The Global Liquid Molding Compounds (LMC) Market was valued at USD 1.58 Billion in 2024 and is projected to reach USD 2.34 Billion by 2030, growing at a Compound Annual Growth Rate (CAGR) of 5.7% during the forecast period (2024–2030). This robust growth trajectory is primarily fueled by escalating demand for advanced semiconductor packaging solutions, rapid expansion of 5G infrastructure, and the accelerating adoption of Fan-Out Wafer Level Packaging (FOWLP) for high-performance computing and IoT applications.

As the electronics manufacturing landscape evolves toward higher integration densities, superior thermal management, and enhanced reliability requirements, material innovators are playing an increasingly critical role. In this comprehensive analysis, we profile the Top 10 Companies in the Liquid Molding Compounds (LMC) Market—a dynamic mix of chemical giants and specialty compounders developing the sophisticated materials enabling next-generation electronics.

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🔟 10. Hitachi Chemical (Showa Denko Materials)

Headquarters: Tokyo, Japan
Key Offering: Semiconductor-grade epoxy molding compounds

Hitachi Chemical, now part of Showa Denko Materials, offers a comprehensive portfolio of high-performance molding compounds tailored for advanced packaging technologies. The company’s materials portfolio supports applications requiring ultra-low warpage and excellent thermal stability.

Innovation Focus:

• Development of low-stress molding compounds
• Specialty formulations for automotive-grade electronics
• Halogen-free and environmentally friendly material systems

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Liquid Molding Compounds (LMC) Market – View in Detailed Research Report

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9️⃣ 9. Hysol (Henkel)

Headquarters: Düsseldorf, Germany
Key Offering: Liquid epoxy molding compounds

Henkel’s Hysol liquid molding compounds provide exceptional protection for semiconductor devices in demanding environments. The company’s materials enable reliable performance across temperature extremes and mechanical stresses.

Innovation Focus:

• Advanced underfill materials for flip-chip applications
• High-reliability formulations for automotive and industrial applications

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8️⃣ 8. SDI (Sumitomo Durez)

Headquarters: Tokyo, Japan
Key Offering: Liquid encapsulants for semiconductor devices

Sumitomo Durez develops specialized epoxy molding compounds with optimized flow characteristics for complex package geometries and fine-pitch interconnects.

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7️⃣ 7. Namics Corporation

Headquarters: Niigata, Japan
Key Offering: High-purity liquid molding compounds

Namics Corporation, a subsidiary of Mitsubishi Chemical Holdings, specializes in high-purity electronic materials for semiconductor packaging.

Innovation Focus:

• Low-alpha particle emission formulations
• Ultra-low CTE materials for large-die applications

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6️⃣ 6. Dexerials Corporation

Headquarters: Tokyo, Japan
Key Offering: Liquid epoxy underfill materials

Dexerials leverages its expertise in adhesive and sealing technologies to develop advanced liquid molding compounds for semiconductor packaging.

Innovation Focus:

• Advanced thermal interface materials
• High-thermal conductivity molding compounds

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5️⃣ 5. Nitto Denko

Headquarters: Osaka, Japan
Key Offering: Liquid encapsulants for optoelectronics

Nitto Denko’s electronics materials division develops specialized liquid molding compounds with exceptional electrical insulation properties and moisture resistance.

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4️⃣ 4. Fujifilm

Headquarters: Tokyo, Japan
Key Offering: Advanced liquid epoxy compounds

Fujifilm has expanded its electronic materials business to include advanced liquid molding compounds for semiconductor packaging applications.

Innovation Focus:

• Nano-filler technology for improved thermal performance
• Low-stress formulations for wafer-level packaging

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3️⃣ 3. Panasonic

Headquarters: Osaka, Japan
Key Offering: Liquid epoxy molding compounds and underfill materials

Panasonic Industry offers a broad range of electronic materials, including liquid molding compounds engineered for high-frequency applications and automotive electronics.

Innovation Focus:

• Development of high-thermal conductivity materials
• Specialized formulations for power semiconductor modules

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2️⃣ 2. Sumitomo Bakelite

Headquarters: Tokyo, Japan
Key Offering: Liquid epoxy compounds for semiconductor packaging

Sumitomo Bakelite develops advanced liquid epoxy molding compounds with enhanced thermal and mechanical properties for demanding semiconductor applications.

Innovation Focus:

• Advanced material formulations for FOWLP applications
• High-reliability materials for automotive and industrial electronics

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1️⃣ 1. Shin-Etsu Chemical

Headquarters: Tokyo, Japan
Key Offering: Semiconductor-grade liquid molding compounds

Shin-Etsu Chemical is a global leader in semiconductor materials, including high-performance liquid molding compounds engineered for advanced packaging technologies.

Innovation Focus:

• Development of ultra-low CTE molding compounds
• Halogen-free formulations for environmental compliance

Download FREE Sample Report:
Liquid Molding Compounds (LMC) Market – View in Detailed Research Report

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🌍 Outlook: The Future of Liquid Molding Compounds Is High-Performance and Sustainable

The liquid molding compounds market is experiencing significant transformation driven by technology advancements in semiconductor packaging and growing demand for reliable electronics in harsh environments.

📈 Key Trends Shaping the Market:

• Increasing adoption of advanced packaging technologies including FOWLP and 2.5D/3D packaging

• Shift toward halogen-free and environmentally friendly formulations

• Growing demand for high-thermal conductivity materials in power electronics

• Expansion of 5G infrastructure driving demand for high-frequency packaging materials

• Rising investment in semiconductor manufacturing capacity globally

Get Full Report Here:
Liquid Molding Compounds (LMC) Market – View in Detailed Research Report

The companies featured above represent the forefront of innovation in liquid molding compounds, developing advanced material solutions that enable the next generation of electronic devices.