The Global High Frequency and High Speed Copper Foil Market was valued at USD 4.73 Billion in 2024 and is projected to reach USD 7.21 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.8% during the forecast period (2024–2030). This robust growth is fueled by the exponential demand for high-performance electronics, the global rollout of 5G infrastructure, the proliferation of automotive electronics, and the increasing adoption of advanced server technologies for AI and data centers.

As the backbone of modern printed circuit boards (PCBs), high frequency and high speed copper foil is critical for signal integrity in an increasingly connected world. In this blog, we profile the Top 10 Companies in the High Frequency and High Speed Copper Foil Industry—a group of material science innovators and manufacturing leaders shaping the future of electronic performance and miniaturization.

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High Frequency and High Speed Copper Foil Market – View in Detailed Research Report

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🔟 1. Mitsui Mining & Smelting Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-Thin Rolled Copper Foil, High-Performance Electrolytic Copper Foil

Mitsui Mining & Smelting is a global leader in advanced materials, with a significant market share in high-end copper foils. The company’s products are essential for high-frequency applications in telecommunications equipment, automotive radar, and high-speed server motherboards.

Innovation and Production Initiatives:

• Development of ultra-low profile (ULP) foils for enhanced signal transmission

• Expansion of production capacity to meet surging demand from the 5G and automotive sectors

• Strategic R&D focus on next-generation foils for substrates like mSAP (modified Semi-Additive Process)

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9️⃣ 2. JX Nippon Mining & Metals Corporation

Headquarters: Tokyo, Japan
Key Offering: Hyper Very Low Profile (HVLP) Electrolytic Copper Foil, Reverse-Treated Foil (RTF)

JX Nippon Mining & Metals is renowned for its high-purity copper foils that deliver exceptional performance in high-speed digital circuits. The company’s products are critical for manufacturing PCBs used in smartphones, network routers, and advanced computing systems.

Innovation and Production Initiatives:

• Pioneering HVLP foil technology for reduced signal loss

• Strong focus on sustainability with eco-friendly manufacturing processes

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8️⃣ 3. Nan Ya Plastics Corporation

Headquarters: Taipei, Taiwan
Key Offering: Standard and High-Performance Electrolytic Copper Foil

As a subsidiary of the Formosa Plastics Group, Nan Ya Plastics is one of the world’s largest producers of copper foil. The company supplies a vast portfolio of products for various applications, with a growing emphasis on high-frequency and high-speed grades for the communications and computing markets.

Innovation and Production Initiatives:

• Significant capital investment in new production lines for high-end foil

• Vertically integrated operations from copper refining to foil production

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7️⃣ 4. Fukuda Metal Foil & Powder Co., Ltd.

Headquarters: Kyoto, Japan
Key Offering: Precision Rolled Copper Foil, Ultra-Thin Foil for FPCs

Fukuda specializes in high-precision rolled copper foils, which are known for their superior flexibility and smooth surface, making them ideal for high-frequency flexible printed circuits (FPCs) used in wearable devices and high-frequency connectors.

Innovation and Production Initiatives:

• Expertise in producing foils as thin as 3 microns

• Focus on high-purity, low-roughness foils for superior electrical performance

Download FREE Sample Report:
High Frequency and High Speed Copper Foil Market – View in Detailed Research Report

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6️⃣ 5. The Furukawa Electric Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: High-Speed Electrolytic Copper Foil (e.g., FT-2 Series)

Furukawa Electric is a key innovator in materials for the electronics industry. Its high-speed copper foils are designed to minimize transmission loss and are widely used in high-frequency communication base stations, high-performance servers, and automotive ADAS (Advanced Driver-Assistance Systems).

