The Global Underfills for Semiconductor Market was valued at USD 539.30 Million in 2023 and is projected to reach USD 973.27 Million by 2030, growing at a Compound Annual Growth Rate (CAGR) of 8.8% during the forecast period (2023–2030). This expansion is driven by the proliferation of advanced packaging technologies, rising semiconductor content in automotive/industrial applications, and increasing miniaturization demands across electronics.

Underfill materials serve as the critical interface between semiconductors and substrates, providing mechanical reinforcement, thermal management, and environmental protection. As package architectures become more complex, the strategic importance of underfill solutions continues to grow. This analysis profiles the Top 10 Companies in the Underfills for Semiconductor Industry—material science specialists delivering innovative solutions for 2.5D/3D ICs, fan-out packaging, and other advanced assembly approaches.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Loctite Underfill Solutions

Henkel maintains market leadership through its Loctite-branded underfill product lines, which set industry standards for reliability in flip-chip, wafer-level, and 3D packaging applications. The company invests heavily in R&D to address emerging challenges in heterogenous integration and high-power density packaging.

Technology Leadership:

• Ultra-low alpha emission formulations for sensitive applications

• Thermally conductive grades (2-5 W/mK) for power devices

• Fast-flow chemistries enabling ≤30 sec dispensing times

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9️⃣ 2. NAMICS Corporation

Headquarters: Niigata, Japan
Key Offering: High-Reliability Underfill Materials

NAMICS specializes in engineered underfill solutions for automotive and industrial electronics, where extreme reliability is paramount. The company’s materials demonstrate outstanding performance in thermal cycling (-40°C to 150°C) and mechanical shock resistance tests.

Technology Leadership:

• Halogen-free formulations meeting automotive OEM requirements

• Low warpage materials for large die (≥20mm) applications

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8️⃣ 3. Panasonic Corporation

Headquarters: Osaka, Japan
Key Offering: Semiconductor-grade Underfills

Panasonic’s underfill portfolio addresses the full spectrum of packaging architectures from traditional flip-chip to emerging chiplet-based designs. The company works closely with major foundries and OSATs to qualify materials for next-generation nodes.

Technology Leadership:

• Low-outgassing formulations for MEMS/VCSEL packaging

• Ultra-fine filler technology (≤1μm particle size)

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7️⃣ 4. Shin-Etsu Chemical Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Ultra-High Purity Underfills

Shin-Etsu leverages its leadership silicone technology to produce underfill materials with exceptionally low ionic contamination (<5ppm). These characteristics make their solutions ideal for automotive and aerospace applications requiring long-term reliability.

Technology Leadership:

• Wide temperature formulations (-55°C to 200°C)

• Low moisture absorption (<0.1%) chemistries

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Underfills for Semiconductor Market – View in Detailed Research Report

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6️⃣ 5. Master Bond Inc.

Headquarters: Hackensack, New Jersey, USA
Key Offering: Specialty Polymer Underfills

Master Bond develops high-performance underfill systems for defense, aerospace, and medical electronics applications where conventional materials may not meet stringent reliability requirements. Their products are qualified to NASA, MIL-SPEC, and other critical standards.

Technology Leadership:

• Radiation-resistant formulations for space applications

• Electrically conductive grades (volume resistivity <0.01 ohm-cm)

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5️⃣ 6. LORD Corporation

Headquarters: Cary, North Carolina, USA
Key Offering: Silicone Underfill Systems

LORD Corporation’s silicone-based underfills provide superior stress relief in mechanically demanding environments such as automotive under-the-hood applications. Their materials maintain flexibility across extreme temperature ranges while preventing delamination.

Technology Leadership:

• Shock/vibration resistant formulations

• Wide applicability from SiC power modules to MEMS sensors

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4️⃣ 7. Showa Denko Materials Co., Ltd.

Headquarters: Tokyo, Japan
Key Offering: Advanced Packaging Underfills

Showa Denko develops underfill solutions optimized for fan-out wafer-level packaging (FOWLP) and panel-level processing. Their materials support industry transitions to larger format packaging approaches while mitigating warpage and stress issues.

Technology Leadership:

• Ultra-thin (<15μm) underfill films

• Low-temperature cure chemistries (≤120°C)

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3️⃣ 8. Won Chemical Co., Ltd.

Headquarters: Gyeonggi-do, South Korea
Key Offering: Cost-effective Underfill Solutions

Won Chemical provides competitively priced underfill materials to high-volume semiconductor manufacturers throughout Asia. The company focuses on formulations that optimize production throughput without compromising reliability.

Technology Leadership:

• Rapid-cure systems (<3 minutes at 150°C)

• Copper pillar compatible chemistries

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2️⃣ 9. Sunstar Engineering Inc.

Headquarters: Osaka, Japan
Key Offering: Stress-Engineered Underfills

Sunstar specializes in underfill materials that precisely manage thermo-mechanical stresses in advanced packages. Their tunable modulus formulations help prevent interconnect fatigue while accommodating CTE mismatches.

Technology Leadership:

• Modulus range from 2 GPa to 8 GPa at 25°C

• Moisture-resistant formulations for humid environments

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1️⃣ 10. Fuji Chemical Co., Ltd.

Headquarters: Osaka, Japan
Key Offering: Thermally Enhanced Underfills

Fuji Chemical develops underfill materials with exceptional thermal conductivity (3-6 W/mK) for high-power applications including processors, power semiconductors, and RF devices. Their patented filler alignment technology maximizes heat transfer efficiency.

Technology Leadership:

• Anisotropic thermal conduction paths

• Low thermal resistance (<0.5°C-cm²/W)

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Underfills for Semiconductor Market – View in Detailed Research Report

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🌍 Market Outlook: Underfill Innovations Driving Packaging Evolution

The underfill market is undergoing significant transformation as material requirements become more demanding across multiple dimensions:

📈 Key Development Directions:

• Formulations enabling ≤10μm gap filling for ultra-fine pitch interconnects

• Bio-based resin systems addressing sustainability concerns

• Multi-functional materials combining underfill with temporary bonding or dielectric properties

• Machine learning-optimized dispensing processes for advanced packages

The profiled companies represent the vanguard of underfill innovation, developing material solutions that will enable next-generation semiconductor packaging architectures.

Get Full Report Here:
Underfills for Semiconductor Market – View in Detailed Research Report