The Global 2D IC Flip Chip Product Market was valued at USD 26.5 Billion in 2023 and is projected to reach USD 39.8 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.2% during the forecast period (2024–2030). This robust growth is fueled by the escalating demand for high-performance computing, advanced consumer electronics, and the widespread adoption of Artificial Intelligence (AI) and 5G technologies, all of which rely on the superior performance and miniaturization capabilities of flip chip packaging solutions.

As the semiconductor industry relentlessly pursues greater power efficiency, bandwidth, and form factor reduction, the spotlight intensifies on the key packaging and foundry leaders driving innovation. In this blog, we profile the Top 10 Companies in the 2D IC Flip Chip Product Industry—a group of integrated device manufacturers (IDMs), foundries, and outsourced semiconductor assembly and test (OSAT) providers that are shaping the future of microelectronics.

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🔟 1. Intel Corporation

Headquarters: Santa Clara, California, USA
Key Offering: Advanced Flip Chip Packaging (e.g., Foveros, EMIB)

Intel is a pioneer and a dominant force in the flip chip market, utilizing the technology extensively across its CPU, GPU, and chipset portfolios. The company’s advanced packaging technologies, such as Foveros for 3D stacking and Embedded Multi-die Interconnect Bridge (EMIB) for 2.5D integration, are industry benchmarks for performance and integration density.

Innovation Initiatives:

• Investment in next-generation hybrid bonding for sub-10µm pitch interconnects
• Development of advanced thermal interface materials for high-power applications
• Expansion of its advanced packaging manufacturing capacity in the US and globally

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9️⃣ 2. Taiwan Semiconductor Manufacturing Company (TSMC)

Headquarters: Hsinchu, Taiwan
Key Offering: Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS)

As the world’s largest dedicated semiconductor foundry, TSMC is a critical enabler of flip chip technology for fabless companies. Its InFO and CoWoS packaging platforms are essential for high-performance applications, including Apple’s A-series and M-series chips and leading AI accelerators from NVIDIA and AMD.

Innovation Initiatives:

• Leading the transition to CoWoS-L (Local Silicon Interconnect) for enhanced performance
• Scaling production capacity for advanced packaging to meet soaring AI-driven demand
• Continuous R&D in wafer-level packaging for improved yield and cost-efficiency

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8️⃣ 3. Samsung Electronics

Headquarters: Suwon, South Korea
Key Offering: I-Cube (2.5D) and X-Cube (3D) Flip Chip Technologies

Samsung’s semiconductor business is a major player in both memory and logic, with advanced flip chip packaging playing a crucial role. Its I-Cube and X-Cube technologies allow for the heterogeneous integration of logic, high-bandwidth memory (HBM), and other chiplets, catering to the needs of data center and mobile applications.

Innovation Initiatives:

• Aggressive ramp-up of HBM and 2.5D packaging capacity for AI semiconductors
• Development of bumpless interconnect technology to reduce resistance and power consumption
• Focus on thermal management solutions for next-generation 3nm and 2nm nodes

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Global 2D IC Flip Chip Product Market – View in Detailed Research Report

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7️⃣ 4. ASE Group (Advanced Semiconductor Engineering)

Headquarters: Kaohsiung, Taiwan
Key Offering: Fan-Out Chip-on-Substrate (FOCoS) and Flip Chip Ball Grid Array (FC-BGA)

ASE Group is the world’s largest OSAT provider and a titan in flip chip packaging. It offers a comprehensive portfolio of 2D and 2.5D flip chip solutions, serving a vast array of customers in networking, automotive, and computing. Its scale and manufacturing expertise make it a vital link in the global semiconductor supply chain.

Innovation Initiatives:

• Expansion of FOCoS-B (Bridge) technology for high-performance computing
• Investments in advanced substrates and copper pillar bumping processes
• Development of panel-level fan-out packaging for cost reduction

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6️⃣ 5. Amkor Technology, Inc.

Headquarters: Tempe, Arizona, USA
Key Offering: Silicon Wafer Integrated Fan-Out (SWIFT®) and Package-on-Package (PoP)

Amkor Technology is a leading provider of advanced flip chip packaging, with a strong focus on automotive and communication applications. The company’s SWIFT® technology offers a high-performance, cost-effective alternative to 2.5D interposers, while its flip chip PoP is widely used in mobile devices.

