The Global Inkjet Printing Solder Market was valued at USD 118 Million in 2023 and is projected to reach USD 182.17 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 6.40% during the forecast period (2025–2030). This expansion is driven by accelerating demand for high-density PCB manufacturing, advancements in micro-deposition technologies, and the global transition toward miniaturized electronic components across industries.

As electronics evolve toward increasingly complex, compact designs, inkjet solder deposition has become indispensable for prototyping and low-volume production. This report highlights the Top 10 Companies in the Inkjet Printing Solder Market — pioneers who are redefining precision soldering for automotive systems, consumer electronics, and 5G infrastructure.

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🔟 1. Agfa-Gevaert Group

Headquarters: Mortsel, Belgium
Key Offering: Modular MCP Series Solder Jetting Solutions

A leader in imaging technologies, Agfa has engineered advanced PCB soldering systems that achieve sub-20μm precision. Their solutions are particularly valuable for HDI applications in aerospace and medical electronics.

Technical Superiority:

• Proprietary micro-valve jetting technology with 50μm nozzle resolution
• Closed-loop Z-axis compensation for warped substrates
• Integrated 3D inspection systems for quality assurance

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9️⃣ 2. Taiyo America, Inc.

Headquarters: Carson City, Nevada, USA
Key Offering: Nano-Particle Solder Pastes

Taiyo dominates the materials segment with patented alloy formulations optimized for jetting systems. Their pastes enable reliable interconnection for 01005 components and micro-BGA packages.

Material Science Leadership:

• 8-12μm particle size distribution with spherical morphology
• Ultra-low voiding formulations (<1% by volume)
• Halogen-free flux systems meeting IPC J-STD-004B

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8️⃣ 3. SUSS MicroTec SE

Headquarters: Garching, Germany
Key Offering: Hybrid Photolithography-Jetting Systems

SUSS integrates its semiconductor expertise with precision deposition, offering complete solutions for advanced 3D packaging and MEMS applications.

Technology Integration:

• Combines jetting with mask aligner precision (±2μm overlay)
• Solutions for wafer-level packaging and TSV filling
• Automated handling for 200mm/300mm wafers

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7️⃣ 4. Nordson ASYMTEK

Headquarters: Carlsbad, California, USA
Key Offering: Spectrum II Jetting Platforms

Nordson’s industrial dispensing systems deliver production-grade reliability for automotive electronics and power module manufacturing.

Production Advantages:

• 1500 dpi jetting resolution with 1μm repeatability
• Patented jetting waveform control technology
• SECS/GEM compatibility for Industry 4.0 integration

Download FREE Sample Report: Inkjet Printing Solder Market – View in Detailed Research Report

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6️⃣ 5. Henkel Electronics

Headquarters: Düsseldorf, Germany
Key Offering: Loctite GC 10 Series Jettable Alloys

Henkel’s materials science expertise yields solder pastes that balance jetting performance with end-use reliability in harsh environments.

Material Innovations:

• SnAgCu formulations with 20+ years field data
• Anti-oxidation additives reducing nozzle clogging
• Compatible with nitrogen and air environments

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5️⃣ 6. Indium Corporation

Headquarters: Clinton, New York, USA
Key Offering: Metal-Organic Decomposition Inks

Indium’s MOD technology enables direct writing of solder features without paste handling, ideal for high-mix production.

Process Breakthroughs:

• 150°C lower process temperatures than conventional pastes
• Creates dense, pore-free interconnects
• Compatible with flexible and rigid substrates

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4️⃣ 7. Senju Metal Industry

Headquarters: Tokyo, Japan
Key Offering: Low-Residue JetALL Series

Senju combines Japanese precision engineering with innovative flux chemistry for defect-free jetting applications.

Quality Features:

• 0.1% residue after reflow (IPC Class 3 compliant)
• Self-centering capability for fine-pitch components
• Specialty alloys for high-temperature applications

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3️⃣ 8. Nihon Superior

Headquarters: Osaka, Japan
Key Offering: SN100C Nickel-Modified Alloys

Nihon’s patented alloys address interconnect reliability challenges in next-generation packaging.

Alloy Advantages:

• 80% reduction in intermetallic compound growth
• Eliminates copper dissolution in high-current joints
• Compatible with all common surface finishes

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2️⃣ 9. Electra Polymers

Headquarters: Woking, UK
Key Offering: Solderinks Conductive Inks

Electra’s formulations bridge traditional soldering and printed electronics for hybrid applications.

Application Versatility:

• Jettable from 20μm to 150μm feature sizes
• Adheres to ceramics, polymers, and metals
• Sintering temperatures as low as 180°C

Get Full Report Here: Inkjet Printing Solder Market – View in Detailed Research Report

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1️⃣ 10. Dymax Corporation

Headquarters: Torrington, Connecticut, USA
Key Offering: UV-Curable Solder Inks

Dymax revolutionizes rapid prototyping with light-activated solders that cure in seconds under UV exposure.

Process Innovations:

• Instant curing without thermal profiles
• 50% faster than conventional processes
• Ideal for heat-sensitive components and substrates

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🚀 Outlook: The Next Wave of Jetting Technology

The inkjet solder market is transitioning from prototyping to volume production, driven by these key developments:

🔍 Market-Shaping Trends:

• Automotive electrification demanding precision interconnects for power electronics
• 5G infrastructure requiring high-frequency compatible materials
• AI-driven process optimization reducing material waste by 30-50%
• Multi-material jetting systems for integrated component placement

Get Full Report Here: Inkjet Printing Solder Market – View in Detailed Research Report

These market leaders are transforming electronics manufacturing through innovations that combine precision, flexibility, and material science breakthroughs.