Innovation and Production Initiatives:

• Proprietary surface treatment technologies for improved bond strength and low signal loss

• Active collaboration with PCB manufacturers to develop application-specific solutions

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5️⃣ 6. Doosan Corporation Electro-Materials (Doosan ENC)

Headquarters: Seoul, South Korea
Key Offering: Electrolytic Copper Foil for HDI and IC Substrates

Doosan ENC is a major South Korean player with a strong focus on copper foils for high-density interconnect (HDI) PCBs and integrated circuit (IC) substrates. Its products are crucial for the miniaturization and performance enhancement of electronic devices.

Innovation and Production Initiatives:

• Investment in R&D for ultra-thin foils for advanced packaging

• Expansion strategies to capture market share in the growing semiconductor substrate market

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4️⃣ 7. Co-Tech Development Corp.

Headquarters: Taoyuan City, Taiwan
Key Offering: Lithium Battery Copper Foil, High-Performance PCB Copper Foil

Co-Tech is a significant Taiwanese manufacturer with a diverse product portfolio. While known for lithium battery foils, the company has strategically expanded into high-performance PCB copper foils, catering to the demands of the 5G and automotive electronics sectors.

Innovation and Production Initiatives:

• Capacity expansion for high-end PCB foil to diversify revenue streams

• Focus on cost-competitive manufacturing while maintaining quality standards

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3️⃣ 8. Guangdong Chaohua Technology Co., Ltd.

Headquarters: Shaoguan, Guangdong, China
Key Offering: Standard and High-Frequency Electrolytic Copper Foil

As a leading Chinese producer, Guangdong Chaohua Technology has rapidly scaled its operations. The company is central to China’s push for self-sufficiency in critical electronic materials, supplying foils for a wide range of domestic electronics manufacturers.

Innovation and Production Initiatives:

• Rapid expansion of production capacity to serve the domestic market

• Government-backed initiatives to advance high-frequency foil technology

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2️⃣ 9. Chang Chun Group

Headquarters: Taipei, Taiwan
Key Offering: Electrolytic Copper Foil for PCBs and Lithium Batteries

Chang Chun Group is a diversified chemical company with a strong presence in the copper foil market. It supplies reliable copper foils for various PCB applications, with increasing focus on products suitable for higher frequency requirements.

Innovation and Production Initiatives:

• Investment in upgrading existing facilities to produce higher-value foils

• Leveraging chemical expertise to develop advanced surface treatments

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1️⃣ 10. Kingboard Holdings Limited

Headquarters: Hong Kong
Key Offering: Laminates, PCBs, and Copper Foil

Kingboard is a vertically integrated conglomerate that produces laminates, PCBs, and the essential copper foil that goes into them. This integration gives the company a unique advantage in understanding and meeting the evolving material needs of the PCB industry, including for high-speed applications.

Innovation and Production Initiatives:

• Vertical integration allows for tight control over material quality and supply chain

• Strategic focus on developing copper foils compatible with its high-performance laminate products

Read Full Report:
High Frequency and High Speed Copper Foil Market – View in Detailed Research Report

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🌍 Outlook: The Future of Electronics Relies on Advanced Copper Foil

The high frequency and high speed copper foil market is at the heart of the digital transformation. As data rates accelerate and devices become more sophisticated, the demand for foils with lower signal loss, higher thermal reliability, and thinner profiles will only intensify.

📈 Key Trends Shaping the Market:

• 5G & 6G Deployment: Massive infrastructure build-out requiring low-loss materials for base station PCBs and mobile devices.

• AI and Data Centers: Explosive growth in high-performance computing demands copper foils that can handle extreme data speeds in server motherboards and switches.

• Automotive Electrification: Advanced driver-assistance systems (ADAS), in-vehicle networking, and electric vehicle powertrains require highly reliable PCBs.

• Advanced Packaging: The shift towards heterogeneous integration in semiconductors is driving need for ultra-thin foils in IC substrates.

Read Full Report:
High Frequency and High Speed Copper Foil Market – View in Detailed Research Report

The companies listed above are not only supplying a critical material—they are enabling the technological leaps that define our connected future.