Innovation Initiatives:

• Strengthening its position in the automotive sector with qualified flip chip solutions for ADAS
• R&D in ultra-fine pitch interconnects for next-generation node integration
• Strategic partnerships with substrate suppliers to ensure a resilient supply chain

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5️⃣ 6. United Microelectronics Corporation (UMC)

Headquarters: Hsinchu, Taiwan
Key Offering: Foundry Services with Flip Chip Packaging Support

While primarily a leading semiconductor foundry, UMC provides robust flip chip packaging solutions through its partners and internal capabilities for its specialty technology offerings. It plays a significant role in serving markets that require reliable, cost-effective flip chip solutions, such as display drivers and connectivity chips.

Innovation Initiatives:

• Focus on flip chip technologies for its 28nm and 22nm specialty processes
• Collaborations with OSAT partners to offer integrated foundry and packaging services
• Development of solutions for IoT and automotive applications requiring high reliability

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4️⃣ 7. Powertech Technology Inc. (PTI)

Headquarters: Hsinchu, Taiwan
Key Offering: Memory-focused Flip Chip Packaging and Testing

Powertech Technology is a major OSAT player with a strong foothold in memory packaging, particularly for NAND Flash and DRAM. The company’s flip chip capabilities are essential for packaging high-speed memory devices, including those used in servers and storage systems.

Innovation Initiatives:

• Expansion of capacity for flip-chip scale package (FCSP) for memory applications
• Investment in advanced testing solutions for high-bandwidth memory (HBM)
• Focus on providing turnkey solutions for memory manufacturers

Download FREE Sample Report:
Global 2D IC Flip Chip Product Market – View in Detailed Research Report

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3️⃣ 8. JCET Group (Jiangsu Changjiang Electronics Technology)

Headquarters: Jiangyin, Jiangsu, China
Key Offering: High-Density Fan-Out (HDFO) and Flip Chip System-in-Package (SiP)

JCET Group is China’s largest and the world’s third-largest OSAT company. It has aggressively advanced its flip chip packaging portfolio, acquiring STATS ChipPAC to gain significant technological expertise. JCET is a key supplier for many Chinese fabless companies and international players seeking a diversified supply chain.

Innovation Initiatives:

• Development of its eSinO™ (embedded Silicon fan-Out) platform for 2.5D applications
• Significant capital expenditure to ramp up advanced flip chip packaging capacity
• Focus on SiP solutions that combine multiple chips into a single flip chip package

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2️⃣ 9. Texas Instruments (TI)

Headquarters: Dallas, Texas, USA
Key Offering: Flip Chip for Analog and Embedded Processors

As a leading IDM, Texas Instruments extensively uses flip chip packaging for its high-performance analog and embedded processing products. This technology enables better thermal performance and electrical characteristics for applications in industrial, automotive, and personal electronics.

Innovation Initiatives:

• Internal development of flip chip processes optimized for its analog semiconductor portfolio
• Focus on copper pillar bumping for improved reliability and miniaturization
• Investment in internal manufacturing capacity to ensure supply chain control

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1️⃣ 10. Tongfu Microelectronics Co., Ltd.

Headquarters: Nantong, Jiangsu, China
Key Offering: FC-BGA and FC-CSP Packaging Services

Tongfu Microelectronics is a rapidly growing Chinese OSAT company with a strong focus on advanced packaging, including flip chip Ball Grid Array (FC-BGA) and flip chip Chip Scale Package (FC-CSP). It is a strategic partner for many domestic semiconductor companies and is expanding its global footprint.

Innovation Initiatives:

• Massive investments in new facilities dedicated to high-end FC-BGA packaging
• Strategic cooperation with foundries and design houses in China’s semiconductor ecosystem
• Development of packaging solutions for AI and data center applications

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Global 2D IC Flip Chip Product Market – View in Detailed Research Report

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🔬 Outlook: The Future of 2D IC Flip Chip Technology Is Heterogeneous and High-Performance

The 2D IC flip chip market is at a pivotal point. While conventional flip chip on substrate remains the workhorse for many applications, the industry is rapidly evolving toward more complex 2.5D and 3D integration schemes, advanced substrates, and new interconnect materials to keep pace with Moore’s Law and the demands of AI.

📈 Key Trends Shaping the Market:

• Explosive demand for CoWoS and other 2.5D packaging for AI/ML GPUs and accelerators
• Transition from organic substrates to glass and silicon interposers for finer interconnect pitches
• Rise of Chiplet-based designs, fuelling the need for advanced flip chip assembly
• Increased focus on thermal management solutions as power densities continue to rise

Get Full Report Here:
Global 2D IC Flip Chip Product Market – View in Detailed Research Report

The companies listed above are not only packaging the world’s most advanced semiconductors—they’re enabling the heterogeneous integration that will define the next decade of computing.