The Global Liquid Epoxy Encapsulant Material Market was valued at USD 652 million in 2023 and is projected to reach USD 1,101.54 million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 6.00% during the forecast period (2023-2032). This growth is being driven by increasing demand for advanced electronics packaging, expansion of automotive electronics applications, and the accelerating adoption of miniaturized and high-performance electronic components across industrial sectors.
As the electronics industry evolves toward more compact, durable, and high-temperature resistant solutions, the spotlight is on key material suppliers who are driving innovation in protective encapsulation. In this blog, we profile the Top 10 Companies in the Liquid Epoxy Encapsulant Material Industry—technology leaders shaping the future of electronic protection and reliability.
🔟 1. Henkel AG & Co. KGaA
Headquarters: Düsseldorf, Germany
Key Offering: Loctite® encapsulants
Henkel is a global leader in adhesive technologies and electronic materials, offering high-performance liquid epoxy encapsulants for automotive, consumer electronics, and industrial applications. Their solutions provide superior moisture resistance, thermal stability, and mechanical protection.
Innovation Focus:
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Low-stress formulations for delicate components
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High thermal conductivity solutions
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Fast-curing systems for high-volume production
Download FREE Sample Report: https://www.24chemicalresearch.com/download-sample/284174/global-regional-liquid-epoxy-encapsulant-material-forecast-supply-dem-analysis-competitive-market-2025-2032-958
9️⃣ 2. Hitachi Chemical Company, Ltd.
Headquarters: Tokyo, Japan
Key Offering: Anisotropic conductive films and epoxy encapsulants
Hitachi Chemical (now Showa Denko Materials) provides advanced epoxy encapsulation materials for semiconductor packaging and power electronics, with particular strength in automotive-grade solutions.
Innovation Focus:
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