The Global High-Speed Transmission Build-Up Resin Market was valued at USD 71.30 Million in 2023 and is projected to reach USD 373.45 Million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 20.20% during the forecast period (2023–2032). This rapid expansion is fueled by escalating demand for high-frequency PCBs in 5G infrastructure, AI servers, and advanced consumer electronics requiring unparalleled signal integrity and thermal management.
As industries transition toward faster, more reliable data transmission, resin manufacturers are innovating to meet stringent performance requirements. Here, we analyze the Top 10 High-Speed Transmission Build-Up Resin Companies—material science innovators shaping the backbone of modern electronics.
🔟 1. Ajinomoto Co., Inc.
Headquarters: Tokyo, Japan
Key Offering: ABF-GX Series Build-Up Films
Ajinomoto dominates with its proprietary Ajinomoto Build-up Film (ABF) used in semiconductor packaging. Their resins enable ultra-fine circuitry (<2μm line width) with exceptional dielectric properties (Dk=3.3 @10GHz).
Technological Edge:
- Pioneer in low-loss resin for HDI PCBs
- Supplies 70% of global ABF market
- Collaborations with TSMC and Intel for advanced packaging
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9️⃣ 2. Sekisui Chemical Co., Ltd.
