding compounds, and high-purity ceramic fillers are engineered to enhance the thermal conductivity of composites and polymer systems used across industries.

Innovation Initiatives:

• Development of plastic compounds with high thermal conductivity for LED lighting

• Innovations in fillers like boron nitride for high-performance TIMs

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3️⃣ 8. Fujipoly

Headquarters: Yokohama, Japan
Key Offering: Sarcon® Thermal Pads, Soft Silicone Pads, Gap Filler Pads

Fujipoly is a renowned Japanese manufacturer specializing in high-performance silicone rubber products, including its industry-leading Sarcon® series of thermal interface materials. The company’s products are known for their exceptional softness, high thermal conductivity, and reliability in demanding conditions.

Innovation Initiatives:

• Ultra-soft thermal pads for low-pressure applications

• Materials designed for high-volume automated assembly processes

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2️⃣ 9. Mitsubishi Chemical Corporation

Headquarters: Tokyo, Japan
Key Offering: PyroMide™ Polyimide Films, Graphite Sheets, Carbon-Based Materials

Mitsubishi Chemical leverages its expertise in carbon and advanced polymers to produce high-end thermal management materials. Its pyrolytic graphite sheets offer anisotropic thermal conductivity, making them ideal for spreading heat laterally in thin, compact devices like smartphones and tablets.

Innovation Initiatives:

• Advanced carbon-based materials for extreme heat flux management

• High-temperature polyimide films for automotive and aerospace electronics

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1️⃣ 10. H.B. Fuller Company

Headquarters: St. Paul, Minnesota, USA
Key Offering: Thermally Conductive Adhesives, Encapsulants, Potting Compounds

H.B. Fuller is a leading global adhesives provider, with a strong focus on electronics assembly. Its tailored thermal management adhesives and encapsulants protect sensitive components from heat and environmental stress, ensuring the durability and performance of electronics in automotive, industrial, and consumer applications.

Innovation Initiatives:

• Formulating high-reliability adhesives for electric vehicle battery packs

• Developing fast-curing systems for high-throughput manufacturing

Get Full Report Here: Heat Dissipation Materials Market – View in Detailed Research Report

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🌍 Outlook: The Future of Heat Dissipation Is Smarter and More Integrated

The heat dissipation materials market is undergoing a fundamental transformation. As power densities continue to climb with the advent of AI servers, wide-bandgap semiconductors in EVs, and advanced 5G mmWave technology, the demand for more efficient, thinner, and multifunctional thermal solutions is intensifying.

📈 Key Trends Shaping the Market:

• Shift towards liquid cooling and two-phase systems for high-performance computing

• Increasing use of synthetic graphite and vapor chambers in consumer electronics

• Rising demand for thermally conductive plastics to replace metals for weight reduction

• Integration of thermal management into the early design stages of electronic products

Get Full Report Here: Heat Dissipation Materials Market – View in Detailed Research Report

The companies listed above are not merely supplying materials—they are enabling the next generation of technological innovation by ensuring electronics can run cooler, faster, and more reliably.

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