The Global Chip On Film Underfill (COF) Market was valued at $352 million in 2024 and is projected to reach $447 million by 2031, growing at a Compound Annual Growth Rate (CAGR) of 3.6% during the forecast period (2024-2031). This growth is driven by increasing demand for compact electronic devices, rising adoption of LCD displays, and technological advancements in semiconductor packaging materials.

As electronic devices continue to shrink in size while increasing performance requirements, the need for reliable stress management between chips and substrates becomes critical. In this blog, we examine the key material suppliers and technologies shaping the COF underfill market across consumer electronics, automotive, and industrial applications.

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🔟 1. Henkel AG & Co. KGaA

Headquarters: Düsseldorf, Germany
Key Offering: Capillary Underfill (CUF), No-Flow Underfill (NUF)

Henkel leads the global underfill market with comprehensive solutions for COF applications. Their materials are extensively used in smartphones, tablets, wearables, and automotive electronics worldwide.

Key Advantages:

• Industry-leading thermal stress management
• Proprietary filler technology for enhanced reliability
• Global technical support network

Download FREE Sample Report: Chip On Film Underfill (COF) Market – View in Detailed Research Report

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9️⃣ 2. Won Chemical

Headquarters: Seoul, South Korea
Key Offering: Non-Conductive Paste (NCP) Underfill

Won Chemical specializes in environmentally friendly underfill formulations with excellent flow properties for high-density interconnects in consumer electronics.

Key Advantages:

• Ultra-low viscosity for fine pitch applications
• Halogen-free and RoHS compliant formulations
• Fast curing systems for high-volume production

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8️⃣ 3. LORD Corporation

Headquarters: Cary, North Carolina, USA
Key Offering: Non-Conductive Film (NCF) Underfill

LORD Corporation provides high-reliability underfill materials engineered for harsh environment applications including automotive and aerospace electronics.

Key Advantages:

• Exceptional thermal cycling performance
• Moisture resistance up to 85°C/85% RH
• Custom formulations for specialized applications

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7️⃣ 4. Namics Corporation

Headquarters: Tokyo, Japan
Key Offering: Molded Underfill (MUF) Solutions

Namics Corporation offers advanced molded underfill technologies that combine encapsulation and underfill functions for enhanced protection.

Key Advantages:

• Single-step process reduces manufacturing costs
• Superior protection against mechanical shocks
• Compatible with high-volume transfer molding

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6️⃣ 5. Fuji Chemical

Headquarters: Osaka, Japan
Key Offering: Capillary Underfill (CUF) Materials

Fuji Chemical provides high-performance underfill materials optimized for leading-edge semiconductor packaging technologies.

Key Advantages:

• Excellent void-free filling capability
• CTE-matched formulations reduce stress
• High thermal conductivity options available

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5️⃣ 6. Panacol

Headquarters: Steinbach, Germany
Key Offering: UV-Curable Underfill Materials

Panacol specializes in rapid-cure underfill solutions that enable fast throughput in high-volume electronics manufacturing.

Key Advantages:

• Cure times under 60 seconds with UV exposure
• Low outgassing formulations
• Precise dispensing characteristics

Download FREE Sample Report: Chip On Film Underfill (COF) Market – View in Detailed Research Report

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4️⃣ 7. Darbond Technology

Headquarters: Shenzhen, China
Key Offering: Epoxy-Based Underfill Materials

Darbond Technology provides cost-effective underfill solutions with robust mechanical properties for consumer electronics applications.

Key Advantages:

• High bond strength to various substrates
• Thermal stability up to 150°C
• Cost-optimized formulations

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3️⃣ 8. AI Technology

Headquarters: Princeton, New Jersey, USA
Key Offering: High-Temperature Underfill Materials

AI Technology specializes in underfill solutions for extreme environment applications including automotive and industrial electronics.

Key Advantages:

• Stable performance up to 200°C
• Excellent chemical resistance
• Long-term reliability in harsh conditions

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2️⃣ 9. Master Bond

Headquarters: Hackensack, New Jersey, USA
Key Offering: Specialty Epoxy Underfill Materials

Master Bond offers customized epoxy underfill solutions for demanding applications requiring exceptional mechanical and thermal properties.

Key Advantages:

• High thermal conductivity options
• Flexible modulus formulations
• Customized rheology available

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1️⃣ 10. Zymet

Headquarters: East Hanover, New Jersey, USA
Key Offering: Biocompatible Underfill Materials

Zymet provides specialty underfill materials meeting stringent medical and aerospace requirements for sensitive electronic assemblies.

Key Advantages:

• FDA-compliant formulations
• Low outgassing for vacuum applications
• Radiation-resistant options

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🌍 Market Outlook: The Future of COF Underfill Technology

The COF underfill market continues to evolve with emerging technologies and applications. Advanced packaging architectures are driving demand for more sophisticated underfill solutions with enhanced performance characteristics.

📈 Key Trends Shaping the Market:

• Development of ultra-low viscosity materials for fine pitch interconnects
• Increased adoption in automotive electronics for reliability enhancement
• Trend toward halogen-free and sustainable material formulations
• Integration of underfill functions into advanced packaging processes

These developments present significant opportunities for material suppliers to innovate and capture growth in this expanding market segment.

Read Full Report: Chip On Film Underfill (COF) Market – View in Detailed Research Report

The companies profiled above represent the technological leaders driving innovation in COF underfill materials – enabling the continued miniaturization and performance enhancement of electronic devices worldwide.