The Global Dicing and Backgrinding Tapes Market was valued at USD 312.7 Million in 2023 and is projected to reach USD 482.4 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.3% during the forecast period (2024–2030). This growth is driven by increasing semiconductor production, advancements in wafer fabrication technologies, and rising demand for consumer electronics worldwide.

As the semiconductor industry continues its rapid expansion, the need for precision dicing and backgrinding tapes has never been higher. These specialized adhesive tapes play a critical role in protecting wafers during semiconductor manufacturing processes. In this blog, we profile the Top 10 Companies in the Dicing and Backgrinding Tapes Industry—a mix of established leaders and innovative specialists shaping the future of semiconductor manufacturing.

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🔟 1. Nitto Denko Corporation

Headquarters: Osaka, Japan
Key Offering: UV-curable dicing tapes, backgrinding tapes

Nitto Denko dominates the global dicing and backgrinding tapes market with its advanced adhesive technologies. The company offers a comprehensive range of tapes for various wafer types and thicknesses, with a strong focus on ultra-thin wafer processing.

Key Innovations:

• Development of low-stress dicing tapes for fragile materials
• Specialized solutions for wide-bandgap semiconductors
• 35% global market share in semiconductor adhesive tapes

Download FREE Sample Report:
Dicing and Backgrinding Tapes Market – View in Detailed Research Report

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9️⃣ 2. Lintec Corporation

Headquarters: Tokyo, Japan
Key Offering: ELEP HOLDER® series, backside protection tapes

Lintec is a leading innovator in semiconductor processing materials, with particular strength in backgrinding tapes for thin wafers. Their products enable precise control during backgrinding processes down to wafer thicknesses below 50μm.

Key Innovations:

• Thermal slide technology for clean tape removal
• Solutions for compound semiconductor processing
• Global production facilities supporting major foundries

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8️⃣ 3. Mitsui Chemicals Tohcello, Inc.

Headquarters: Tokyo, Japan
Key Offering: Adwill series dicing tapes

Mitsui Chemicals offers high-performance adhesive tapes specifically designed for advanced packaging technologies, including fan-out wafer-level packaging (FOWLP) and through-silicon via (TSV) applications.

Key Innovations:

• Low-outgassing formulations for cleanroom compatibility
• Products optimized for laser dicing processes
• Strong presence in the advanced packaging segment

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7️⃣ 4. Denka Company Limited

Headquarters: Tokyo, Japan
Key Offering: Denka Dicing Tape series

Denka specializes in high-performance dicing tapes for challenging semiconductor materials, including silicon carbide (SiC) and gallium nitride (GaN) wafers used in power electronics and 5G applications.

Key Innovations:

• High-tack formulations for difficult-to-process materials
• Solutions for hybrid bonding applications
• Strategic partnerships with power device manufacturers

Download FREE Sample Report:
Dicing and Backgrinding Tapes Market – View in Detailed Research Report

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6️⃣ 5. Showa Denko Materials Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: ELECTROTAC® dicing tapes

Showa Denko Materials provides comprehensive solutions for wafer processing with focus on memory and logic devices. Their tapes are known for exceptional dimensional stability during precision dicing operations.

Key Innovations:

• Conductive adhesive formulations
• Solutions for in-line processing systems
• Strong technical support for foundry customers

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5️⃣ 6. Sekisui Chemical Co., Ltd.

Headquarters: Osaka, Japan
Key Offering: SEKISUI dicing tapes

Sekisui Chemical has developed proprietary adhesive technologies that enable clean chip retrieval while minimizing residual adhesive. The company serves both traditional silicon and compound semiconductor markets.

Key Innovations:

• Low die-fly solutions for ultra-thin die
• Temporary bonding solutions
• Global logistics for just-in-time deliveries

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4️⃣ 7. AI Technology, Inc.

Headquarters: Princeton, New Jersey, USA
Key Offering: AIT Dicing & Backgrinding Tapes

AI Technology is a leading Western supplier of semiconductor processing tapes, offering customized solutions for specific customer requirements. Their products are particularly strong in MEMS and sensor applications.

Key Innovations:

• Quick-stick formulations for rapid throughput
• Cleanroom-compatible adhesive systems
• Strong technical support in North America

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3️⃣ 8. Sumitomo Bakelite Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Semiconductor process tapes

Sumitomo Bakelite combines polymer expertise with semiconductor process knowledge to develop high-performance tapes. The company has been expanding its focus on advanced packaging applications.

Key Innovations:

• Multi-layer tape constructions
• Low ionic contamination formulations
• Solutions for heterogenous integration

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2️⃣ 9. Minitron Elektronik GmbH

Headquarters: München, Germany
Key Offering: Semiconductor dicing films

Minitron specializes in European semiconductor manufacturing needs, providing high-quality dicing films with reliable batch-to-batch consistency. Their products are widely used in automotive semiconductor production.

Key Innovations:

• Automotive-grade material solutions
• Customized expansion characteristics
• Support for high-mix production environments

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1️⃣ 10. Chung Hao Material Technology Co., Ltd.

Headquarters: Hsinchu, Taiwan
Key Offering: CHM Dicing Tapes

Chung Hao Material is a fast-growing regional player serving the dense semiconductor manufacturing ecosystem in Taiwan. The company provides cost-competitive solutions with rapid turnaround times.

Key Innovations:

• Localized production supporting TSMC supply chain
• Quick customization services
• Strong presence in OSAT segment

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🔍 Outlook: The Future of Dicing and Backgrinding Tapes

The dicing and backgrinding tapes market is evolving alongside semiconductor manufacturing trends, with material innovations addressing the challenges of advanced packaging and new substrate materials.

📈 Key Trends Shaping the Market:

• Growing demand for ultra-thin wafer processing below 50μm
• Increasing requirements for wide-bandgap semiconductor materials
• Adoption of hybrid bonding in advanced packaging
• Expansion of 300mm wafer production capacity
• Growing importance of material cost in high-volume manufacturing

Read Full Report:
Dicing and Backgrinding Tapes Market – View in Detailed Research Report

The companies profiled above are not only supplying critical materials for semiconductor manufacturing—they’re enabling the next generation of electronic devices through materials innovation.