The Global Semiconductor Packaging Adhesives Market was valued at USD 2.75 Billion in 2024 and is projected to reach USD 3.93 Billion by 2029, growing at a Compound Annual Growth Rate (CAGR) of 6.8% during the forecast period (2024–2029). This substantial growth is being driven by the rapid expansion of the semiconductor industry, increasing demand for advanced IC packages, and the critical role adhesives play in enhancing device performance, reliability, and thermal management in next-generation electronics.
As the semiconductor industry pivots toward increasingly dense and sophisticated chip architectures—including 2.5D/3D packaging, flip-chip technologies, and heterogeneous integration—the spotlight falls on the leading adhesive manufacturers who are developing innovative bonding solutions for high-performance applications. In this blog, we profile the Top 10 Companies in the Semiconductor Packaging Adhesives Market—a mix of global specialty chemical giants, Japanese material science leaders, and emerging innovators shaping the future of electronic device assembly.
🔟 1. Henkel AG & Co. KGaA
Headquarters: Düsseldorf, Germany
Key Offering: High-performance die attach adhesives, encapsulation compounds, thermal interface materials (TIMs)
Henkel stands as a global market leader in semiconductor packaging adhesives, offering comprehensive material solutions for advanced packaging applications across automotive, consumer electronics, and industrial sectors. Their LOCTITE® and Bergquist product lines provide critical bonding, sealing, and thermal management functions for cutting-edge semiconductor devices.
Innovation Focus:
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Development of low-temperature cure adhesives for heat-sensitive components
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Advanced thermal interface materials for high-power applications
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Next-generation silicone-free adhesives for automotive electronics
Download FREE Sample Report: Semiconductor Packaging Adhesives Market – View in Detailed Research Report
9️⃣ 2. Panasonic Holdings Corporation
Headquarters: Osaka, Japan
Key Offering: Epoxy die attach adhesives, UV-curable adhesives, thermal interface materials
Panasonic’s electronic materials division provides comprehensive adhesive solutions for semiconductor packaging applications, serving global chip manufacturers and OSAT providers with materials for advanced applications.
Innovation Focus:
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Lead-free and halogen-free adhesive formulations
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High-reliability materials for automotive and industrial applications
8️⃣ 3. DuPont de Nemours, Inc.
Headquarters: Wilmington, Delaware, USA
Key Offering: Specialty adhesives, underfills, encapsulants, and thermal management materials
DuPont maintains a strong position in the semiconductor packaging adhesives market with its advanced material science capabilities and broad product portfolio for diverse packaging requirements.
Innovation Focus:
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Advanced epoxy and silicone formulations
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Comprehensive material solutions for fan-out wafer-level packaging (FOWLP)
7️⃣ 4. Shin-Etsu Chemical Co., Ltd.
Headquarters: Tokyo, Japan
Key Offering: Silicone-based encapsulants, die attach films, thermal interface materials
Shin-Etsu Chemical leverages its leadership in silicone technology to provide high-performance adhesives for semiconductor packaging, targeting applications requiring exceptional thermal stability and reliability.
Innovation Focus:
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High-purity silicone materials for advanced packaging
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Custom formulations for specific customer requirements
6️⃣ 5. Sumitomo Bakelite Co., Ltd.
Headquarters: Tokyo, Japan
Key Offering: Epoxy molding compounds (EMCs), high-temperature adhesives, semiconductor encapsulants
Sumitomo Bakelite specializes in epoxy-based materials for semiconductor encapsulation and protection, with a focus on high-reliability applications in automotive and industrial electronics.
Innovation Focus:
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Low-stress molding compounds for large-die packages
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Thermally conductive materials for power semiconductor applications
Download FREE Sample Report: Semiconductor Packaging Adhesives Market – View in Detailed Research Report
5️⃣ 6. Momentive Performance Materials Inc.
Headquarters: Waterford, New York, USA
Key Offering: High-performance silicone adhesives, sealants, and encapsulants
Momentive provides advanced silicone-based materials that offer superior thermal stability, flexibility, and reliability for demanding semiconductor packaging applications across various end-use industries.
Innovation Focus:
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Silicone gel encapsulants for sensitive semiconductor devices
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Advanced thermal interface materials for high-power density applications
4️⃣ 7. DELO Industrie Klebstoffe GmbH & Co. KGaA
Headquarters: Windach, Germany
Key Offering: UV-curable adhesives, epoxy-based die attach materials, thermal interface adhesives
DELO specializes in high-performance, fast-curing adhesives for semiconductor packaging, including flip-chip underfill and die attach applications requiring high precision and reliability.
Innovation Focus:
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Development of anisotropic conductive adhesives (ACAs) for fine-pitch interconnects.
Innovation Focus:
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Light-curing adhesives for automated semiconductor assembly processes
3️⃣ 8. Nissan Chemical Corporation
Headquarters: Tokyo, Japan
Key Offering: Silica-filled epoxy adhesives, underfill materials, high-thermal conductivity die attach materialsNissan Chemical leverages its expertise in silica technology to provide enhanced epoxy adhesive formulations for semiconductor packaging applications.
Innovation Focus:
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Development of low-alpha particle-emitting materials for advanced memory packaging
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Nanocomposite adhesives with tailored thermal and mechanical properties
2️⃣ 9. Master Bond Inc.
Headquarters: Hackensack, New Jersey, USA
Key Offering: Specialty epoxy, silicone, and UV-curable adhesives for semiconductor packagingMaster Bond develops high-performance adhesive systems specifically engineered for semiconductor packaging applications, with a focus on high-reliability and performance under extreme conditions.
Innovation Focus:
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Custom formulations for specific semiconductor packaging requirements
1️⃣ 10. Lord Corporation
Headquarters: Cary, North Carolina, USA
Key Offering: High-temperature adhesives, thermally conductive die attach materials, and encapsulantsLord Corporation provides advanced adhesive solutions for semiconductor packaging, particularly for demanding applications in automotive, aerospace, and industrial sectors where reliability under harsh conditions is paramount.
Innovation Focus:
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Adhesives for power semiconductor modules and automotive electronics
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Advanced thermal management materials for high-power density semiconductor packages
Get Full Report Here: Semiconductor Packaging Adhesives Market – View in Detailed Research Report
🌍 Outlook: The Future of Semiconductor Packaging Adhesives Is Smarter and Higher-Performance
The semiconductor packaging adhesives market is undergoing a fundamental transformation as chip packaging technologies advance toward 3D integration and heterogeneous systems. While traditional epoxy and silicone formulations continue to dominate the market, the industry is increasingly focused on developing materials with enhanced thermal conductivity, reduced stress, and improved reliability for next-generation electronic devices.
📈 Key Trends Shaping the Market:
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Development of high-thermal-conductivity adhesives for power semiconductors
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Shift toward low-outgassing materials for advanced packaging applications
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Increasing demand for halogen-free and environmentally friendly adhesive formulations
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Advanced adhesive systems for wafer-level packaging and 3D IC integration
Get Full Report Here: Semiconductor Packaging Adhesives Market – View in Detailed Research Report
The companies listed above are not only enabling advanced semiconductor packaging—they’re pioneering the next generation of electronic devices through advanced material science and engineering.
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