The Global Semiconductor Packaging Adhesives Market was valued at USD 1.86 Billion in 2023 and is projected to reach USD 2.65 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.2% during the forecast period (2024–2030). This growth is being driven by the exponential expansion of semiconductor applications in automotive electronics, 5G infrastructure, consumer electronics, and artificial intelligence systems.

As the semiconductor industry transforms toward miniaturization, higher performance, and increased reliability, the spotlight is on the key adhesive suppliers who are driving innovation, thermal management, and advanced bonding solutions. In this blog, we profile the Top 10 Companies in the Semiconductor Packaging Adhesives Industry—a mix of chemical giants, specialized manufacturers, and material science pioneers shaping the future of global electronics.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Epoxy Molding Compounds, Die-Attach Adhesives, Thermal Interface Materials

Henkel is a global leader in semiconductor packaging adhesives, offering comprehensive solutions for die attachment, encapsulation, and thermal management. Their LOCTITE and BERGYLUX product lines serve leading semiconductor manufacturers worldwide with materials designed for advanced packaging applications like Flip-Chip and Fan-Out Wafer Level Packaging (FOWLP).

Technology Leadership:

• Advanced epoxy compounds for high-reliability automotive applications
• Low-stress, high-thermal conductivity adhesives for power devices
• Green products with reduced environmental impact

Download FREE Sample Report: Semiconductor Packaging Adhesives Market – View in Detailed Research Report

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9️⃣ 2. Panasonic Corporation

Headquarters: Osaka, Japan
Key Offering: Liquid Encapsulants, Underfill Materials, Die-Attach Films

Panasonic Industrial Solutions provides semiconductor manufacturers with high-performance adhesive solutions including thermal interface materials, electrically conductive adhesives, and advanced epoxy molding compounds for automotive-grade applications.

Technology Leadership:

• High-purity materials for 5G and IoT applications
• Low-alpha particle adhesives for enhanced reliability

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8️⃣ 3. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Epoxy Molding Compounds, Liquid Encapsulation Resins

Sumitomo Bakelite specializes in high-performance thermoset plastics and epoxy molding compounds for semiconductor encapsulation, offering materials with exceptional thermal stability and moisture resistance for automotive and industrial applications.

Technology Leadership:

• Developed ultra-low CTE (Coefficient of Thermal Expansion) materials

• Environmentally friendly halogen-free products

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7️⃣ 4. DELO Industrial Adhesives

Headquarters: Windach, Germany
Key Offering: UV-Curable Adhesives, Thermally Conductive Adhesives, Underfill Materials

DELO provides specialty adhesives for microelectronics and semiconductor packaging, focusing on high-performance solutions for MEMS, sensors, and optoelectronics applications.

Technology Leadership:

• High-precision dispensing technologies
• Adhesives for extreme temperature applications (-55°C to +200°C)

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6️⃣ 5. Master Bond Inc

Headquarters: Hackensack, New Jersey, USA
Key Offering: One-Component Epoxy Systems, Thermally Conductive Adhesives, UV Curable Adhesives

Master Bond develops high-performance adhesives, sealants, and coatings for semiconductor packaging, emphasizing thermal management and electrical performance.

Technology Leadership:

• High-temperature resistant formulations (up to 600°F)
• Custom formulations for specific application requirements

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5️⃣ 6. DuPont

Headquarters: Wilmington, Delaware, USA
Key Offering: Underfill Encapsulants, Die-Attachment Adhesives, Silicone Thermal Gels

DuPont’s electronics portfolio includes advanced materials for semiconductor packaging with excellent thermal conductivity and reliability performance.

Technology Leadership:

• Advanced thermal interface materials for high-power devices
• Low-outgassing formulations for space applications

Download FREE Sample Report: Semiconductor Packaging Adhesives Market – View in Detailed Research Report

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4️⃣ 7. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Liquid Silicone Rubbers, Heat-Dissipating Silicone Greases

Shin-Etsu is a global leader in silicone-based semiconductor packaging adhesives, offering materials with superior flexibility, thermal stability, and electrical insulation properties.

Technology Leadership:

• High-thermal conductivity silicone compounds for power semiconductors

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3️⃣ 8. Nissan Chemical Corporation

Headquarters: Tokyo, Japan
Key Offering: Silicone Adhesives, Epoxy Encapsulants

Nissan Chemical provides specialty adhesive solutions for semiconductor packaging, focusing on high-reliability applications in automotive and industrial sectors with materials that maintain performance under harsh operating conditions.

Technology Leadership:

• Advanced curing technology for rapid processing
• Materials for heterogeneous integration and 3D packaging

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2️⃣ 9. Lord Corporation (Parker Hannifin)

Headquarters: Cary, North Carolina, USA
Key Offering: Thermally Conductive Adhesives, Potting Compounds, Encapsulation Resins

Lord’s adhesive portfolio includes specialized materials for power semiconductor packaging, offering solutions with excellent thermal dissipation and mechanical strength.

Technology Leadership:

• Innovative formulations for automotive electrification
• Materials capable of withstanding thermal cycling and mechanical shock

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1️⃣ 10. Ajinomoto Fine-Techno Co., Inc.

Headquarters: Tokyo, Japan
Key Offering: Build-Up Film (ABF), Non-Conductive Adhesives

Ajinomoto Fine-Techno specializes in innovative adhesive films for semiconductor packaging, particularly recognized for their Ajinomoto Build-up Film used in substrate manufacturing.

Technology Leadership:

• Core material for high-density interconnect substrates
• Materials enabling finer circuit patterning and higher integration density

Get Full Report Here: Semiconductor Packaging Adhesives Market – View in Detailed Research Report

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🌍 Outlook: The Future of Semiconductor Packaging Adhesives Is Smarter and More Integrated

The semiconductor packaging adhesives market is undergoing a fundamental transformation as semiconductor devices continue to increase in complexity, performance requirements, and power density.

📈 Key Trends Shaping the Market:

• Growing demand for high-thermal conductivity adhesives in automotive power modules
• Increasing adoption of advanced packaging technologies like FOWLP and 3D IC
• Expansion of 5G infrastructure driving need for high-frequency packaging materials
• Development of environmentally friendly halogen-free and low-volatile adhesives

Get Full Report Here: Semiconductor Packaging Adhesives Market – View in Detailed Research Report

The companies listed above are not only supplying critical materials for electronics manufacturing—they’re advancing the technological evolution of the semiconductor industry.